JPS59225896A - レ−ザ加工方法 - Google Patents

レ−ザ加工方法

Info

Publication number
JPS59225896A
JPS59225896A JP58100676A JP10067683A JPS59225896A JP S59225896 A JPS59225896 A JP S59225896A JP 58100676 A JP58100676 A JP 58100676A JP 10067683 A JP10067683 A JP 10067683A JP S59225896 A JPS59225896 A JP S59225896A
Authority
JP
Japan
Prior art keywords
groove
laser
freon
laser beam
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58100676A
Other languages
English (en)
Japanese (ja)
Other versions
JPH034319B2 (enExample
Inventor
Shunpei Yamazaki
舜平 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP58100676A priority Critical patent/JPS59225896A/ja
Publication of JPS59225896A publication Critical patent/JPS59225896A/ja
Publication of JPH034319B2 publication Critical patent/JPH034319B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
JP58100676A 1983-06-06 1983-06-06 レ−ザ加工方法 Granted JPS59225896A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58100676A JPS59225896A (ja) 1983-06-06 1983-06-06 レ−ザ加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58100676A JPS59225896A (ja) 1983-06-06 1983-06-06 レ−ザ加工方法

Publications (2)

Publication Number Publication Date
JPS59225896A true JPS59225896A (ja) 1984-12-18
JPH034319B2 JPH034319B2 (enExample) 1991-01-22

Family

ID=14280354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58100676A Granted JPS59225896A (ja) 1983-06-06 1983-06-06 レ−ザ加工方法

Country Status (1)

Country Link
JP (1) JPS59225896A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106689A (ja) * 1983-11-16 1985-06-12 Hitachi Ltd レ−ザ加工装置
WO2004015753A1 (en) * 2002-08-06 2004-02-19 Xsil Technology Limited Laser machinining
JP2004247426A (ja) * 2003-02-12 2004-09-02 Inst Of Research & Innovation レーザダイシング装置
US6835319B2 (en) * 2001-10-25 2004-12-28 Data Storage Institute Method of patterning a substrate
CN100359645C (zh) * 2002-08-06 2008-01-02 Xsil技术有限公司 激光加工
JP2009542022A (ja) * 2006-07-03 2009-11-26 フラウンホッファー−ゲゼルシャフト・ツァー・フォデラング・デル・アンゲワンテン・フォーシュング・エー.ファウ. 固形物から物質を除去するための液体ジェットガイド式エッチング法およびその使用

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106689A (ja) * 1983-11-16 1985-06-12 Hitachi Ltd レ−ザ加工装置
US6835319B2 (en) * 2001-10-25 2004-12-28 Data Storage Institute Method of patterning a substrate
WO2004015753A1 (en) * 2002-08-06 2004-02-19 Xsil Technology Limited Laser machinining
CN100359645C (zh) * 2002-08-06 2008-01-02 Xsil技术有限公司 激光加工
JP2004247426A (ja) * 2003-02-12 2004-09-02 Inst Of Research & Innovation レーザダイシング装置
JP2009542022A (ja) * 2006-07-03 2009-11-26 フラウンホッファー−ゲゼルシャフト・ツァー・フォデラング・デル・アンゲワンテン・フォーシュング・エー.ファウ. 固形物から物質を除去するための液体ジェットガイド式エッチング法およびその使用

Also Published As

Publication number Publication date
JPH034319B2 (enExample) 1991-01-22

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