JPS6332955A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS6332955A JPS6332955A JP17600386A JP17600386A JPS6332955A JP S6332955 A JPS6332955 A JP S6332955A JP 17600386 A JP17600386 A JP 17600386A JP 17600386 A JP17600386 A JP 17600386A JP S6332955 A JPS6332955 A JP S6332955A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- handler
- type
- recesses
- guided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 4
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 238000003860 storage Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 235000020339 pu-erh tea Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は樹脂封止型プーアルインラインパッケージ半導
体集積回路装置の外部形状に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the external shape of a resin-sealed Pu-erh in-line package semiconductor integrated circuit device.
樹脂封止型デュアルインラインパッケージ半導体集積回
路装置（以下ＩＣと称す）は、外部リー６００ｍ１／の
３種類があシ、ＩＣの製造工程あるいは流通に使用され
る設備や収納ケースは、この大きさを基本として設計、
製作されていた。第２図（ａｌ 、 （ｂ）に３００ｍ
１ｌと６００ｍ１ｌのものを示す。Resin-sealed dual in-line package semiconductor integrated circuit devices (hereinafter referred to as ICs) come in three types with an external lead of 600m1/cm, and the equipment and storage cases used in the IC manufacturing process or distribution must be of this size. Designed as a basic,
It was being produced. 300m in Figure 2 (al, (b))
1l and 600ml are shown.
前述した３種類のＩＣの製造工程中に於ける運搬や流通
に使用される収納ケース及び電気的特性試験に使用され
るハンドラは、ＩＣの樹脂部やリード部を支え、あるい
はガイドする事によりＩＣの試験ヘッドへの供給、排出
、更には収納が行なわれていた。この事はＩＣの大きさ
が異なる為にハンドラや収納ケースをＩＣの大きさに合
せて設計、製作し、使用する事を意味し、結果として、
前記３種類のＩＣに使用するハンドラや収納ケースは各
々別の種類のものとなり、共通性がなく、生産に於ける
７レキシビリテイがないという欠点を有する。The storage cases used for transportation and distribution during the manufacturing process of the three types of ICs mentioned above, and the handlers used for electrical characteristic tests, are used to support or guide the resin and lead parts of ICs. was being supplied to the test head, discharged, and even stored. This means that the handler and storage case must be designed, manufactured, and used according to the size of the IC because the size of the IC is different, and as a result,
The handlers and storage cases used for the three types of ICs are of different types, have no commonality, and have the disadvantage of lacking flexibility in production.
本発明のＩＣは、封止樹脂の裏面に１つあるい大きい４
００ｍ１Ｊ、 ６００ｍ輩（Ｄ Ｉ Ｃに同一位置２寸
法で設はハンドラーや収納マガジンのガイドやレールを
凹部に合せる事によシエＣの位置を定める。The IC of the present invention may be one or four large ICs on the back side of the sealing resin.
00m1J, 600m (DIC) Determine the position of Sheet C by aligning the guides and rails of the handler and storage magazine with the recesses.
以上の方法によシ、ハンドラー、マガジンに共用性を持
たせようとするものである。The method described above is intended to provide common use to the handler, handler, and magazine.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す図である。１は封止樹
脂、２，３は外部リード、４，５は本発明による樹脂部
に設けられた凹部である。FIG. 1 is a diagram showing an embodiment of the present invention. 1 is a sealing resin, 2 and 3 are external leads, and 4 and 5 are recesses provided in the resin part according to the present invention.
第３図（ａ）は３００ｍ１ｌタイプのＩＣがハンドラに
装着された図、第３図（ｂ）は本発明による６００ｍ１
ｌタイプのＩＣがハンドラに装着された図である。Figure 3(a) is a diagram of a 300ml type IC installed on a handler, and Figure 3(b) is a diagram of a 600ml type IC according to the present invention.
FIG. 2 is a diagram showing an L type IC mounted on a handler.
第３図（ａ）に於て３００ｍ１ｌタイプのＩＣは樹脂表
面側をハンドラの溝６によシ支見られ裏面側をレール７
によシガイドされる事によシ、流れ操作が行なわれる。In Fig. 3(a), the 300ml type IC is supported by the groove 6 of the handler on the resin surface side and the rail 7 on the back side.
