JPS59222731A - 赤外線検出器 - Google Patents

赤外線検出器

Info

Publication number
JPS59222731A
JPS59222731A JP58098333A JP9833383A JPS59222731A JP S59222731 A JPS59222731 A JP S59222731A JP 58098333 A JP58098333 A JP 58098333A JP 9833383 A JP9833383 A JP 9833383A JP S59222731 A JPS59222731 A JP S59222731A
Authority
JP
Japan
Prior art keywords
infrared
elements
infrared detector
adjacent elements
detecting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58098333A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0229180B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Kunio Nakamura
中村　邦雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58098333A priority Critical patent/JPS59222731A/ja
Publication of JPS59222731A publication Critical patent/JPS59222731A/ja
Publication of JPH0229180B2 publication Critical patent/JPH0229180B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass H10F
    • H01L25/042—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass H10F the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Burglar Alarm Systems (AREA)
JP58098333A 1983-06-02 1983-06-02 赤外線検出器 Granted JPS59222731A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58098333A JPS59222731A (ja) 1983-06-02 1983-06-02 赤外線検出器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58098333A JPS59222731A (ja) 1983-06-02 1983-06-02 赤外線検出器

Publications (2)

Publication Number Publication Date
JPS59222731A true JPS59222731A (ja) 1984-12-14
JPH0229180B2 JPH0229180B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-06-28

Family

ID=14216973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58098333A Granted JPS59222731A (ja) 1983-06-02 1983-06-02 赤外線検出器

Country Status (1)

Country Link
JP (1) JPS59222731A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06258137A (ja) * 1993-03-04 1994-09-16 Matsushita Electric Ind Co Ltd 焦電型赤外線センサ
US5418198A (en) * 1993-08-23 1995-05-23 Magneco/Metrel, Inc. Pelletizable gunning composition
US5554847A (en) * 1994-10-11 1996-09-10 Hughes Aircraft Company Flexibly connectable high precision thermal and structural focal plane array mount
WO1998003011A1 (en) * 1996-07-11 1998-01-22 Simage Oy Imaging apparatus having a large sensing area
WO2000045440A1 (fr) 1999-01-28 2000-08-03 Shimadzu Corporation Dispositif d'imagerie et camera cinematographique pourvue du dispositif d'imagerie
WO2012029974A1 (ja) * 2010-09-03 2012-03-08 日本電気株式会社 赤外線検知センサおよび電子機器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168995A (en) * 1991-06-24 1992-12-08 Tektronix, Inc. Pinch clip lid for non-hermetic packages

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06258137A (ja) * 1993-03-04 1994-09-16 Matsushita Electric Ind Co Ltd 焦電型赤外線センサ
US5418198A (en) * 1993-08-23 1995-05-23 Magneco/Metrel, Inc. Pelletizable gunning composition
US5554847A (en) * 1994-10-11 1996-09-10 Hughes Aircraft Company Flexibly connectable high precision thermal and structural focal plane array mount
WO1998003011A1 (en) * 1996-07-11 1998-01-22 Simage Oy Imaging apparatus having a large sensing area
EP1162833A1 (en) * 1996-07-11 2001-12-12 Simage Oy Image apparatus having a large sensing area
US6408110B2 (en) * 1996-07-11 2002-06-18 Simage Oy Tiled imaging apparatus providing substantially continuous imaging
WO2000045440A1 (fr) 1999-01-28 2000-08-03 Shimadzu Corporation Dispositif d'imagerie et camera cinematographique pourvue du dispositif d'imagerie
EP1094522A4 (en) * 1999-01-28 2008-01-02 Takeharu Etoh PICTURE RECORDING DEVICE AND PICTURE CAMERA WITH IMAGE RECORDING DEVICE
WO2012029974A1 (ja) * 2010-09-03 2012-03-08 日本電気株式会社 赤外線検知センサおよび電子機器

Also Published As

Publication number Publication date
JPH0229180B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-06-28

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