JPS59217399A - Tape for taping semiconductor part - Google Patents
Tape for taping semiconductor partInfo
- Publication number
- JPS59217399A JPS59217399A JP9266783A JP9266783A JPS59217399A JP S59217399 A JPS59217399 A JP S59217399A JP 9266783 A JP9266783 A JP 9266783A JP 9266783 A JP9266783 A JP 9266783A JP S59217399 A JPS59217399 A JP S59217399A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- semiconductor components
- taping
- semiconductor
- electrical characteristics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/003—Placing of components on belts holding the terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は、半導体部品のテーピング用テープに関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a tape for taping semiconductor components.
従来、半導体部品を包装する場合、電気特性の揃ってい
るもの同志を、他の特性を有するものと区別して包装す
ることが行われている。トランジスタの電気特性として
は、例えば直流電流増幅率（ｈｙｉ’）や降伏電圧がＮ
１■べられ、ダイオードの電気特性としては、各号−箪
圧、降伏電圧、スイッチング特性が調べられる。近年で
は、これらの特性を更に細く分類することが行われてい
る。2. Description of the Related Art Conventionally, when packaging semiconductor components, those with the same electrical characteristics are packaged separately from those with other characteristics. As for the electrical characteristics of a transistor, for example, the DC current amplification factor (hyi') and the breakdown voltage are
1. As for the electrical characteristics of the diode, each item - voltage, breakdown voltage, and switching characteristics are investigated. In recent years, these characteristics have been further classified.
このような種々の半導体部品を自動化された装置で基板
に組立てるために、多数個の半導体部品をテーピング用
テープに、電気特性の同じもの毎にまとめて固定するこ
とが行われている。In order to assemble such various semiconductor components onto a substrate using automated equipment, a large number of semiconductor components having the same electrical characteristics are collectively fixed to a taping tape.
しかしながら、従来のテーピング用テープでは、１コ５
気特性の異なる半導体部品と区別する手段として、故意
に半導体部品の数個分の空白部をテーピング用テープに
設けることが行われている。However, with conventional taping tape, 5 pieces per piece
As a means of distinguishing between semiconductor components having different chemical characteristics, blank spaces corresponding to several semiconductor components are intentionally provided on the taping tape.
このようなテーピング用テープでは、電気特性の同じ半
導体部品の数が少ない場合には、空白部分が多くなシ、
１巻のテーピング用夢−グに固定できる半導体部品の数
が少なくなる欠点がある。また、このような空白部分の
多いテーピング用テープを使用すると、頻繁にテーピン
グ用テープを交換しなければならず、作業性が悪い欠点
がある。更に、テーピング用テープを使用する自動挿入
装置のソフトウェアを、空白部分の検出ができるように
変更しなければならない問題があった。With this type of taping tape, if there are only a small number of semiconductor components with the same electrical characteristics, the taping tape may have many blank areas.
There is a drawback that the number of semiconductor components that can be fixed to one roll of taping tape is reduced. Furthermore, if a taping tape with many blank areas is used, the taping tape must be replaced frequently, resulting in poor workability. Furthermore, there is a problem in that the software of the automatic insertion device that uses the taping tape must be changed so that it can detect blank areas.
本発明は、半導体部品の基板等への供給操作を円滑に行
い、かつ、電気特性の異なる部品の区別を容易にすると
共に、固定する半導体部品の数を増大できる半導体部品
のテーピング用テープを提供することをその目的とする
ものである。The present invention provides a tape for taping semiconductor components that can smoothly supply semiconductor components to a substrate, etc., easily distinguish components with different electrical characteristics, and increase the number of semiconductor components to be fixed. Its purpose is to
本発明は、半導体部品を固定する固定部の複数個毎に対
応して、認識マークを設けたことに１ よシ、半
導体部品の基板等への供給操作を円滑に行い、かつ、電
気特性の異なる部品の区別を容易にすると共に、固定す
る半導体部品の数のの増大を図った半導体部品のテーピ
ング用テープである。The present invention provides identification marks corresponding to each of a plurality of fixing parts for fixing semiconductor components.1. This is a tape for taping semiconductor components that facilitates the differentiation of different components and increases the number of semiconductor components that can be fixed.
以下、本発明の実施例について図面を参照して説明する
。Embodiments of the present invention will be described below with reference to the drawings.
第１図（４）は、本発明の一実施例の平面図、同図（Ｂ
）は、同実施例の側面図である。この半導体部品のテー
ピング用テープは、テープ本体ｌにその長手方向に沿っ
て半導体部品全固定するための凹み部２からなる固定部
を所定間隔で設けている。夫々の凹み部２間に対応テー
プ本体１の領域には、移送用の過少穴３が穿設されてい
る。凹み部２の側部には、４個目の凹み部２ごとに、認
識マーク４として穴が穿設されている。FIG. 1 (4) is a plan view of one embodiment of the present invention, and FIG.
) is a side view of the same embodiment. This tape for taping semiconductor components has fixing portions consisting of recessed portions 2 provided at predetermined intervals along the longitudinal direction of the tape body 1 for completely fixing the semiconductor components. In the region of the corresponding tape body 1 between the respective recesses 2, underholes 3 for transport are bored. A hole is bored as a recognition mark 4 at each fourth recess 2 on the side of the recess 2 .
ここで、認識マーク４の形成位置を４個［１の凹み部２
の側部としたのは、電気特性の異なる半導体部品の使用
個数の最小単位が４個だからである。つまシ、認識マー
ク４の形成位＃は、同一の電気特性を有する半導体部品
の最小の使用個数に応じて適宜設定するのが望ましい。Here, the formation positions of the recognition mark 4 are set at four positions [1 recessed part 2].
The reason for selecting the side part is that the minimum unit of the number of semiconductor components having different electrical characteristics is four. It is desirable that the formation position # of the pick and recognition mark 4 be appropriately set according to the minimum number of semiconductor components having the same electrical characteristics to be used.
また、認識マーク４の形成は、予めテープ本体１に過少
穴３を形成する際に同時に形成しておいても良い、或は
、半導体部品を凹み部２に固定してシールした後に、形
成しても良い。また、テープ本体１′としては、第２図
体）ω）に示す如く、半導体部品を収容する収容枠２′
の開口した両面を塞ぐようにしたものでも良い。Further, the recognition mark 4 may be formed in advance at the same time as forming the undersized hole 3 in the tape body 1, or it may be formed after the semiconductor component is fixed in the recessed part 2 and sealed. It's okay. In addition, as shown in the second figure) ω), the tape body 1' includes a housing frame 2' for housing semiconductor components.
It is also possible to close both sides of the opening.
このように構成された半導体部品のテーピング用テープ
によれば、電気特性が同じである半導体部品の使用個数
の最小単位ごとに、凹み部２．２′からなる固定部の近
傍に認識マーク４が形成されているので、半導体部品を
他の電気特性を有するものと容易に区別することができ
る。According to the taping tape for semiconductor components configured in this way, a recognition mark 4 is placed near the fixing part consisting of the recessed part 2.2' for each minimum unit of the number of used semiconductor parts having the same electrical characteristics. This makes it easy to distinguish semiconductor components from those with other electrical properties.
また、電気特性の異なる半導体部品を凹み部２゜２′に
連続的に固定できるので、固定する電気部品の数を増大
させることができる。また、半導体部品を固定していな
い凹み部２．２′からなる空白領域が小さいので、半導
体部品の基板等への供給操作を円滑に行うことができる
。また、テーピング用テープを使用する自動挿入装置に
、空白部分を検出するためのソフトウェアを組込む必要
がない。Furthermore, since semiconductor components having different electrical characteristics can be successively fixed in the recessed portions 2.degree. 2', the number of electrical components to be fixed can be increased. Further, since the blank area consisting of the recessed portion 2.2' to which the semiconductor component is not fixed is small, the operation of supplying the semiconductor component to the substrate etc. can be carried out smoothly. Furthermore, there is no need to incorporate software for detecting blank areas into an automatic insertion device that uses taping tape.
