JPH0199974A - Taping of semiconductor device - Google Patents

Abstract

PURPOSE:To improve the workability of taping mount through taping mount with automatic skip of dropouts, by taping semiconductor devices on a tape while the tape containing semiconductor devices are marked at points of their dropout. CONSTITUTION:A semiconductor device 3 is contained in an embossed part 1a of a carrier tape 1, and both ends of a cover tape 2 is heat-bonded to the carrier tape 1 by a thermocompression bonder 6 for the purpose of preventing skips of the devices 3. The carrier tape 1 is fed successively by feed holes 4 bored on one side of the tape 1. A magnetic marking 5a indicating the dropout of semiconductor devices is applied to the cover tape 2 by the action of a presence checking sensor at points of the dropout due to poor chuck of semiconductor devices 3 in the embassed part 1a of the carrier tape 1. The magnetic marking 5a identifier absence by the action of the magnetic marker sensor preset in the mounting machine before mounting of a semiconductor device 3 onto a board or the like, thereby allowing skip the dropout automatically for mounting of semiconductor devices.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device taping method for taping a semiconductor device into a tape.

[Conventional technology]

In recent years, various taping products have been increasingly used as a method for mounting semiconductor devices on various substrates.

The conventional taping method is carrier tape 3.
A semiconductor device 33 is housed in the embossed portion 1a of 1, the housed semiconductor device 33 is covered with a cover tape 32, and the carrier tape 31 and the cover tape 32 are thermocompression bonded and taped using a thermocompression bonding section 36. This is a general taping method for semiconductor devices. 34 is carrier tape 31
It is a sprocket hole.

[Problem that the invention seeks to solve]

Regarding the above-mentioned taping method for semiconductor devices, when semiconductor devices @33 are automatically stored in the carrier tape 31, semiconductor devices may be missing due to suction failure due to timing errors of the taping machine, improper equipment adjustment, etc. arise.

When a semiconductor device is automatically mounted on various substrates using the taped product with the chipping, there is a drawback that the chipping part becomes insufficiently suctioned and the mounting machine stops, reducing the efficiency of the mounting work. .

An object of the present invention is to provide a taping method that solves the above problems.

[Differences between the invention and the prior art]

In the conventional taping method for semiconductor devices described above, the missing parts of the semiconductor device are not treated with any special treatment during the taping process and are shipped, and when the semiconductor device is mounted on a board etc., the missing parts of the taped product are In contrast to the problem that suction is not possible and the mounting machine stops, in the present invention, a semiconductor device presence sensor installed in advance in the taping machine detects the location where a semiconductor device is missing due to a suction error during taping. The difference is that some markers such as magnetic markings or punch holes are attached.

[Means for solving problems]

The present invention involves taping a semiconductor device onto a tape while attaching in advance a marking portion indicating the missing semiconductor device by magnetic marking or punching in the tape to the location where the semiconductor device is missing within the tape that stores the semiconductor device. A method of taping a semiconductor device is characterized in that:

〔Example〕

Next, the present invention will be explained with reference to the drawings.

(Example 1) In FIG. 1, a semiconductor device 3 is housed in an embossed portion 1a of a carrier tape 1, and both ends of the cover tape 2 are thermocompression bonded to the carrier tape 1 by a thermocompression bonding section 6 to prevent the semiconductor device 3 from flying away. Ru. The carrier tape 1 is fed sequentially through feed holes 4 drilled on one side of the tape.
As shown in Figure (c), at a location where a semiconductor device 3 is missing in the embossed portion la of the carrier tape 1 due to a suction failure or the like, a magnetic marking indicating the missing semiconductor device is made by the function of a semiconductor device presence/absence inspection sensor (not shown). Part 5
Apply a on cover tape 2. When the semiconductor device 3 is mounted on a board or the like, the magnetic marking portion 5a indicating the missing portion is determined to be absent by the action of a magnetic marker detection sensor (not shown) installed in advance in the mounting machine, and the missing portion is automatically skipped. Then, the semiconductor device is mounted.

(Embodiment 2) FIG. 2 is a plan view of Embodiment 2 of the present invention. The semiconductor device 3 is housed in the embossed portion 1a of the carrier tape 1, and both ends of the cover tape 2 are thermocompression bonded 6. The taping method is the same operation as in the first embodiment.

In this embodiment, a 0-type or opening-shaped hole 5b is formed on the cover tape 2 at a location where the semiconductor device 3 is missing by punching or the like.
. When mounting the semiconductor device 3, a sensor (not shown) installed in the mounting machine activates the perforation 5b and automatically skips it, so the mounting machine does not have to stop as in Example 1, and a stable taped product can be obtained. It becomes possible to supply

〔Effect of the invention〕

As explained above, the present invention attaches a part of the marker such as magnetic marking or perforation to the taped part where the semiconductor device is missing due to suction failure etc. during taping. This has the effect that taping mounting can be performed by detecting the missing part and automatically skipping the missing part, thereby improving the taping mounting work efficiency.

[Brief explanation of the drawing]

FIG. 1(a) is a plan view showing a first embodiment of the present invention. Figure 1(b) is a sectional view taken along the line A-A' in Figure 1(a).
FIG. 1(c) is a sectional view taken along line B-8' in FIG. 1(a), FIG. 2 is a plan view showing a second embodiment of the present invention, and FIG. 3 is a plan view showing a conventional example.

Claims (1)

[Claims] (1) Tape the semiconductor device to the tape while attaching a marking part indicating the missing semiconductor device by magnetic marking or punching in the tape in advance to the place where the semiconductor device is missing in the tape that stores the semiconductor device. A method for taping a semiconductor device, characterized in that: