JPS59225883A - 自動半田付け装置におけるキヤリアの昇降装置 - Google Patents

自動半田付け装置におけるキヤリアの昇降装置

Info

Publication number
JPS59225883A
JPS59225883A JP9992083A JP9992083A JPS59225883A JP S59225883 A JPS59225883 A JP S59225883A JP 9992083 A JP9992083 A JP 9992083A JP 9992083 A JP9992083 A JP 9992083A JP S59225883 A JPS59225883 A JP S59225883A
Authority
JP
Japan
Prior art keywords
carrier
sprocket
driven sprocket
drive
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9992083A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0238310B2 (enrdf_load_stackoverflow
Inventor
Hachiji Yokota
八治 横田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOTA KIKAI KK
Original Assignee
YOKOTA KIKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOTA KIKAI KK filed Critical YOKOTA KIKAI KK
Priority to JP9992083A priority Critical patent/JPS59225883A/ja
Publication of JPS59225883A publication Critical patent/JPS59225883A/ja
Publication of JPH0238310B2 publication Critical patent/JPH0238310B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0669Solder baths with dipping means
    • B23K3/0676Conveyors therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chain Conveyers (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9992083A 1983-06-05 1983-06-05 自動半田付け装置におけるキヤリアの昇降装置 Granted JPS59225883A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9992083A JPS59225883A (ja) 1983-06-05 1983-06-05 自動半田付け装置におけるキヤリアの昇降装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9992083A JPS59225883A (ja) 1983-06-05 1983-06-05 自動半田付け装置におけるキヤリアの昇降装置

Publications (2)

Publication Number Publication Date
JPS59225883A true JPS59225883A (ja) 1984-12-18
JPH0238310B2 JPH0238310B2 (enrdf_load_stackoverflow) 1990-08-29

Family

ID=14260205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9992083A Granted JPS59225883A (ja) 1983-06-05 1983-06-05 自動半田付け装置におけるキヤリアの昇降装置

Country Status (1)

Country Link
JP (1) JPS59225883A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067140A (ja) * 2005-08-31 2007-03-15 Nihon Dennetsu Keiki Co Ltd 雰囲気処理装置
CN103008818A (zh) * 2012-12-25 2013-04-03 镇江市松协电器有限公司 一种自动焊接装置
JP2014234289A (ja) * 2013-06-04 2014-12-15 株式会社前川製作所 ベルトコンベア板およびベルトコンベア機構

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187279A (ja) * 1975-01-25 1976-07-30 Nitto Seiko Kk Isosochi
JPS5456169A (en) * 1977-10-13 1979-05-04 Kondo Kenji Method of soldering print substrate
JPS55148861U (enrdf_load_stackoverflow) * 1979-04-09 1980-10-27

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187279A (ja) * 1975-01-25 1976-07-30 Nitto Seiko Kk Isosochi
JPS5456169A (en) * 1977-10-13 1979-05-04 Kondo Kenji Method of soldering print substrate
JPS55148861U (enrdf_load_stackoverflow) * 1979-04-09 1980-10-27

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067140A (ja) * 2005-08-31 2007-03-15 Nihon Dennetsu Keiki Co Ltd 雰囲気処理装置
CN103008818A (zh) * 2012-12-25 2013-04-03 镇江市松协电器有限公司 一种自动焊接装置
JP2014234289A (ja) * 2013-06-04 2014-12-15 株式会社前川製作所 ベルトコンベア板およびベルトコンベア機構

Also Published As

Publication number Publication date
JPH0238310B2 (enrdf_load_stackoverflow) 1990-08-29

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