JPH0199974A - Taping of semiconductor device - Google Patents
Taping of semiconductor deviceInfo
- Publication number
- JPH0199974A JPH0199974A JP24710787A JP24710787A JPH0199974A JP H0199974 A JPH0199974 A JP H0199974A JP 24710787 A JP24710787 A JP 24710787A JP 24710787 A JP24710787 A JP 24710787A JP H0199974 A JPH0199974 A JP H0199974A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- semiconductor device
- taping
- semiconductor devices
- dropout
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 claims description 11
- 238000004080 punching Methods 0.000 claims description 3
- 239000003550 marker Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
Landscapes
- Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置をテープ内にテーピングする半導体
装置のテーピング方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device taping method for taping a semiconductor device into a tape.
近年、半導体装置を各種基板へ実装する方法として各種
のテーピング品の対応が強いられている。In recent years, various taping products have been increasingly used as a method for mounting semiconductor devices on various substrates.
従来のテーピング作業方法としては、キャリアテープ3
1のエンボス部り1a内に半導体装置33を収納し、収
納された該半導体装置33をカバーテープ32でカバー
し、キャリアテープ31とカバーテープ32とを熱圧着
部36で熱圧着しテーピングするのが一般的な半導体装
置のテーピング方法である。34はキャリアテープ31
の送り穴である。The conventional taping method is carrier tape 3.
A semiconductor device 33 is housed in the embossed portion 1a of 1, the housed semiconductor device 33 is covered with a cover tape 32, and the carrier tape 31 and the cover tape 32 are thermocompression bonded and taped using a thermocompression bonding section 36. This is a general taping method for semiconductor devices. 34 is carrier tape 31
It is a sprocket hole.
上述した半導体装置のテーピング方法については半導体
装@33をキャリアテープ31内に自動的に収納する際
、テーピング機のタイミングミス及び設備調整不備等に
より吸着不具合に伴う半導体装置の欠落が接種であるが
生じる。Regarding the above-mentioned taping method for semiconductor devices, when semiconductor devices @33 are automatically stored in the carrier tape 31, semiconductor devices may be missing due to suction failure due to timing errors of the taping machine, improper equipment adjustment, etc. arise.
欠落が生じた該テーピング品を使用し、各種基板へ半導
体装置を自動実装した場合、該欠落部においては吸着不
良となり実装機が停止し、実装作業の能率が低下すると
いう欠点を有している。When a semiconductor device is automatically mounted on various substrates using the taped product with the chipping, there is a drawback that the chipping part becomes insufficiently suctioned and the mounting machine stops, reducing the efficiency of the mounting work. .
本発明の目的は前記問題点を解消したテーピング方法を
提供することにある。An object of the present invention is to provide a taping method that solves the above problems.
上述した従来の半導体装置のテーピング方法は、該テー
ピング時半導体装置が欠落した箇所は特別な処置が施さ
れず出荷され半導体装置を基板等へ実装する際、該テー
ピング品の欠落部は半導体装置の吸着が不可であり実装
機が停止するという不具合があるのに対し、本発明はテ
ーピング時、吸着ミスにより半導体装置が欠落した箇所
には予めテーピング機内に設置された半導体装置の有無
センサが検知する磁気マーキング又はポンチの穿孔等の
マーカ一部を付すという相違点を有する。In the conventional taping method for semiconductor devices described above, the missing parts of the semiconductor device are not treated with any special treatment during the taping process and are shipped, and when the semiconductor device is mounted on a board etc., the missing parts of the taped product are In contrast to the problem that suction is not possible and the mounting machine stops, in the present invention, a semiconductor device presence sensor installed in advance in the taping machine detects the location where a semiconductor device is missing due to a suction error during taping. The difference is that some markers such as magnetic markings or punch holes are attached.
本発明は半導体装置を収納するテープ内で半導体装置が
欠落している箇所に予め磁気マーキング又はテープへの
穿孔等による半導体装置の欠落を示すマーキング部を付
しつつ、半導体装置をテープにテーピングすることを特
徴とする半導体装置のテーピング方法である。The present invention involves taping a semiconductor device onto a tape while attaching in advance a marking portion indicating the missing semiconductor device by magnetic marking or punching in the tape to the location where the semiconductor device is missing within the tape that stores the semiconductor device. A method of taping a semiconductor device is characterized in that:
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
(実施例1)
第1図において、半導体装置3はキャリアテープ1のエ
ンボス部1aに収納され半導体装置3の飛跳ね防止とし
てカバーテープ2の両端はキャリアテープ1に熱圧着部
6で熱圧着される。キャリアテープ1の供給は該テープ
の片側に穿孔された送り穴4によって順次送られ、第1
図(c)に示すように吸着不具合等によりキャリアテー
プ1のエンボス部la内に半導体装置3が欠落した箇所
においては図示しない半導体装置の有無検査センサの働
きにより、半導体装置の欠落を示す磁気マーキング部5
aをカバーテープ2上に塗布する。該欠落部を示す磁気
マーキング部5aは半導体装置3を基板等へ実装する際
、実装機内に予め設置した図示しない磁気マーカー検知
センサの働きにより無と判定し、該欠落部を自動的にス
キップさせて半導体装置゛の実装を行う。(Example 1) In FIG. 1, a semiconductor device 3 is housed in an embossed portion 1a of a carrier tape 1, and both ends of the cover tape 2 are thermocompression bonded to the carrier tape 1 by a thermocompression bonding section 6 to prevent the semiconductor device 3 from flying away. Ru. The carrier tape 1 is fed sequentially through feed holes 4 drilled on one side of the tape.
