CN219124435U

CN219124435U - Rigid-flex printed circuit board and electronic device

Info

Publication number: CN219124435U
Application number: CN202320079101.7U
Authority: CN
Inventors: 林运; 邓先友; 刘金峰; 周尚松; 张河根; 向付羽; 张贤仕; 李寿义
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2023-01-10
Filing date: 2023-01-10
Publication date: 2023-06-02
Anticipated expiration: 2033-01-10

Abstract

The utility model discloses a rigid-flex printed circuit board and an electronic device. The rigid-flex board comprises a flexible board and a first rigid board; one side of the flexible plate is provided with a golden finger, the first rigid plate and one side of the flexible plate with the golden finger are attached, and the first rigid plate covers part of the area of the golden finger. Through the mode, the utility model can meet the requirements of thin and hard products and space application scenes.

Description

Rigid-flex printed circuit board and electronic device

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a rigid-flex printed circuit board and an electronic device.

Background

Aiming at the golden finger processing technology of the existing rigid-flex printed circuit board, a cover film is required to be added at the position of a golden finger lead, so that the PCBA can be conveniently assembled, bent and plugged on line, but the requirement of reducing the weight of terminal electronic products and industrial equipment is met, so that the existing rigid-flex printed circuit board cannot meet the requirement of increasingly reducing the use space of the products.

Disclosure of Invention

The utility model mainly solves the technical problem of providing a rigid-flex printed circuit board and an electronic device so as to meet the requirements of thin and hard products and simultaneously consider space application scenes.

In order to solve the technical problems, the technical scheme adopted by the utility model is to provide the rigid-flex board, which comprises a flexible board and a first rigid board; one side of the flexible plate is provided with a golden finger, the first rigid plate and one side of the flexible plate with the golden finger are attached, and the first rigid plate covers part of the area of the golden finger.

The first rigid plate and the flexible plate are adhered and fixed through a first adhesive layer, and a part of the golden finger covered by the first rigid plate is embedded into the first adhesive layer.

Wherein the length of the partial area of the golden finger covered by the first rigid plate is 0.15mm-0.3mm.

The flexible plate comprises a flexible substrate and a circuit layer attached to at least one side of the flexible substrate, and the golden finger is fixed with the flexible substrate in a pressing mode through the pressing layer.

Wherein, the lamination layer is BT25 pure glue.

Wherein the thickness of the flexible substrate is 2-4mil.

Wherein, the rigid-flex board further comprises a second rigid board; the second rigid plate is attached to the other side, far away from the golden finger, of the flexible plate.

The second rigid plate and the flexible plate are bonded and fixed through a second bonding layer; the first rigid plate and the second rigid plate comprise a rigid substrate and a circuit layer attached to at least one side of the rigid substrate.

And the rigid-flex printed circuit board is also provided with at least one via hole, and the at least one via hole is connected with each circuit layer in the rigid-flex printed circuit board so as to realize the in-board interconnection of the rigid-flex printed circuit board.

In order to solve the technical problem, another technical scheme adopted by the utility model is to provide an electronic device, wherein the electronic device comprises any rigid-flex board.

The beneficial effects of the utility model are as follows: the rigid-flex board of the present utility model includes a flexible board and a first rigid board, different from the prior art; one side of the flexible plate is provided with a golden finger, the first rigid plate is attached to one side of the flexible plate, which is provided with the golden finger, and the first rigid plate covers part of the region of the golden finger. Through shortening the distance between the golden finger and the rigid plate area, the first rigid plate covers part of the golden finger, so that the golden finger is embedded into the rigid plate area, and the golden finger and the first rigid plate form a step structure for matching with an assembly, so that the rigid-flex printed circuit board has the characteristics of compact structure, small occupied space, thin and hard structure and high reliability, and space between plate layers can be effectively saved, and mass production can be realized.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:

fig. 1 is a schematic structural diagram of an embodiment of a rigid-flex board according to the present utility model.

Detailed Description

The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

It will also be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a flex-rigid board according to the present utility model. In this embodiment, the rigid-flex board 10 includes a flexible board 100 and a first rigid board 101; the golden finger 103 is arranged on one side of the flexible plate 100, the first rigid plate 101 is attached to one side of the flexible plate 100 with the golden finger 103, and the first rigid plate 101 covers part of the region of the golden finger 103.

It will be appreciated that, as shown in fig. 1, since the first rigid board 101 is disposed in a manner of being attached to the flexible board 100, the first rigid board 101 covers a part of the area of the flexible board 100, so that the flexible board 10 has a rigid board area and a flexible board area, where the rigid board area is an area covered by the first rigid board 101, the flexible board area is an area uncovered by the first rigid board 101, and the flexible board area is similar to the tail of the flexible board 10 flying out. The first rigid board 101 covers a part of the area of the golden finger 103, that is to say, the golden finger 103 is arranged in the flexible board area, and the golden finger 103 extends to the rigid board area, that is, the golden finger 103 is arranged in the tail flying area of the structure of the rigid-flex board 10, so that the distance from the golden finger 103 to the rigid board area is shortened, and the covering film flow in the existing scheme can be canceled.

According to the scheme, the first rigid plate 101 is covered on a part of the region of the golden finger 103 by shortening the distance from the golden finger 103 to the rigid plate region, so that the golden finger 103 is embedded into the rigid plate region, and the golden finger 103 and the first rigid plate 101 form a step structure for matching with an assembly, so that the rigid-flex printed circuit board 10 has the characteristics of compact structure, small occupied space, thin and hard design and high reliability, and the requirements that the existing rigid-flex printed circuit board 10 cannot be simultaneously thinned and hardened and plugged in and pulled out in a limited space can be solved; in addition, the space between the plate layers can be effectively saved, and the plate can be produced in a large scale.

Further, the first rigid board 101 and the flexible board 100 are bonded and fixed by the first adhesive layer 104, and a part of the region of the golden finger 103 covered by the first rigid board 101 is embedded in the first adhesive layer 104. The first adhesive layer 104 may be in a sheet shape, for example, a prepreg, wherein the first adhesive layer 104 may be a PP sheet made of PP (polypropylene) material.

Further, the length of the partial region of the gold finger 103 covered by the first rigid plate member 101 is 0.15mm to 0.3mm. In the structural design of the flex-rigid board 10, the golden finger 103 is embedded into the rigid board area, so that the structure of the flexible board area becomes thin and hard, the insertion and extraction operation between the golden finger 103 and the assembly of the flex-rigid board 10 is facilitated, and the space is saved. The depth of embedding the gold finger 103 into the rigid plate area may be set between 0.15mm and 0.3mm, for example, may be 0.15mm, 0.18mm, 0.2mm, 0.25mm, 0.3mm, etc., without limitation.

In an embodiment, the flexible board 100 includes a flexible substrate 1000 and a circuit layer 1001 attached to at least one side of the flexible substrate 1000, and the gold finger 103 is pressed and fixed with the flexible substrate 1000 through the pressing layer 105. The flexible substrate 1000 may be PI polyimide or other flexible dielectric layer. The circuit layer 1001 in this embodiment of the present application may be a copper layer, an aluminum layer, a gold layer, a silver layer, an alloy layer, or other circuit layers, which is not limited herein. In a specific application scenario, a circuit layer 1001 is attached to one side of the flexible substrate 1000. In another specific application scenario, two sides of the flexible substrate 1000 are respectively bonded to a circuit layer 1001. Specifically, the setting can be performed based on the preparation requirement of the rigid-flex board 10.

Further, the lamination layer 105 is BT25 pure glue. Specifically, in the manufacturing process, the back of the golden finger 103 is bonded with the flexible substrate 1000 through BT25 pure glue in a pressing manner, the reinforcement sheet is formed after the bonding, then the first rigid plate 101 is bonded to the flexible plate 100 through the first bonding layer 104, and when the first bonding layer 104 and the first rigid plate 101 cover part of the region of the golden finger 103 during the bonding, the golden finger 103 is embedded into the first bonding layer 104, and then the first bonding layer 104 is shaped through the bonding and other modes, so as to realize the bonding and fixing between the first rigid plate 101 and the flexible plate 100. In one embodiment, the thickness of the flexible substrate 1000 is 2-4 mils, such as 2 mils, 2.4 mils, 2.8 mils, 3 mils, 3.4 mils, 3.5 mils, 4 mils, etc., and may be specifically configured as desired.

In one embodiment, the rigid-flex board 10 further includes a second rigid board 102; the second rigid plate 102 is attached to the other side of the flexible plate 100 away from the golden finger 103.

Further, the second rigid board 102 and the flexible board 100 are adhered and fixed through the second adhesive layer 106; each of the first rigid board 101 and the second rigid board 102 includes a rigid substrate 1010 and a circuit layer 1001 attached to at least one side of the rigid substrate 1010. The rigid substrate 1010 may be a flame-resistant material, which is a composite material of epoxy and glass fiber, and has a rating of FR-4. The second adhesive layer 106 may be in a sheet shape, for example, a prepreg, wherein the second adhesive layer 106 may be a PP sheet made of PP material.

Further, at least one via hole 107 is further provided on the flex-rigid board 10, and the at least one via hole 107 is connected to each circuit layer 1001 in the flex-rigid board 10, so as to realize the in-board interconnection of the flex-rigid board 10. The via hole 107 may be interconnected with the multi-layer circuit layer 1001 in the flex-rigid board 10 by copper plating or the like, for example, the via hole 107 may be connected with the circuit layer 1001 including the first rigid board 101 and the circuit layer 1001 including the second rigid board 102, and may also be connected with the circuit layer 1001 of the flexible board 100.

In other embodiments, the flex-rigid board 10 may further include a solder mask (not shown) disposed on two sides of the flex-rigid board 10, wherein the solder mask may expose pads on the circuit layer 1001 on two opposite sides of the flex-rigid board 10 or circuits that need to be externally connected, and cover the circuits that do not need to be externally connected, so as to insulate and protect the flex-rigid board 10 from stress.

The utility model also provides an electronic device (not shown) comprising any of the rigid-flex boards 10 described above. According to the rigid-flex printed circuit board 10 in the electronic device, the first rigid plate 101 covers part of the region of the golden finger 103 by shortening the distance from the golden finger 103 to the rigid plate region, so that the golden finger 103 is embedded into the rigid plate region, and the golden finger 103 and the first rigid plate 101 form a step structure for matching with an assembly, so that the rigid-flex printed circuit board 10 has the characteristics of compact structure, small occupied space, thin and hard design and high reliability, and the requirements that the structure of the traditional rigid-flex printed circuit board 10 cannot be simultaneously thinned and hardened and the limited space is required to be plugged and unplugged can be solved; in addition, the space between the plate layers can be effectively saved, and the plate can be produced in a large scale.

It should be noted that in this application relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.

The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent principle changes made by the specification and the drawings of the present application, or direct or indirect application in other related technical fields, are included in the scope of the patent protection of the present application.

Claims

1. The rigid-flex board is characterized by comprising a flexible board and a first rigid board; one side of the flexible plate is provided with a golden finger, the first rigid plate and one side of the flexible plate with the golden finger are attached, and the first rigid plate covers part of the area of the golden finger.

2. The rigid-flex board according to claim 1, wherein said first rigid plate member and said flexible plate member are bonded and fixed by a first adhesive layer, and a partial area of said gold finger covered by said first rigid plate member is embedded in said first adhesive layer.

3. The rigid-flex board according to claim 2, wherein a length of a partial area of said gold finger covered by said first rigid plate member is 0.15mm to 0.3mm.

4. The flex-rigid board according to claim 1, wherein the flexible board comprises a flexible substrate and a circuit layer attached to at least one side of the flexible substrate, and the golden finger is pressed and fixed with the flexible substrate through the pressing layer.

5. The flex-rigid board according to claim 4, wherein said bonding layer is BT25 pure glue.

6. The rigid-flex board of claim 4, wherein said flexible substrate has a thickness of 2-4 mils.

7. The rigid-flex board of claim 4, wherein said rigid-flex board further comprises a second rigid plate member; the second rigid plate is attached to the other side, far away from the golden finger, of the flexible plate.

8. The rigid-flex board according to claim 7, wherein said second rigid board and said flexible board are bonded and fixed by a second bonding layer;

the first rigid plate and the second rigid plate comprise a rigid substrate and a circuit layer attached to at least one side of the rigid substrate.

9. The flex-rigid board according to claim 8, wherein at least one via hole is further provided on the flex-rigid board, and the at least one via hole connects each circuit layer in the flex-rigid board to realize in-board interconnection of the flex-rigid board.

10. An electronic device, characterized in that it comprises a rigid-flex board according to any of claims 1-9.