GB8615987D0 - Support for semiconductor parts - Google Patents

Support for semiconductor parts

Info

Publication number
GB8615987D0
GB8615987D0 GB868615987A GB8615987A GB8615987D0 GB 8615987 D0 GB8615987 D0 GB 8615987D0 GB 868615987 A GB868615987 A GB 868615987A GB 8615987 A GB8615987 A GB 8615987A GB 8615987 D0 GB8615987 D0 GB 8615987D0
Authority
GB
United Kingdom
Prior art keywords
support
semiconductor parts
semiconductor
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB868615987A
Other versions
GB2177060B (en
GB2177060A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of GB8615987D0 publication Critical patent/GB8615987D0/en
Publication of GB2177060A publication Critical patent/GB2177060A/en
Application granted granted Critical
Publication of GB2177060B publication Critical patent/GB2177060B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
GB08615987A 1983-05-26 1986-07-01 Support for semiconductor parts Expired GB2177060B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9266783A JPS59217399A (en) 1983-05-26 1983-05-26 Tape for taping semiconductor part

Publications (3)

Publication Number Publication Date
GB8615987D0 true GB8615987D0 (en) 1986-08-06
GB2177060A GB2177060A (en) 1987-01-14
GB2177060B GB2177060B (en) 1987-12-09

Family

ID=14060825

Family Applications (2)

Application Number Title Priority Date Filing Date
GB08413034A Expired GB2140383B (en) 1983-05-26 1984-05-22 Semiconductor part-carrying tape
GB08615987A Expired GB2177060B (en) 1983-05-26 1986-07-01 Support for semiconductor parts

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB08413034A Expired GB2140383B (en) 1983-05-26 1984-05-22 Semiconductor part-carrying tape

Country Status (2)

Country Link
JP (1) JPS59217399A (en)
GB (2) GB2140383B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151896A (en) * 1984-08-21 1986-03-14 株式会社村田製作所 Electronic part series
JPH0239968Y2 (en) * 1984-12-24 1990-10-25
US4708901A (en) * 1985-09-20 1987-11-24 Gerber Scientific Products, Inc. Coded web and associated web handling and working machine
NL8503063A (en) * 1985-11-08 1987-06-01 Philips Nv TIRE PACKAGING FOR ELECTRICAL AND / OR ELECTRONIC COMPONENTS.
GB2184098B (en) * 1985-12-13 1989-11-29 Gerber Scient Inc Web loading and feeding system
JPS63131970U (en) * 1986-09-03 1988-08-29
JPH0199974A (en) * 1987-09-30 1989-04-18 Nec Corp Taping of semiconductor device
EP0321961B1 (en) * 1987-12-23 1992-08-12 Siemens Aktiengesellschaft Process for taping tuning diodes with a fluent transition of the capacitor synchronization groups
JPH0216763U (en) * 1988-07-20 1990-02-02
US6779726B1 (en) 1999-11-03 2004-08-24 Solectron Corporation Method and apparatus for controlling a production operation using printed information on a component tape
DE102010049857A1 (en) * 2010-09-16 2012-03-22 Osram Opto Semiconductors Gmbh Method for assembling LEDs in a packaging unit and packaging unit with a plurality of LEDs

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB755596A (en) * 1953-11-13 1956-08-22 Erie Resistor Corp Improvements in the packaging of electrical condensers
JPS5112661A (en) * 1974-07-22 1976-01-31 Tdk Electronics Co Ltd Kondensaoyobisono seizohoho
FR2452856A1 (en) * 1979-03-28 1980-10-24 Europ Composants Electron COMPONENT PACKAGING MEDIUM AND MANUFACTURING METHOD USING THE SAME

Also Published As

Publication number Publication date
GB8413034D0 (en) 1984-06-27
GB2177060B (en) 1987-12-09
GB2140383A (en) 1984-11-28
GB2140383B (en) 1987-12-02
JPS59217399A (en) 1984-12-07
GB2177060A (en) 1987-01-14

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19980522