Flow operation is performed by being guided by the flow.
第３図（ｂ）に於て６００ｍ１ｌタイプのＩＣは樹脂裏
面側に設けられた凹部に前記３００ｍ１ｌで用いたハン
ドラのレール凸部が入る事によシガイドされる事によυ
流れ操作が行なわれる。図に於ては二つの凹部及びハン
ドラについて説明したが、凹部の大きさ及びレールの構
造を考慮する事により一つの凹部でも実施可能であり、
又収納マガジンについても同様に実施可能である。In Fig. 3(b), the 600ml type IC is guided by the rail protrusion of the handler used in the 300ml type inserted into the recess provided on the back side of the resin.
Flow manipulation is performed. In the figure, two recesses and a handler are explained, but it is also possible to implement with one recess by considering the size of the recess and the structure of the rail.
Further, the same can be applied to storage magazines.
以上説明した如く、本発明は樹脂部に設けた凹部をガイ
ド用の穴として用いる事によ、！ｌ） ３００ｍ１４４
００ｍ１ｌ、 ６００ｍｉ／の３種類のＩＣを一ツノタ
イプのハンドラあるいはマガジンを用いる事が出来、共
用性を確保出来る効果がある。As explained above, the present invention uses the recess provided in the resin part as a guide hole. l) 300m144
Three types of ICs, 00ml and 600mi/, can be used in one horn type handler or magazine, which has the effect of ensuring common use.
第１図は本発明の一実施例を示す断面図、第２図（ａ）
、 （ｂ）は大々従来の断面図、第３図（ａｌ 、
（ｂ）は夫夫本発明によるＩＣ取扱い状態図である。
１・・・・・・封止樹脂、２，３・・・・・・外部リー
ド、４゜５・・・・・・封止樹脂に設けられた凹部、６
・・・・・・・・ンドラに設けられた溝、７・・・・・
・ハンドラレール。
代理人 弁理士 内 原 晋 ″。
第１図
第２図Figure 1 is a sectional view showing one embodiment of the present invention, Figure 2 (a)
, (b) is a conventional cross-sectional view, and Fig. 3 (al,
(b) is a diagram showing how the IC is handled according to the present invention. 1...Sealing resin, 2, 3...External lead, 4゜5...Recess provided in sealing resin, 6
・・・・・・Groove provided in the roller, 7・・・・・・
・Handler rail. Agent: Susumu Uchihara, patent attorney. Figure 1 Figure 2
Claims (1)
回路装置に於て、外部引出しリードが並んだ方向に並行
に封止樹脂に１つ又は複数本の溝が設けられていること
を特徴とする半導体集積回路装置。A semiconductor integrated circuit device in a resin-sealed dual-in-line package, characterized in that one or more grooves are provided in the sealing resin in parallel to the direction in which the external lead leads are lined up. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17600386A JPS6332955A (en) | 1986-07-25 | 1986-07-25 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17600386A JPS6332955A (en) | 1986-07-25 | 1986-07-25 | Semiconductor integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6332955A true JPS6332955A (en) | 1988-02-12 |
Family
ID=16006010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17600386A Pending JPS6332955A (en) | 1986-07-25 | 1986-07-25 | Semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6332955A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5195023A (en) * | 1991-12-23 | 1993-03-16 | At&T Bell Laboratories | Integrated circuit package with strain relief grooves |
| US5777382A (en) * | 1995-12-19 | 1998-07-07 | Texas Instruments Incorporated | Plastic packaging for a surface mounted integrated circuit |
-
1986
- 1986-07-25 JP JP17600386A patent/JPS6332955A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5195023A (en) * | 1991-12-23 | 1993-03-16 | At&T Bell Laboratories | Integrated circuit package with strain relief grooves |
| US5777382A (en) * | 1995-12-19 | 1998-07-07 | Texas Instruments Incorporated | Plastic packaging for a surface mounted integrated circuit |
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