JPS59219999A - Method of producing electromagnetic wave shielding case - Google Patents

Method of producing electromagnetic wave shielding case

Info

Publication number
JPS59219999A
JPS59219999A JP9546683A JP9546683A JPS59219999A JP S59219999 A JPS59219999 A JP S59219999A JP 9546683 A JP9546683 A JP 9546683A JP 9546683 A JP9546683 A JP 9546683A JP S59219999 A JPS59219999 A JP S59219999A
Authority
JP
Japan
Prior art keywords
electromagnetic shielding
shielding case
manufacturing
electromagnetic wave
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9546683A
Other languages
Japanese (ja)
Other versions
JPH0315358B2 (en
Inventor
岩瀬 英裕
小椋 慶喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP9546683A priority Critical patent/JPS59219999A/en
Publication of JPS59219999A publication Critical patent/JPS59219999A/en
Publication of JPH0315358B2 publication Critical patent/JPH0315358B2/ja
Granted legal-status Critical Current

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 「発明の技術分野」 本発明は、電磁波シールド性合成樹脂製成形品を2個以
上嵌合させ−C構成される電磁波シールドケースの製造
方法に関する。
DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for manufacturing an electromagnetic shielding case having a -C configuration by fitting two or more electromagnetic shielding synthetic resin molded products.

[発明の技術的背景] 近年、ディジタル電子機器の発展に伴ない、これらの電
子機器から発生する電磁波が周辺のテレビ等の他の機器
へ妨害を与えたり、あるいは仙の機器からの電磁波によ
って誤動作を起こしたりするという問題が大きくりLl
−ズアップされてきている。
[Technical Background of the Invention] In recent years, with the development of digital electronic devices, the electromagnetic waves generated by these electronic devices may interfere with other devices such as nearby televisions, or may cause malfunctions due to electromagnetic waves from other devices. There is a big problem of causing
-It's getting more and more popular.

これらの問題は電子回路を包囲するケースに電磁波シー
ルド効果を持たせることにより解決することができる。
These problems can be solved by providing an electromagnetic shielding effect to the case surrounding the electronic circuit.

しかしてこのようなケースとしては、単産性、経済性、
軽母性等の観点から合成樹脂製のものが多く用いられて
おり、ま1=射出成形の技術上の制約や内部機器の組立
作業上の都合から2つ以上の成形品を嵌合させて製造さ
れている。
However, in such a case, monoproductivity, economic efficiency,
Synthetic resin products are often used from the viewpoint of lightness, etc., and due to technical constraints of injection molding and convenience in assembling internal equipment, products are manufactured by fitting two or more molded products together. has been done.

このようなケースに電磁波シールド性を付与する方法と
しくは以下に記載するような〜種々の方法が採られてい
た。
Various methods have been used to provide electromagnetic shielding properties to such cases, as described below.

(イ〉メッキ、塗装、溶射、粘接着等の方法で合成樹脂
製ケースの外表面あるいは内表面に金属質の電磁波シー
ルド層を設りる。
(a) A metallic electromagnetic shielding layer is provided on the outer or inner surface of the synthetic resin case by plating, painting, thermal spraying, adhesive, etc.

([1)金属粉、カーボン粉、金属箔、金属SaW、カ
ーボン繊維等の導電1(1フイラーを混和した熱可塑性
樹脂によりケースを成形づる。
([1) A case is molded from a thermoplastic resin mixed with a conductive filler such as metal powder, carbon powder, metal foil, metal SaW, carbon fiber, etc.

[背景技術の問題点] しかしながらCれらの方法のうち(イ)の方法においで
は、落下による衝撃や熱ナイクル等により電磁波シール
ド層が剥1f![L、たり脱落したりするd3それがあ
り、その剥離片が万−電子回路上に落下した場合に(j
、短絡や発火等の重大事故につながり易いという問題が
あった。
[Problems with the Background Art] However, in the method (a) among these methods, the electromagnetic shielding layer peels off due to the impact caused by dropping, thermal shock, etc.! [L, or falls off d3, and if the peeled piece falls onto the electronic circuit (j
However, there was a problem in that it could easily lead to serious accidents such as short circuits and fires.

また(口)の方法にd3いCは、通常、外観の平滑性、
帯電防止のため、金型キャビティ部分の表面温度を(゛
きるだCl高く(熱可塑性樹脂の種類にもよるが通7K
 60 ℃以上)シ(成形りることにより、成形品表面
への導電性フィラーの露出を防止しているが、そのため
電磁波シールドケースの嵌合部において導電性フィラー
の接触がなくなり、この部分で電磁波が漏洩してしまう
という問題があった。そのため嵌合部の接触面を導電性
フィラーが均一に露出゛するまで削除しなければならず
、二次加工に手間がかかるという欠点があった。
In addition, C (d3) in the (mouth) method usually has a smooth appearance,
In order to prevent static electricity, the surface temperature of the mold cavity is raised to 7K (depending on the type of thermoplastic resin).
60℃ or higher) (Molding prevents the conductive filler from being exposed to the surface of the molded product, but as a result, there is no contact of the conductive filler at the fitting part of the electromagnetic shielding case, and this area is where electromagnetic waves Therefore, the contact surface of the fitting part had to be removed until the conductive filler was uniformly exposed, resulting in a drawback that secondary processing was time-consuming.

[発明の目的] 本発明はこのような点に対処してなされたもので、上述
のような二次加工を必要とすることなく嵌合部において
8!電性を有する電磁波シールドケースの製造方法を提
供することを目的とする。
[Object of the Invention] The present invention has been made in order to address the above-mentioned problems, and the 8! An object of the present invention is to provide a method for manufacturing an electromagnetic shielding case that has electrical properties.

[発明の概要] すなわち本発明の電磁波シールドケースの製造方法は電
磁波シールド性合成樹脂からなる成形品を2つ以上嵌合
させて構成される電磁波シ・−ルドケースを製造づるに
あたり、前記成形品の嵌合部となる部分の金型キャビテ
ィ内に金属板を挿入し、この状態でキャビティ内に電磁
波シールド性合成樹脂を充填し固化させて嵌合部に金属
板の露出しlこ成形品を1火苛りることを1ji徴とし
くいる。
[Summary of the Invention] That is, the method for manufacturing an electromagnetic shielding case of the present invention involves manufacturing an electromagnetic shielding case constructed by fitting two or more molded products made of electromagnetic shielding synthetic resin. A metal plate is inserted into the mold cavity of the part that will become the fitting part, and in this state, electromagnetic shielding synthetic resin is filled into the cavity and solidified, and the metal plate is exposed in the fitting part. It is considered to be a sign of anger.

本発明tこJ5い′CI史用される電磁波シールド性合
成樹脂は、金1iJi粉、カーボン紛、金属箔、金属綴
紐、カーボン繊維等の導電性フィラーを、ポリスチレン
、へBS樹脂等のスチレン系樹脂、ポリプロピレン等の
Aレフイン系樹1指、ポリカーボネ−1〜、ポリツノミ
ドa3J、ひポリ土ステルのような熱可塑性樹脂に混和
したもので−ある。
The electromagnetic shielding synthetic resin used in the present invention is a conductive filler such as gold powder, carbon powder, metal foil, metal string, carbon fiber, etc., mixed with polystyrene, styrene such as BS resin, etc. It is mixed with thermoplastic resins such as A-based resins such as polypropylene, polycarbonate-1, polytsunomide a3J, and polystyrene.

まlこ本発明にd3い(使用する金属板として(ま、平
板状あるいは「字状の鉄、111、ノフルミニウムおよ
びこれらの合金や表面にめっきを施したものがあげられ
る。
The metal plates used in the present invention include flat or letter-shaped iron, 111, nofluminium, alloys thereof, and those plated on the surface.

次にホ発明乃法を図面を用いて説明する。Next, the invention method will be explained using drawings.

第1図は本発明方法に使用する金型の断1rOCある。FIG. 1 shows a cross section of a mold used in the method of the present invention.

