JPS61190458A - Packaging vessel for semiconductor device - Google Patents
Packaging vessel for semiconductor deviceInfo
- Publication number
- JPS61190458A JPS61190458A JP3195285A JP3195285A JPS61190458A JP S61190458 A JPS61190458 A JP S61190458A JP 3195285 A JP3195285 A JP 3195285A JP 3195285 A JP3195285 A JP 3195285A JP S61190458 A JPS61190458 A JP S61190458A
- Authority
- JP
- Japan
- Prior art keywords
- container
- semiconductor device
- packaging
- semiconductor devices
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Packages (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、台テープの長さ方向に沿って個々に設けられ
た容器部に半導体装置を収納し包装するマガジン容器状
テーピングに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to magazine container-like taping for storing and packaging semiconductor devices in individual container portions provided along the length of the base tape.
従来、半導体装置の包装方法として、ビニール袋による
ばら詰、または、粘着性テープで貼り付けるテーピング
方式、規定の容器に並べるマガジン包装、あるいは、マ
ガジン容器をテーピング状にしたテーピング方式などが
ある。Conventional packaging methods for semiconductor devices include bulk packaging in plastic bags, taping with adhesive tape, magazine packaging in which semiconductor devices are lined up in prescribed containers, and taping in which magazine containers are taped.
上述した中で、マガジン容器状のテーピング方式では、
台テープの一面側に一列に個々に凹ませた容器部に半導
体装置を収納組み込み時に、飛びはね、つかみそこね等
で、容器部に入らない時がある。父、上記の包装は、半
導体装置組み込み後直ちに封止してしまうため、後にな
って空の容器部が発見されても修後不可能になってしま
う。特に、セットメーカーでは、空容器部があると自動
実装後、部品不搭載不良になってしまい、上記空容器部
の存在するテーピング部品は、セットメーカーの要求を
満たすことはできない。このため、包装時の外観チェッ
ク、再テーピング等の工数が増大し、又作業性が著しく
劣るため、原価上昇という悪影響を及ぼしていた。Among the above, in the magazine container-shaped taping method,
When semiconductor devices are housed and assembled in a container section that is individually recessed in a row on one side of the base tape, there are cases where the semiconductor devices do not fit into the container section because they fly off, are not grasped, etc. Unfortunately, since the packaging described above is sealed immediately after the semiconductor device is assembled, even if an empty container is discovered later, it will be impossible to repair it. Particularly, for set manufacturers, if there is an empty container part, the component will be defective after automatic mounting, and the taped parts with the empty container part cannot meet the requirements of the set manufacturer. For this reason, the number of man-hours for checking the appearance during packaging, re-taping, etc. increases, and the workability is extremely poor, resulting in an adverse effect of increasing costs.
上記問題点に対し、本発明では、台テープの長さ方向に
個々設けられた容器部における半導体装置の収納情況な
どの情報を与えるための情報記録媒体が、前記台テープ
に沿って設けられている。In order to solve the above problem, in the present invention, an information recording medium for providing information such as the storage status of semiconductor devices in the container portions provided individually in the length direction of the mounting tape is provided along the mounting tape. There is.
つぎに本発明を実施例によシ説明する。 Next, the present invention will be explained using examples.
第１図は本発明の一実施例の包装容器に半導体装置を収
納し、リールに巻いた状態を示す斜視図である。図にお
いて、台テープ１の長さ方向に沿って個々に凹んだ容器
部２が設けられ、この容器部に半導体装置３を収納し、
例えばリール４に巻いて保管される。なお、台テープ１
０片側に沿って、各容器部２における半導体装置の収納
状況などの情報を与えるための磁気テープ５が着装され
ている。FIG. 1 is a perspective view showing a state in which a semiconductor device is housed in a packaging container according to an embodiment of the present invention and wound onto a reel. In the figure, individually recessed container portions 2 are provided along the length direction of the mounting tape 1, and semiconductor devices 3 are housed in the container portions.
For example, it is wound on a reel 4 and stored. In addition, stand tape 1
A magnetic tape 5 is attached along one side of the container 2 for providing information such as the storage status of semiconductor devices in each container section 2.
上記の本発明の包装容器では、半導体装置を容器部に収
納組込み時に、飛びはねなどにより収納されず空容器部
となったとしても、磁気テープ５内に半導体装置の有無
の信号を入力すれば、その後の半導体装置をプリント基
板に実装する際、入力信号読み取り装置により半導体装
置があるかどうか検出され、無い場合は空送シとして、
自動組立における部品不搭載事故などが防止される。In the above-mentioned packaging container of the present invention, even if the semiconductor device is not stored in the container portion due to splashing etc. and becomes an empty container portion when the semiconductor device is stored and assembled in the container portion, a signal indicating the presence or absence of the semiconductor device can be input into the magnetic tape 5. For example, when subsequently mounting a semiconductor device on a printed circuit board, an input signal reading device detects whether or not there is a semiconductor device, and if there is no semiconductor device, the device is air-shipped.
Accidents such as parts not being loaded during automatic assembly are prevented.
第１図は本発明の一実施例の包装容器に半導体装置を収
納し、リールに巻いた状態を示す斜視図である。
１・−・・・・台テープ、２・・・・・−容器部、３・
・・・・・半導体装置、４・・・・・・リール、５・・
・・・・磁気テープ。FIG. 1 is a perspective view showing a state in which a semiconductor device is housed in a packaging container according to an embodiment of the present invention and wound onto a reel. 1.--Base tape, 2.--Container part, 3.
...Semiconductor device, 4...Reel, 5...
····Magnetic tape.
Claims (1)
に半導体装置を収納し包装する包装容器において、前記
容器部の個々の位置に対応し、この容器部における半導
体装置の収納状況などの情報を与えるための情報媒体が
、前記台テープに沿って設けられていることを特徴とす
る半導体装置の包装容器。In a packaging container in which semiconductor devices are housed and packaged in individual container portions provided along the length direction of the base tape, the status of storage of semiconductor devices in this container portion corresponds to each position of the container portion. A packaging container for a semiconductor device, characterized in that an information medium for providing information is provided along the mounting tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3195285A JPS61190458A (en) | 1985-02-20 | 1985-02-20 | Packaging vessel for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3195285A JPS61190458A (en) | 1985-02-20 | 1985-02-20 | Packaging vessel for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61190458A true JPS61190458A (en) | 1986-08-25 |
Family
ID=12345293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3195285A Pending JPS61190458A (en) | 1985-02-20 | 1985-02-20 | Packaging vessel for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61190458A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6349358U (en) * | 1986-09-18 | 1988-04-04 | ||
| JPS63232170A (en) * | 1987-03-18 | 1988-09-28 | ティーディーケイ株式会社 | Electronic part run |
| JPH0199974A (en) * | 1987-09-30 | 1989-04-18 | Nec Corp | Taping of semiconductor device |
| JPH01199866A (en) * | 1987-11-18 | 1989-08-11 | Philip Morris Prod Inc | Tear tape or sealing strip for packaging |
-
1985
- 1985-02-20 JP JP3195285A patent/JPS61190458A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6349358U (en) * | 1986-09-18 | 1988-04-04 | ||
| JPS63232170A (en) * | 1987-03-18 | 1988-09-28 | ティーディーケイ株式会社 | Electronic part run |
| JPH0199974A (en) * | 1987-09-30 | 1989-04-18 | Nec Corp | Taping of semiconductor device |
| JPH01199866A (en) * | 1987-11-18 | 1989-08-11 | Philip Morris Prod Inc | Tear tape or sealing strip for packaging |
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