JPS59229836A - ペレツトピツクアツプ方法 - Google Patents

ペレツトピツクアツプ方法

Info

Publication number
JPS59229836A
JPS59229836A JP9755583A JP9755583A JPS59229836A JP S59229836 A JPS59229836 A JP S59229836A JP 9755583 A JP9755583 A JP 9755583A JP 9755583 A JP9755583 A JP 9755583A JP S59229836 A JPS59229836 A JP S59229836A
Authority
JP
Japan
Prior art keywords
pellet
sleeve
wafer sheet
needle
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9755583A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242379B2 (enExample
Inventor
Masahiro Muraoka
村岡　正裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP9755583A priority Critical patent/JPS59229836A/ja
Publication of JPS59229836A publication Critical patent/JPS59229836A/ja
Publication of JPS6242379B2 publication Critical patent/JPS6242379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP9755583A 1983-05-30 1983-05-30 ペレツトピツクアツプ方法 Granted JPS59229836A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9755583A JPS59229836A (ja) 1983-05-30 1983-05-30 ペレツトピツクアツプ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9755583A JPS59229836A (ja) 1983-05-30 1983-05-30 ペレツトピツクアツプ方法

Publications (2)

Publication Number Publication Date
JPS59229836A true JPS59229836A (ja) 1984-12-24
JPS6242379B2 JPS6242379B2 (enExample) 1987-09-08

Family

ID=14195483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9755583A Granted JPS59229836A (ja) 1983-05-30 1983-05-30 ペレツトピツクアツプ方法

Country Status (1)

Country Link
JP (1) JPS59229836A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100346482B1 (ko) * 1994-12-03 2002-11-23 앰코 테크놀로지 코리아 주식회사 다이본딩의이젝팅장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4980971A (enExample) * 1972-12-08 1974-08-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4980971A (enExample) * 1972-12-08 1974-08-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100346482B1 (ko) * 1994-12-03 2002-11-23 앰코 테크놀로지 코리아 주식회사 다이본딩의이젝팅장치

Also Published As

Publication number Publication date
JPS6242379B2 (enExample) 1987-09-08

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