As shown in Figure (c), at a location where a semiconductor device 3 is missing in the embossed portion la of the carrier tape 1 due to a suction failure or the like, a magnetic marking indicating the missing semiconductor device is made by the function of a semiconductor device presence/absence inspection sensor (not shown). Part 5
Apply a on cover tape 2. When the semiconductor device 3 is mounted on a board or the like, the magnetic marking portion 5a indicating the missing portion is determined to be absent by the action of a magnetic marker detection sensor (not shown) installed in advance in the mounting machine, and the missing portion is automatically skipped. Then, the semiconductor device is mounted.
(実施例2)
第2図は本発明の実施例2の平面図である。半導体装置
3はキャリアテープ1のエンボス部1aに収納され更に
カバーテープ2の両端は熱圧着6される。該テーピング
方法は第1の実施例と同じ作業である。(Embodiment 2) FIG. 2 is a plan view of Embodiment 2 of the present invention. The semiconductor device 3 is housed in the embossed portion 1a of the carrier tape 1, and both ends of the cover tape 2 are thermocompression bonded 6. The taping method is the same operation as in the first embodiment.
本実施例では半導体装置3が欠落した箇所のカバーテー
プ2上にはポンチ等により0型又は、口型の穿孔部5b
を付したものである。半導体装置3を実装する際に該穿
孔部5bを実装機内に設置された図示しないセンサが作
動し自動的にスキップされるため、実施例1と同様に実
装機の停止がなくなり、安定したテーピング品の供給が
可能となる。In this embodiment, a 0-type or opening-shaped hole 5b is formed on the cover tape 2 at a location where the semiconductor device 3 is missing by punching or the like.
. When mounting the semiconductor device 3, a sensor (not shown) installed in the mounting machine activates the perforation 5b and automatically skips it, so the mounting machine does not have to stop as in Example 1, and a stable taped product can be obtained. It becomes possible to supply
以上説明したように本発明はテーピング時に吸着不具合
等により半導体装置が欠落してテーピングした部分に磁
気マーキング又は穿孔等めマーカ一部を付すことにより
、該テーピング品を使用した自動実装機においてマーカ
一部を検知して該欠落部を自動的にスキップしテーピン
グ実装を行うことができ、テーピング実装作業性の向上
を図ることができるという効果を有するものである。As explained above, the present invention attaches a part of the marker such as magnetic marking or perforation to the taped part where the semiconductor device is missing due to suction failure etc. during taping. This has the effect that taping mounting can be performed by detecting the missing part and automatically skipping the missing part, thereby improving the taping mounting work efficiency.
第1図(a)は本発明の第1の実施例を示す平面図。
第1図(b)は第1図(a)のA−A’線断面図、第1
図(c)は第1図(a)のB−8’線断面図、第2図は
本発明の第2の実施例を示す平面図、第3図は従来例を
示す平面図である。FIG. 1(a) is a plan view showing a first embodiment of the present invention. Figure 1(b) is a sectional view taken along the line A-A' in Figure 1(a).
FIG. 1(c) is a sectional view taken along line B-8' in FIG. 1(a), FIG. 2 is a plan view showing a second embodiment of the present invention, and FIG. 3 is a plan view showing a conventional example.
Claims (1)
落している箇所に予め磁気マーキング又はテープへの穿
孔等による半導体装置の欠落を示すマーキング部を付し
つつ、半導体装置をテープにテーピングすることを特徴
とする半導体装置のテーピング方法。(1) Tape the semiconductor device to the tape while attaching a marking part indicating the missing semiconductor device by magnetic marking or punching in the tape in advance to the place where the semiconductor device is missing in the tape that stores the semiconductor device. A method for taping a semiconductor device, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24710787A JPH0199974A (en) | 1987-09-30 | 1987-09-30 | Taping of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24710787A JPH0199974A (en) | 1987-09-30 | 1987-09-30 | Taping of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0199974A true JPH0199974A (en) | 1989-04-18 |
Family
ID=17158535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24710787A Pending JPH0199974A (en) | 1987-09-30 | 1987-09-30 | Taping of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0199974A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007075662A1 (en) * | 2005-12-20 | 2007-07-05 | 3M Innovative Properties Company | Component carrier tape |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59217399A (en) * | 1983-05-26 | 1984-12-07 | 株式会社東芝 | Tape for taping semiconductor part |
JPS61190458A (en) * | 1985-02-20 | 1986-08-25 | 日本電気株式会社 | Packaging vessel for semiconductor device |
-
1987
- 1987-09-30 JP JP24710787A patent/JPH0199974A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59217399A (en) * | 1983-05-26 | 1984-12-07 | 株式会社東芝 | Tape for taping semiconductor part |
JPS61190458A (en) * | 1985-02-20 | 1986-08-25 | 日本電気株式会社 | Packaging vessel for semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007075662A1 (en) * | 2005-12-20 | 2007-07-05 | 3M Innovative Properties Company | Component carrier tape |
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