JPS59219999A - 電磁波シ−ルドケ−スの製造方法 - Google Patents
電磁波シ−ルドケ−スの製造方法Info
- Publication number
- JPS59219999A JPS59219999A JP9546683A JP9546683A JPS59219999A JP S59219999 A JPS59219999 A JP S59219999A JP 9546683 A JP9546683 A JP 9546683A JP 9546683 A JP9546683 A JP 9546683A JP S59219999 A JPS59219999 A JP S59219999A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic shielding
- shielding case
- manufacturing
- electromagnetic wave
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 17
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 229920003002 synthetic resin Polymers 0.000 claims description 13
- 239000000057 synthetic resin Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000010899 nucleation Methods 0.000 claims 1
- 239000011231 conductive filler Substances 0.000 description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 241000257465 Echinoidea Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9546683A JPS59219999A (ja) | 1983-05-30 | 1983-05-30 | 電磁波シ−ルドケ−スの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9546683A JPS59219999A (ja) | 1983-05-30 | 1983-05-30 | 電磁波シ−ルドケ−スの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59219999A true JPS59219999A (ja) | 1984-12-11 |
JPH0315358B2 JPH0315358B2 (enrdf_load_stackoverflow) | 1991-02-28 |
Family
ID=14138430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9546683A Granted JPS59219999A (ja) | 1983-05-30 | 1983-05-30 | 電磁波シ−ルドケ−スの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59219999A (enrdf_load_stackoverflow) |
-
1983
- 1983-05-30 JP JP9546683A patent/JPS59219999A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0315358B2 (enrdf_load_stackoverflow) | 1991-02-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2713059B2 (ja) | 電子部品または電子機器を収納する箱または蓋からなる筺体の製造方法。 | |
EP0180383A2 (en) | A manufacturing method for housings with a two-layer structure | |
US20050028999A1 (en) | EMI shielding enclosure for portable electronic device and method for making same | |
US4585686A (en) | Two-layer structure molded by using thermoplastic resin | |
JPS59219999A (ja) | 電磁波シ−ルドケ−スの製造方法 | |
JPS612519A (ja) | 射出成形法 | |
JPS58192398A (ja) | 電磁シ−ルド成形品 | |
JPH0557758B2 (enrdf_load_stackoverflow) | ||
JPS59128704A (ja) | 導電性フイラ−含有成形材料の製造方法 | |
JPH0112648B2 (enrdf_load_stackoverflow) | ||
JPH0142392Y2 (enrdf_load_stackoverflow) | ||
JPH03183516A (ja) | 導電層付き成形体の製造方法 | |
US20040262021A1 (en) | Electromagnetic interference shield and method of manufacturing same | |
JPS60131715A (ja) | 電磁シ−ルド用成形品の製造方法 | |
JPS59124824A (ja) | 電磁波遮蔽性合成樹脂射出成形品の製造方法 | |
JPS59211300A (ja) | 電磁波シールド部品の製造法 | |
JPH0136773B2 (enrdf_load_stackoverflow) | ||
JPH07237243A (ja) | 電波シールドハウジング | |
JPH04135816A (ja) | シールド層付き樹脂成形体の製造方法 | |
JPH09148712A (ja) | 立体成形回路体の製法およびそれによって得られた立体成形回路体 | |
CN100373405C (zh) | 一种网卡封装结构装置及其封装方法 | |
JPS60217121A (ja) | 電磁波シ−ルド性プラスチツクハウジングの製造方法 | |
JP2882549B2 (ja) | 接点の製造方法 | |
JPS60240198A (ja) | 電磁波遮蔽性を有するプラスチツクハウジング及びその製造方法 | |
JPS60105106A (ja) | 射出成形用の導電性成形材料 |