JPS59210690A - Method of producing metal plate base printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method for manufacturing a flexible printed wiring board based on a metal plate.

[Background Art 1 As a flexible printed wiring board based on a metal plate, the one shown in Fig. 2 has been used conventionally, and the one shown in Fig. 1 (a) and (b) It was manufactured by That is, a copper foil (101"i) is pasted on one side of the 3D film (8) through insulation/alt91't-, and an electric circuit is formed by etching on this copper foil (lO), and on the other hand, an aluminum plate or a steel plate is attached. A copper foil Q is placed on one side of a metal plate (11) such as
o) For k pasting, an electric circuit is formed by molding and etching on this copper foil (lO), and these are then covered with an insulating layer (9).
) and is integrally molded with adhesive. However, in this case, forming and etching the copper foil on the three-dimensional film (8), forming and etching the copper foil (1) on the metal plate (Ill), and forming the integrated lamination of these layers are required. This requires a large number of man-hours and is time-consuming, and in addition, the copper foil circuit provided on the three-dimensional film (8) and the copper foil circuit provided on the metal plate (1) must be laminated and integrated while accurately aligning them. There is always a problem that molding becomes difficult.

[Object of the Invention] The present invention has been made in view of the above points, and provides a method for manufacturing a metal plate-based printed wiring board that can be manufactured at once, by molding and etching, and can be manufactured easily. The purpose is to provide law.

DISCLOSURE OF THE INVENTION] However, the method for manufacturing a metal plate-based printed wiring board according to the present invention includes an electrically insulating resin layer (2) on one side of a copper-based metal plate (1).
), the copper-based metal foil (3) is bonded and integrated, and the etching resist (4) is applied to the entire circuit pattern on the surface of the copper-based metal foil (3) and the surface of the copper-based metal plate (1), and then etched. By doing this, an electric circuit (5) is attached to the copper-based metal foil (3).
) At the same time as forming the electric circuit (6) on the copper-based metal plate +1.1, the portion of the electrically insulating resin layer (2) to be bent is exposed at the portion between the electric circuit +61 and +6+. The above object is achieved by this configuration, and will be explained in detail below using an example of an unexploded 1311m.

First, as shown in Figure 3(a), a thermosetting resin such as epoxy resin is applied to one side of a copper-based metal plate (1), such as a copper alloy plate (typical examples of which are a copper plate or a brass plate), and then a copper foil is applied. By stacking and press-molding the copper-based metal foils (3), the copper-based metal scrap 1 foil (3) is fully laminated and integrated with the copper-based metal plate +11 via the electrically insulating resin layer (2). Here, the thickness of the copper-based metal plate fi+ is set to, for example, about 1 μm in order to maintain the strength as a board, and the thickness of the electrically insulating resin layer +21 is set to about 100 μm, for example, and the copper-based metal foil (3 )
The thickness is set to, for example, about 35μ. Then, as shown in FIG. 5(b), etching resist 4) is completely applied to the surface of the copper-based metal foil (3) and the surface of the copper-based metal plate +11 in a circuit pattern at the portions that will become circuits, respectively. By immersing the copper-based metal foil (3) and the copper-based metal plate (11) in an etching solution and performing an etch-shield process, the parts of the copper-based metal foil (3) and the copper-based metal plate (11) that are not covered with the etch-shield resist (4) are etch-removed. Cyst (4)
By removing the electrical circuits (5) and (6) formed by the copper-based metal foil (3) and the copper-based metal plate fi+, as shown in FIG. It is possible to obtain a metal plate-based printed wiring board formed on both the front and back sides. Here, since the copper-based metal plate (1) is copper-based and has excellent electrical conductivity, it is possible to form the copper-based metal plate ill itself into the electric circuit (6).
For example, this electric circuit (61) can be used as a ground, etc., and when connecting electric circuits (5) and (6), press a through hole so that it spans the electric circuits (5) and (6). The electrically insulating resin layer (2) may be bent to form a flexible printed wiring board when used as a flexible printed wiring board. The copper-based metal plate (1) is etched away at the bent part of the electrically insulating resin layer (2), so that this part becomes the part between the electrical circuits (6). As shown in the figure, the electrically insulating resin layer N(2) acts as a flexible film and can be used as a flexible metal plate-based printed wiring board, instead of using conventional expensive polyimide films. It is possible to reduce costs by not using .

[Effects of the Invention] As described above, according to the present invention, forming is only required once when laminating the copper-based metal sheet onto the copper-based metal foil, and the etchshita treatment is performed on the copper-based metal foil and the copper-based metal sheet. Etching can be done at the same time, requiring only one etching, and furthermore, the electrical circuit formed using the copper-based metal foil and the electrical circuit formed using the copper-based metal plate can be easily and accurately aligned using the printed pattern of the etch resist. As a result, a metal plate-based lint wiring board can be manufactured with fewer steps and easier work.

[Brief explanation of the drawing]

Figures 1 (a) and (b) are cross-sectional views showing the production of conventional metal plate-based lint wiring boards, Figure 2 is a cross-sectional view of the same wiring board, and Figures 5 (a), (b), and (c). FIG. 4 is a cross-sectional view showing the manufacture of a gold peach board-based printed wiring board according to the present invention, and FIG. 4 is a cross-sectional view of the same wiring board. +11 is a copper metal plate, (2) is an electrically insulating resin layer, (3)
is copper-based metal foil, (4) is etching resist, (5),
(6) is an electric circuit. Agent Patent Attorney Ishi 1) Chief 7Figure 1Figure 2Figure 3Figure 4

Claims (1)

[Claims] fil A copper-based metal foil is bonded and integrated on one side of a copper-based metal plate via an electrically insulating resin layer, and an etching resist is applied to the surface of the copper-based metal foil and the surface of the copper-based metal plate in circuit J~ turns. By performing etching, an electric circuit is formed on the copper-based metal foil, and an electric circuit is formed on the copper-based metal plate, and the portions of the electrically insulating resin layer to be bent are exposed between the electric circuits. A method for manufacturing a metal plate paste printed wiring board characterized by: