JPS627566Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a belt-shaped storage device for transporting electronic components, particularly chip-type electronic components.

Chip-type electronic components are particularly small ones that can be directly attached to hybrid integrated circuit boards.
Due to its compact structure, it is handled by being attached to a tape-shaped storage device in series for transportation. The structure attached to such a tape-shaped storage device is convenient for automatic mounting by machine onto a hybrid integrated circuit board.

However, with the conventional mounting structure, it is practically impossible to check the characteristics while it is attached to the strip storage device, so it is necessary to remove it from the strip storage device, check the characteristics, and then attach it to the hybrid integrated circuit board. This actually made automatic implementation by machines difficult.

An object of the present invention is to provide a belt-shaped storage device for transporting small electronic components, which allows characteristics to be checked while the electronic components are attached to the storage device.

According to the present invention, a band-shaped storage device for small electronic components having conductive electrode foils at the locations where the external leads of the electronic components to which a tape having an electronic component mounting structure is attached is obtained.

That is, according to the belt-shaped storage device of the present invention, the probe of the characteristic testing device is applied to the conductive electrode foil with the electronic component attached, and pressure is applied to the external lead of the electronic component so that it comes into contact with the conductive electrode foil. By adding , it is possible to easily check the characteristics even when electronic parts are attached.

Next, the present invention will be explained in more detail with reference to the drawings.

Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view thereof, and FIG. 3 is a plan view of the tape portion. For example, a conductive foil 3 made of copper foil, for example, is adhered to one surface of the insulating tape 2 made of paper, depending on the shape of the external lead 5 of the chip-type electronic component 1 to be attached. This conductive foil 3 is an external lead 5
It extends outward from the tape, and has end portions 4 and 6 with wide areas at both ends to facilitate contact with the external lead 5 and the probe of the characteristic testing device. There is. A positioning member 8 made of an insulator and having an external lead insertion groove is provided near the mounting portion of the electronic component 1, and a wall portion 7 and a lid portion 9 on the outer periphery of the positioning member 8 protect the electronic component 1.
The electronic component 1 has a positioning member 8 for positioning the external lead 5.
It can be fixed by inserting it into the groove, or it can be fixed by lowering the lid part 9 so that the external lead 5 does not come out from the groove, although it is not fixed by the groove. Note that when the external lead 5 is fixed in the groove 9, the wall portion 7 and the lid portion 9 may be omitted.

To check the characteristics of the electronic component 1 mounted on the strip-shaped storage device, the probe of the characteristic testing device is applied to the end 6 of the conductive foil 3, and pressure is applied to the external lead-out lead 5 to lead it out to the outside. Lead 5 and conductive foil 3
The characteristic test can be performed by bringing the end portion 4 of the In this way, the characteristics can be tested while the electronic component 1 is stored in the strip-shaped storage device, so there is no need to take out the electronic component for the characteristic test, which is extremely easy. Furthermore, mechanical mounting on a hybrid integrated circuit board can be easily performed.

Incidentally, if an adhesive is applied to the attachment portion of the electronic component 1 body of the tape 2, the positioning member 8, wall portion 7, and lid portion 9 can all be omitted. Furthermore, it is clear that the shape of the conductive foil 3 can be changed as appropriate. It is also clear that applicable electronic components are not limited to chip type. As described above, it is clear that the present invention is not limited to the embodiments and can be modified as appropriate.

[Brief explanation of the drawing]

Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view thereof, and FIG. 3 is a plan view of the tape portion. 1... Electronic component, 2... Tape, 3... Conductive foil, 4, 6... End, 5... External lead, 7
...Wall part, 8...Positioning member, 9...Lid part.

Claims (1)

[Scope of utility model registration request] 1. A band-shaped storage device for electronic components, characterized in that a conductive foil is provided in a portion corresponding to an external lead-out lead of an electronic component to which a tape having an electronic component mounting structure is attached, in correspondence with the external lead-out lead.