JPS59209475A - 噴流式半田付装置 - Google Patents

噴流式半田付装置

Info

Publication number
JPS59209475A
JPS59209475A JP59076092A JP7609284A JPS59209475A JP S59209475 A JPS59209475 A JP S59209475A JP 59076092 A JP59076092 A JP 59076092A JP 7609284 A JP7609284 A JP 7609284A JP S59209475 A JPS59209475 A JP S59209475A
Authority
JP
Japan
Prior art keywords
solder
soldering device
guide plate
jet
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59076092A
Other languages
English (en)
Japanese (ja)
Other versions
JPS632704B2 (enExample
Inventor
Kiyoshi Shirakawa
白川　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59076092A priority Critical patent/JPS59209475A/ja
Publication of JPS59209475A publication Critical patent/JPS59209475A/ja
Publication of JPS632704B2 publication Critical patent/JPS632704B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP59076092A 1984-04-16 1984-04-16 噴流式半田付装置 Granted JPS59209475A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59076092A JPS59209475A (ja) 1984-04-16 1984-04-16 噴流式半田付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59076092A JPS59209475A (ja) 1984-04-16 1984-04-16 噴流式半田付装置

Publications (2)

Publication Number Publication Date
JPS59209475A true JPS59209475A (ja) 1984-11-28
JPS632704B2 JPS632704B2 (enExample) 1988-01-20

Family

ID=13595196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59076092A Granted JPS59209475A (ja) 1984-04-16 1984-04-16 噴流式半田付装置

Country Status (1)

Country Link
JP (1) JPS59209475A (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52127263U (enExample) * 1976-03-24 1977-09-28
JPS54139028U (enExample) * 1978-03-16 1979-09-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52127263U (enExample) * 1976-03-24 1977-09-28
JPS54139028U (enExample) * 1978-03-16 1979-09-27

Also Published As

Publication number Publication date
JPS632704B2 (enExample) 1988-01-20

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