図にJ3いて符月1.2はそれぞれ金型の固定側型板、
移動側型(反Cあつ(、固定側キVビテイ表面3ど移動
側キ1?じティ表面4の温度は各々熱媒体流路5、G内
の熱媒体によって導電性フィラーが成形品表面に露出し
ないよう60℃以上の適温に制御され′Cいる。符号7
は本発明の特徴をなすもので、成形品嵌合部となる、金
型キャビティに挿入された金属板である。この金属板7
は、充填された電磁波シールド性合成樹脂がここ′c′
急冷固化されて導電性充填剤が露出し、この金属板7に
密接するように、予め一40〜20℃に冷却されて金型
キャビティ内に挿入される。
In the figure, J3 and sign month 1.2 are the fixed side templates of the mold, respectively.
The temperature of the movable side mold (anti-C), the fixed side key V bit surface 3, the moving side key 1, and the stationary surface 4 are respectively set by the heat medium flow path 5, and the conductive filler is applied to the molded product surface by the heat medium in G. The temperature is controlled at an appropriate temperature of 60℃ or higher to prevent exposure. Code 7
This is a feature of the present invention, and is a metal plate inserted into the mold cavity, which serves as the molded product fitting part. This metal plate 7
Here, the filled synthetic resin with electromagnetic shielding properties is 'c'.
It is rapidly cooled and solidified to expose the conductive filler, and is cooled in advance to -40 to 20 DEG C. and inserted into the mold cavity so as to be in close contact with the metal plate 7.

本発明においては、このような金型を使用して、まず射
出機のシリンダー内で゛可塑化した電vil波シールド
性合成樹脂を金型のノズルタッヂ部8を経て、金型キャ
ビディ内に充填する。このとき導電性フィラーは熱媒体
流路5.6内の熱媒体の影響をうり固定側キャビティ表
面と移動側キャビティ表面には露出しないが、低温状態
にある金属板7表面には露出し、金属板7と導電性フィ
ラーが導通した状態で電磁波シールド性合成樹脂が固化
する。
In the present invention, using such a mold, first, an electromagnetic shielding synthetic resin that has been plasticized in the cylinder of an injection machine is filled into the mold cavity through the nozzle ridge part 8 of the mold. . At this time, the conductive filler is not exposed on the fixed side cavity surface and the moving side cavity surface due to the influence of the heat medium in the heat medium flow path 5.6, but is exposed on the surface of the metal plate 7 which is in a low temperature state, and the conductive filler The electromagnetic shielding synthetic resin solidifies in a state where the plate 7 and the conductive filler are electrically connected.

このようにして成型された嵌合部に金属板の露出した成
形品9.10を金属板7.7′を接触させて嵌合してな
る電磁波シールドケースの断面を第2図(a )に、そ
の嵌合部の拡大断面を第2図(b)に示ず。第2図(b
)に示すJ:うに成形品9内の導電性フィラー[は金属
板7と導通しており、金rA板7はもう一方の成形品1
0の金属板7′と接触し、さらに成形品10の金属板7
′は成形品10内の導電性フィラーと導通しているので
、電磁波シールドケースの嵌合部は全体として導通状態
となり、かつケース表面には導電性フィラーが露出して
おらり゛絶縁層[が存在するので、外観が平滑で導電性
)rラー[との接触により帯電するiJ3それもない。
Figure 2 (a) shows a cross section of an electromagnetic shielding case formed by fitting the molded product 9.10 with the exposed metal plate in contact with the metal plate 7.7' in the fitting part formed in this way. , an enlarged cross section of the fitting portion is not shown in FIG. 2(b). Figure 2 (b
J: The conductive filler in the sea urchin molded product 9 is electrically connected to the metal plate 7, and the gold rA plate 7 is connected to the other molded product 1.
The metal plate 7' of the molded product 10 is in contact with the metal plate 7' of the molded product 10.
' is electrically conductive with the conductive filler in the molded product 10, so the fitted part of the electromagnetic shielding case is electrically conductive as a whole, and the conductive filler is exposed on the case surface. Because it is smooth in appearance and conductive, it does not get charged by contact with the iJ3.

[発明の実施例J 次に本発明の実施例につい(説明す゛る。[Embodiment J of the invention Next, embodiments of the present invention will be explained.

実施例 挿入時の温aが5′Gになるよう冷7JI L、たニラ
クルメッキ鉄板を、嵌合部となる金型キャヒティ内に挿
入した。この状tA(゛、金型のノズルタッヂ部より射
出圧力900k(1/cシ、樹脂温230℃の条1′1
で40重量%の真ちゅう繊維を含むABS樹脂からなる
電磁波シールド性合成樹脂を充填した。
EXAMPLE A cold 7JIL plated iron plate was inserted into a mold cavity serving as a fitting part so that the temperature a at the time of insertion was 5'G. In this condition tA (゛, the injection pressure is 900k (1/c) from the nozzle tedge part of the mold, the resin temperature is 230℃, the line 1'1
It was filled with an electromagnetic shielding synthetic resin made of ABS resin containing 40% by weight of brass fibers.

なJ3金W(温石は固定側キI7ヒテイ表面温度が75
℃、移動側キャピテイ表面温度が70℃になるように調
節し7た。また成型時間は゛上ケースで射出に18秒間
、冷却に60秒間、下ケースで射出に16秒間、冷却に
55秒間とした。
J3 gold W (warm stone has a surface temperature of 75 on the fixed side)
The surface temperature of the moving side cavity was adjusted to 70°C. The molding time was 18 seconds for injection and 60 seconds for cooling in the upper case, and 16 seconds for injection and 55 seconds for cooling in the lower case.

このようにしテ+[」300111m、長さ400+n
m、高さ200 vlm 、肉厚3mmの上ケースと巾
300 mm、長さ400111111.高さ150I
IIIIl、肉厚3tIIInの下ケースを製造し、こ
れらの成形品に直流モータを組み込み、上ケースと下ケ
ースを嵌合さUた。しかる後、直流モータを回転させ、
そのブラシから発生ずる雑音電波を、ケース外3關の位
置でタイボールアンテナCキャッチし、スペクトルアナ
ライザーひ測定した。測定結果は第3図(a >のグラ
フに示す通りであった。−万雷磁波シールド性合成樹脂
の成形時に金属板を使用しない以外は実施例と同様にし
て電磁波シールドケースを製造し、直流モーターを組み
込んで雑音電波を測定した。その測定結果は第3図(b
)のグラフに示ず通りでめった。
In this way, Te+['300111m, length 400+n
m, height 200 vlm, wall thickness 3 mm upper case, width 300 mm, length 400111111. Height 150I
A lower case with a wall thickness of 3tIIIn was manufactured, a DC motor was built into these molded products, and the upper and lower cases were fitted together. After that, rotate the DC motor,
The noise radio waves generated from the brush were caught by a tie ball antenna C at three positions outside the case, and measured using a spectrum analyzer. The measurement results were as shown in the graph in Figure 3 (a). - Electromagnetic shielding properties An electromagnetic shielding case was manufactured in the same manner as in the example except that no metal plate was used during molding of the synthetic resin. The noise radio waves were measured by incorporating a motor.The measurement results are shown in Figure 3 (b).
) was not shown in the graph.

このグラフからも明らかなように実施例の電磁波シール
i〜クースC゛は雑品電波が小さく、良好な゛電磁波シ
ールドタ11床をイ:1づることが認められた。
As is clear from this graph, it was confirmed that the electromagnetic wave shields I to C' of the examples had small miscellaneous radio waves and had good electromagnetic wave shielding of 11 floors.

[発明の効果」 以上説明し1ζように本発明乃法によれば、嵌合部?1
″′3!)通があり、表面は絶縁性の電磁波シールドケ
ースが1!7られるのひ、成形品の二次加工が不要とな
り、電磁波シールド効果の大きい電磁波シールドケース
が得られる。
[Effects of the Invention] As explained above, according to the method of the present invention, the fitting part? 1
``'3!) Since the electromagnetic wave shielding case with an insulating surface can be created, there is no need for secondary processing of the molded product, and an electromagnetic wave shielding case with a large electromagnetic shielding effect can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明yノ法に使用りる金型の断面図、第2図
(aC4五木発明方法により1−1られたTA磁波シー
ルドクースの組立’Cll′Ii而図、第面図(b)は
第2図(a)のI+X合部の拡大断面図、第3図(a 
)、(b)はくれそ′れ本発明方法により得られノ〔゛
電磁波シールドケースおよび従来の方法によりjqられ
た電磁波シールドケースの電磁波シールド性能を表ねづ
グラフCある。 ′1・・・・・・・・・・・・固定側型板2・・・・・
・・・・・・・移動側型板3・・・・・・・・・・・・
固定側:Yシビデイ4・・・・・・・・・・・・移動側
キllビティ5.6・・・・・・熱媒体流路 7.7′・・・金属板 9.10・・・成形品 代理人弁理士   須 山 佐 − 第1図 第 ? 図 (d)           (b) 第3図 (a) 駈り畝寸佃2 印fL麩Ml−1!
Fig. 1 is a sectional view of the mold used in the method of the present invention, Fig. 2 is a cross-sectional view of the mold used in the method of the invention. b) is an enlarged sectional view of the I+X junction in Fig. 2(a), and Fig. 3(a)
Graph C shows the electromagnetic shielding performance of the electromagnetic shielding case obtained by the method of the present invention and the electromagnetic shielding case obtained by the conventional method. '1...Fixed side template 2...
・・・・・・Moving side template 3・・・・・・・・・・・・
Fixed side: Y side 4...Moving side kick 5.6...Heat medium flow path 7.7'...Metal plate 9.10...・Articles representative Patent attorney Satoshi Suyama - Figure 1 No. ? Figure (d) (b) Figure 3 (a) Canter ridge size 2 mark fLfu Ml-1!

Claims (3)

【特許請求の範囲】[Claims] (1)電磁波シールド性合成樹脂からなる成形品を2つ
以上嵌合さIL14j″i成される電磁波シールドケー
スを製造づるにあたり、前記成形品の嵌合部となる部分
の金型キャビティ内に金属板を挿入し、この状態Cキ1
7ヒテイ内に電磁波シールド性合成樹脂を充填し固化さ
Jj((flj<合部に金属板の露出した成形品を製造
り゛ることを特徴どする電磁波シールドケースの製造方
法。
(1) Electromagnetic shielding property When manufacturing an electromagnetic shielding case made by fitting two or more molded products made of synthetic resin, metal is placed inside the mold cavity of the part that becomes the fitting part of the molded products. Insert the board and in this state C key 1
7. A method for manufacturing an electromagnetic shielding case characterized by manufacturing a molded product having a metal plate exposed at the joint.
(2)金型の表面温度を60℃以上に保持してキャビデ
ィ内に電磁波シード性合成樹脂を特徴とする特許請求の
範囲第1項記載の電磁波シールドケースの製j4方法。
(2) The method for manufacturing an electromagnetic wave shielding case according to claim 1, characterized in that the surface temperature of the mold is maintained at 60° C. or higher, and an electromagnetic wave seeding synthetic resin is provided in the cavity.
(3)金属板は予じめ一/IO〜20℃に冷N1され−
Cキャヒティ内に挿入される特5′[請求の範囲第1項
または7iS2項記載の電磁波シールドケースの製造方
法。
(3) The metal plate is pre-cooled with N1 to 1/IO~20℃.
A method for manufacturing an electromagnetic shielding case according to claim 1 or 7iS2.
JP9546683A 1983-05-30 1983-05-30 Method of producing electromagnetic wave shielding case Granted JPS59219999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9546683A JPS59219999A (en) 1983-05-30 1983-05-30 Method of producing electromagnetic wave shielding case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9546683A JPS59219999A (en) 1983-05-30 1983-05-30 Method of producing electromagnetic wave shielding case

Publications (2)

Publication Number Publication Date
JPS59219999A true JPS59219999A (en) 1984-12-11
JPH0315358B2 JPH0315358B2 (en) 1991-02-28

Family

ID=14138430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9546683A Granted JPS59219999A (en) 1983-05-30 1983-05-30 Method of producing electromagnetic wave shielding case

Country Status (1)

Country Link
JP (1) JPS59219999A (en)

Also Published As

Publication number Publication date
JPH0315358B2 (en) 1991-02-28

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