JPS59220932A - 半導体素子用モ−ルド樹脂の予熱装置 - Google Patents

半導体素子用モ−ルド樹脂の予熱装置

Info

Publication number
JPS59220932A
JPS59220932A JP9602683A JP9602683A JPS59220932A JP S59220932 A JPS59220932 A JP S59220932A JP 9602683 A JP9602683 A JP 9602683A JP 9602683 A JP9602683 A JP 9602683A JP S59220932 A JPS59220932 A JP S59220932A
Authority
JP
Japan
Prior art keywords
waveguide
resin
tablet
preheating
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9602683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6355861B2 (enrdf_load_stackoverflow
Inventor
Yasumasa Noda
野田　康昌
Yoichi Suzuki
洋一 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP9602683A priority Critical patent/JPS59220932A/ja
Priority to DE19843420280 priority patent/DE3420280A1/de
Priority to GB08413715A priority patent/GB2141909B/en
Priority to US06/615,463 priority patent/US4577078A/en
Publication of JPS59220932A publication Critical patent/JPS59220932A/ja
Publication of JPS6355861B2 publication Critical patent/JPS6355861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP9602683A 1983-05-31 1983-05-31 半導体素子用モ−ルド樹脂の予熱装置 Granted JPS59220932A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP9602683A JPS59220932A (ja) 1983-05-31 1983-05-31 半導体素子用モ−ルド樹脂の予熱装置
DE19843420280 DE3420280A1 (de) 1983-05-31 1984-05-30 Vorrichtung zum vorwaermen von pressharz fuer eine halbleitervorrichtung
GB08413715A GB2141909B (en) 1983-05-31 1984-05-30 Apparatus for preheating mold resin for a semiconductor device
US06/615,463 US4577078A (en) 1983-05-31 1984-05-30 Apparatus for preheating mold resin for a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9602683A JPS59220932A (ja) 1983-05-31 1983-05-31 半導体素子用モ−ルド樹脂の予熱装置

Publications (2)

Publication Number Publication Date
JPS59220932A true JPS59220932A (ja) 1984-12-12
JPS6355861B2 JPS6355861B2 (enrdf_load_stackoverflow) 1988-11-04

Family

ID=14153841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9602683A Granted JPS59220932A (ja) 1983-05-31 1983-05-31 半導体素子用モ−ルド樹脂の予熱装置

Country Status (1)

Country Link
JP (1) JPS59220932A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991008883A1 (en) * 1989-12-12 1991-06-27 Kabushiki Kaisha Kobe Seiko Sho Method of molding fiber-reinforced composite material and premolded body of said material
JP2009538760A (ja) * 2006-05-31 2009-11-12 ダウ グローバル テクノロジーズ インコーポレイティド 熱可塑性ポリマー系を選択的に加熱するためのマイクロ波エネルギーの使用
JP2019202533A (ja) * 2018-05-21 2019-11-28 マイクロ波化学株式会社 成形装置、金型および成形品製造方法
JP2020192817A (ja) * 2018-05-21 2020-12-03 マイクロ波化学株式会社 成形装置、金型および成形品製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991008883A1 (en) * 1989-12-12 1991-06-27 Kabushiki Kaisha Kobe Seiko Sho Method of molding fiber-reinforced composite material and premolded body of said material
US5283026A (en) * 1989-12-12 1994-02-01 Kabushiki Kaisha Kobe Seiko Sho Method for molding fiber-reinforced composite material
JP2009538760A (ja) * 2006-05-31 2009-11-12 ダウ グローバル テクノロジーズ インコーポレイティド 熱可塑性ポリマー系を選択的に加熱するためのマイクロ波エネルギーの使用
JP2019202533A (ja) * 2018-05-21 2019-11-28 マイクロ波化学株式会社 成形装置、金型および成形品製造方法
JP2020192817A (ja) * 2018-05-21 2020-12-03 マイクロ波化学株式会社 成形装置、金型および成形品製造方法

Also Published As

Publication number Publication date
JPS6355861B2 (enrdf_load_stackoverflow) 1988-11-04

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