なお、本発明の他の実施例として、第３図（Ａ）の）に
示す如く、認識マーク４としてテープ本体１の側部に切
欠き４ａを形成するようにしたものでも良い。この場合
に、テープ本体１′として、凹み部２．２′と＃１に等
じ肉厚のものを用いても良いことは勿論である。更に、
切欠き４ｂを、第５図に示す如く、凹み部２の側部に形
成したものでも良す。As another embodiment of the present invention, a notch 4a may be formed in the side of the tape body 1 as the recognition mark 4, as shown in FIG. 3(A). In this case, it goes without saying that the tape body 1' may have the same thickness as the recessed portions 2.2' and #1. Furthermore,
The notch 4b may be formed on the side of the recessed portion 2, as shown in FIG.
また、第６図に示す如く、固定部の代ゎシに貼付テープ
５を有するテープ本体１“を使用し、このテープ本体ｌ
“に上述と同様に必要最小数の半導体部品６の数に応じ
た位置に穴からなる認識マーク４を穿設したものでも良
し６また、第７図に示す如く、半導体部品６の両端部を
、過少穴３を形成してぃ々いテープ本体ｌ′であって貼
付テープ５を設けたもので固定し、このテープ本体ｌ′
の所定位置、例えば４個の必要最小数の半導体部品６ご
とに対応した位置に穴からなる認識マーク４を設けたも
のでも良い。In addition, as shown in FIG.
Similarly to the above, a recognition mark 4 consisting of a hole may be bored at a position corresponding to the minimum number of semiconductor components 6 required.6Alternatively, as shown in FIG. , a large tape body l' having a small hole 3 formed thereon and provided with an adhesive tape 5 is fixed, and this tape body l'
A recognition mark 4 made of a hole may be provided at a predetermined position, for example, at a position corresponding to each of the four required minimum number of semiconductor components 6.
以上説明した如く、本発明に係る半導体部品のテーピン
グ用テープによれば、半導体部品の基板等への供給操作
を円滑に行い、かつ、電気特性の異なる部品の区別金谷
易にすると共に、固定する半導体部品の数を増大できる
ものである。As explained above, according to the tape for taping semiconductor components according to the present invention, it is possible to smoothly supply semiconductor components to a substrate, etc., to easily distinguish between components with different electrical characteristics, and to fix them. This allows the number of semiconductor components to be increased.
昭誠マークとして切欠き全採用した本発明の詳細な説明
図である。
１．１“、７″・・・テープ本体、２・・・凹み部、３
・・・送シ穴、４認識マーク、５・・・貼付テープ、６
・・・半導体部品。It is a detailed explanatory diagram of the present invention in which the entire notch is adopted as the Shosei mark. 1.1", 7"...Tape body, 2...Concave part, 3
... feed hole, 4 recognition mark, 5 ... pasting tape, 6
...Semiconductor parts.
