JPH037881B2 - - Google Patents
Info
- Publication number
- JPH037881B2 JPH037881B2 JP24385183A JP24385183A JPH037881B2 JP H037881 B2 JPH037881 B2 JP H037881B2 JP 24385183 A JP24385183 A JP 24385183A JP 24385183 A JP24385183 A JP 24385183A JP H037881 B2 JPH037881 B2 JP H037881B2
- Authority
- JP
- Japan
- Prior art keywords
- image signal
- pattern image
- wiring pattern
- wiring
- fluorescent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 45
- 230000007547 defect Effects 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 16
- 238000001917 fluorescence detection Methods 0.000 claims description 14
- 230000000873 masking effect Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000002073 fluorescence micrograph Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 230000005284 excitation Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24385183A JPS60135807A (ja) | 1983-12-26 | 1983-12-26 | 基板上の配線パタ−ン検出方法及びその装置 |
| US06/686,007 US4692690A (en) | 1983-12-26 | 1984-12-24 | Pattern detecting apparatus |
| KR1019840008343A KR890004956B1 (ko) | 1983-12-26 | 1984-12-26 | 페턴 검출장치 |
| EP84116393A EP0149849B1 (en) | 1983-12-26 | 1984-12-27 | Pattern detecting apparatus |
| DE8484116393T DE3477693D1 (en) | 1983-12-26 | 1984-12-27 | Pattern detecting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24385183A JPS60135807A (ja) | 1983-12-26 | 1983-12-26 | 基板上の配線パタ−ン検出方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60135807A JPS60135807A (ja) | 1985-07-19 |
| JPH037881B2 true JPH037881B2 (enrdf_load_stackoverflow) | 1991-02-04 |
Family
ID=17109894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24385183A Granted JPS60135807A (ja) | 1983-12-26 | 1983-12-26 | 基板上の配線パタ−ン検出方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60135807A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0660878B2 (ja) * | 1987-06-25 | 1994-08-10 | 株式会社日立製作所 | 多層プリント基板におけるスルーホールボイド検査方法とその装置 |
| JPH01292238A (ja) * | 1988-05-19 | 1989-11-24 | Toshiba Corp | 表面検査装置 |
| US6791099B2 (en) * | 2001-02-14 | 2004-09-14 | Applied Materials, Inc. | Laser scanning wafer inspection using nonlinear optical phenomena |
| US7355692B2 (en) * | 2004-03-05 | 2008-04-08 | Orbotech Ltd | System and method for inspecting electrical circuits utilizing reflective and fluorescent imagery |
| CN112387604B (zh) * | 2021-01-04 | 2021-04-20 | 深圳和美精艺半导体科技股份有限公司 | 一种avi检测机与自动找点机联网检测封装基板的方法 |
-
1983
- 1983-12-26 JP JP24385183A patent/JPS60135807A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60135807A (ja) | 1985-07-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |