JPS59208860A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS59208860A
JPS59208860A JP8274183A JP8274183A JPS59208860A JP S59208860 A JPS59208860 A JP S59208860A JP 8274183 A JP8274183 A JP 8274183A JP 8274183 A JP8274183 A JP 8274183A JP S59208860 A JPS59208860 A JP S59208860A
Authority
JP
Japan
Prior art keywords
alloy
adsorbent
mg
consisting
hydrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8274183A
Inventor
Masamichi Ishihara
Kazumichi Mitsusada
Takayuki Okinaga
Kanji Otsuka
Hiroshi Ozaki
Original Assignee
Hitachi Ltd
Hitachi Micro Comput Eng Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Micro Comput Eng Ltd filed Critical Hitachi Ltd
Priority to JP8274183A priority Critical patent/JPS59208860A/en
Publication of JPS59208860A publication Critical patent/JPS59208860A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE:To remove defective factors, such as H2, H2O, etc. having an adverse effect on a semiconductor device by incorporating an adsorbent into the cavity of a semiconductor package. CONSTITUTION:A metallized layer 7 consisting of an Mg group alloy as a hydrogen adsorbent is formed on the back, the cavity side, of a cap 1 for a cerdip type semiconductor package, and a porous alumina layer 8 as a moisture adsorbent is formed to one part on the surface of the metallized layer 7. It is desirable that the Mg group alloy, such as an alloy consisting of Mg and Ni, an alloy consisting of Mg and Cu or the like is used as the hydrogen adsorbent employed. An alloy or a metal adsorbing hydrogen, such as a Pd metal, an LaCo alloy or the like may be used as other metals or alloys.
JP8274183A 1983-05-13 1983-05-13 Semiconductor device Pending JPS59208860A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8274183A JPS59208860A (en) 1983-05-13 1983-05-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8274183A JPS59208860A (en) 1983-05-13 1983-05-13 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS59208860A true JPS59208860A (en) 1984-11-27

Family

ID=13782837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8274183A Pending JPS59208860A (en) 1983-05-13 1983-05-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS59208860A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0472866A2 (en) * 1990-07-23 1992-03-04 National Semiconductor Corporation Ferroelectric device packaging techniques
US5491361A (en) * 1994-10-14 1996-02-13 The Aerospace Corporation Hydrogen out venting electronic package
JPH0878445A (en) * 1994-09-02 1996-03-22 Tomoegawa Paper Co Ltd Hermetically sealed package and its manufacture
EP0707360A1 (en) * 1994-10-11 1996-04-17 Corning Incorporated Impurity getters in laser enclosures
EP0837502A2 (en) * 1996-10-15 1998-04-22 Texas Instruments Inc. Improvements in or relating to hydrogen gettering
US5770473A (en) * 1993-07-14 1998-06-23 Corning Incorporated Packaging of high power semiconductor lasers
EP0993047A1 (en) * 1998-10-06 2000-04-12 Philips Electronics N.V. Semiconductor device with elements of integrated circuits of III-V group and means to prevent the pollution by hydrogen

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0472866A2 (en) * 1990-07-23 1992-03-04 National Semiconductor Corporation Ferroelectric device packaging techniques
EP0472866A3 (en) * 1990-07-23 1994-09-07 Nat Semiconductor Corp Ferroelectric device packaging techniques
US5770473A (en) * 1993-07-14 1998-06-23 Corning Incorporated Packaging of high power semiconductor lasers
JPH0878445A (en) * 1994-09-02 1996-03-22 Tomoegawa Paper Co Ltd Hermetically sealed package and its manufacture
EP0707360A1 (en) * 1994-10-11 1996-04-17 Corning Incorporated Impurity getters in laser enclosures
US5491361A (en) * 1994-10-14 1996-02-13 The Aerospace Corporation Hydrogen out venting electronic package
EP0837502A2 (en) * 1996-10-15 1998-04-22 Texas Instruments Inc. Improvements in or relating to hydrogen gettering
EP0837502A3 (en) * 1996-10-15 2004-06-02 Texas Instruments Inc. Improvements in or relating to hydrogen gettering
US6958260B2 (en) 1996-10-15 2005-10-25 Texas Instruments Incorporated Hydrogen gettering system
EP0993047A1 (en) * 1998-10-06 2000-04-12 Philips Electronics N.V. Semiconductor device with elements of integrated circuits of III-V group and means to prevent the pollution by hydrogen
US6703701B2 (en) 1998-10-06 2004-03-09 Koninklijke Philips Electronics N.V. Semiconductor device with integrated circuit elements of group III-V comprising means for preventing pollution by hydrogen

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