Claims (2)
で形成された多数個の半導体部品の固定部と、該固定部
の複数個毎に対応して前記テープ本体に形成された認識
マークとを具備してなることを特徴とする半導体部品の
テーピング用テープ。(1) A plurality of semiconductor component fixing portions formed on a tape body at predetermined intervals along its longitudinal direction, and recognition marks formed on the tape body corresponding to each of the plurality of fixing portions. A tape for taping semiconductor parts, characterized by comprising:
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9266783A JPS59217399A (en) | 1983-05-26 | 1983-05-26 | Tape for taping semiconductor part |
| GB08413034A GB2140383B (en) | 1983-05-26 | 1984-05-22 | Semiconductor part-carrying tape |
| GB08615987A GB2177060B (en) | 1983-05-26 | 1986-07-01 | Support for semiconductor parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9266783A JPS59217399A (en) | 1983-05-26 | 1983-05-26 | Tape for taping semiconductor part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59217399A true JPS59217399A (en) | 1984-12-07 |
Family
ID=14060825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9266783A Pending JPS59217399A (en) | 1983-05-26 | 1983-05-26 | Tape for taping semiconductor part |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS59217399A (en) |
| GB (2) | GB2140383B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131970U (en) * | 1986-09-03 | 1988-08-29 | ||
| JPH0199974A (en) * | 1987-09-30 | 1989-04-18 | Nec Corp | Taping of semiconductor device |
| JPH0216763U (en) * | 1988-07-20 | 1990-02-02 | ||
| EP2617057A1 (en) * | 2010-09-16 | 2013-07-24 | OSRAM Opto Semiconductors GmbH | Method for combining leds in a packaging unit and packaging unit having a multiplicity of leds |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151896A (en) * | 1984-08-21 | 1986-03-14 | 株式会社村田製作所 | Electronic part series |
| JPH0239968Y2 (en) * | 1984-12-24 | 1990-10-25 | ||
| US4708901A (en) * | 1985-09-20 | 1987-11-24 | Gerber Scientific Products, Inc. | Coded web and associated web handling and working machine |
| NL8503063A (en) * | 1985-11-08 | 1987-06-01 | Philips Nv | TIRE PACKAGING FOR ELECTRICAL AND / OR ELECTRONIC COMPONENTS. |
| GB2184098B (en) * | 1985-12-13 | 1989-11-29 | Gerber Scient Inc | Web loading and feeding system |
| EP0321961B1 (en) * | 1987-12-23 | 1992-08-12 | Siemens Aktiengesellschaft | Process for taping tuning diodes with a fluent transition of the capacitor synchronization groups |
| US6779726B1 (en) | 1999-11-03 | 2004-08-24 | Solectron Corporation | Method and apparatus for controlling a production operation using printed information on a component tape |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB755596A (en) * | 1953-11-13 | 1956-08-22 | Erie Resistor Corp | Improvements in the packaging of electrical condensers |
| JPS5112661A (en) * | 1974-07-22 | 1976-01-31 | Tdk Electronics Co Ltd | Kondensaoyobisono seizohoho |
| FR2452856A1 (en) * | 1979-03-28 | 1980-10-24 | Europ Composants Electron | COMPONENT PACKAGING MEDIUM AND MANUFACTURING METHOD USING THE SAME |
-
1983
- 1983-05-26 JP JP9266783A patent/JPS59217399A/en active Pending
-
1984
- 1984-05-22 GB GB08413034A patent/GB2140383B/en not_active Expired
-
1986
- 1986-07-01 GB GB08615987A patent/GB2177060B/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131970U (en) * | 1986-09-03 | 1988-08-29 | ||
| JPH0199974A (en) * | 1987-09-30 | 1989-04-18 | Nec Corp | Taping of semiconductor device |
| JPH0216763U (en) * | 1988-07-20 | 1990-02-02 | ||
| EP2617057A1 (en) * | 2010-09-16 | 2013-07-24 | OSRAM Opto Semiconductors GmbH | Method for combining leds in a packaging unit and packaging unit having a multiplicity of leds |
| JP2013544712A (en) * | 2010-09-16 | 2013-12-19 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Method for organizing a plurality of LEDs in a packaging unit, and a packaging unit comprising a plurality of LEDs |
| US9171884B2 (en) | 2010-09-16 | 2015-10-27 | Osram Opto Semiconductors Gmbh | Method for combining LEDS in a packaging unit and packaging unit having a multiplicity of LEDS |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8413034D0 (en) | 1984-06-27 |
| GB2177060B (en) | 1987-12-09 |
| GB2140383A (en) | 1984-11-28 |
| GB2140383B (en) | 1987-12-02 |
| GB2177060A (en) | 1987-01-14 |
| GB8615987D0 (en) | 1986-08-06 |
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