JPS5920673U - thermal welding machine - Google Patents

thermal welding machine

Info

Publication number
JPS5920673U
JPS5920673U JP11579982U JP11579982U JPS5920673U JP S5920673 U JPS5920673 U JP S5920673U JP 11579982 U JP11579982 U JP 11579982U JP 11579982 U JP11579982 U JP 11579982U JP S5920673 U JPS5920673 U JP S5920673U
Authority
JP
Japan
Prior art keywords
welding machine
thermocompression
thermal welding
conductor pattern
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11579982U
Other languages
Japanese (ja)
Inventor
芳久 小林
利夫 鈴木
貞夫 井上
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP11579982U priority Critical patent/JPS5920673U/en
Publication of JPS5920673U publication Critical patent/JPS5920673U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はプリント基板の導体パターンと部品のリードと
の熱加圧チップによる接続を説明するための平面図、第
2図は第1図の断面図、第3図は本考案の一実施例によ
る熱加圧チップによる導体パターンとリードとの接続を
説明するための断面図、第4図は第3図の平面図を示す
。 図に於いて、1はプリント基板、2は導体パターン、4
はリード、5は熱加圧チップを夫々示す。
Figure 1 is a plan view for explaining the connection between the conductor pattern of a printed circuit board and the lead of a component using a heat-pressing chip, Figure 2 is a cross-sectional view of Figure 1, and Figure 3 is an embodiment of the present invention. FIG. 4 is a cross-sectional view for explaining the connection between a conductor pattern and a lead using a thermally pressurized chip, and FIG. 4 is a plan view of FIG. 3. In the figure, 1 is a printed circuit board, 2 is a conductor pattern, and 4 is a printed circuit board.
5 indicates a lead, and 5 indicates a heat-pressed chip, respectively.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板の導体パターンと部品のリードとを熱圧接
する熱加圧チップに回転軸を設け、導体パターンと部品
との仮付けの位置ずれを追従する構成としたことを特徴
とする熱圧接機。
A thermocompression welding machine characterized in that a rotary shaft is provided on a thermocompression chip that thermocompression welds a conductor pattern of a printed circuit board and a lead of a component, and is configured to follow misalignment during temporary bonding between the conductor pattern and the component.
JP11579982U 1982-07-30 1982-07-30 thermal welding machine Pending JPS5920673U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11579982U JPS5920673U (en) 1982-07-30 1982-07-30 thermal welding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11579982U JPS5920673U (en) 1982-07-30 1982-07-30 thermal welding machine

Publications (1)

Publication Number Publication Date
JPS5920673U true JPS5920673U (en) 1984-02-08

Family

ID=30267183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11579982U Pending JPS5920673U (en) 1982-07-30 1982-07-30 thermal welding machine

Country Status (1)

Country Link
JP (1) JPS5920673U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524448A (en) * 1978-08-09 1980-02-21 Fujitsu Ltd Junction head

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524448A (en) * 1978-08-09 1980-02-21 Fujitsu Ltd Junction head

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