JPS6018574U - Chip parts land - Google Patents

Chip parts land

Info

Publication number
JPS6018574U
JPS6018574U JP11021383U JP11021383U JPS6018574U JP S6018574 U JPS6018574 U JP S6018574U JP 11021383 U JP11021383 U JP 11021383U JP 11021383 U JP11021383 U JP 11021383U JP S6018574 U JPS6018574 U JP S6018574U
Authority
JP
Japan
Prior art keywords
chip component
chip parts
land
parts land
notches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11021383U
Other languages
Japanese (ja)
Inventor
清 内田
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP11021383U priority Critical patent/JPS6018574U/en
Publication of JPS6018574U publication Critical patent/JPS6018574U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のチップ部品ランド上にチップ部品を固定
した平面図、第２図は同側断面図、第３図は本考案の一
実施例によるチップ部品ランドの平面図、第４図は本考
案のチップ部品ランドにチップ部品を固定した平面図自
第５図は同側断面図である。 ２・・・パターン、３・・・チップ部品、４・・・チッ
プ部品接合部、６・・・チップ部品ランド。FIG. 1 is a plan view of a chip component fixed on a conventional chip component land, FIG. 2 is a sectional view of the same side, FIG. 3 is a plan view of a chip component land according to an embodiment of the present invention, and FIG. FIG. 5 is a plan view showing a chip component fixed to a chip component land according to the present invention. FIG. 5 is a sectional view of the same side. 2... Pattern, 3... Chip component, 4... Chip component joint, 6... Chip component land.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ部品を固定するために印刷配線板上に所定間隔で
対向して設けられるチップ部品ランドにおいて、チップ
部品と回申の切欠きを設けてコの字形に形成すると共に
、両切欠きの間隔をチップ部品の接合部間隔と一致させ
て対向配置したことを特徴としたチップ部品ランド。In a chip component land that is provided facing each other at a predetermined interval on a printed wiring board for fixing a chip component, notches for the chip component and the recirculation are provided to form a U-shape, and the spacing between both notches is A chip component land characterized by being arranged facing each other to match the spacing between the joints of the chip component.
JP11021383U 1983-07-18 1983-07-18 Chip parts land Pending JPS6018574U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11021383U JPS6018574U (en) 1983-07-18 1983-07-18 Chip parts land

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11021383U JPS6018574U (en) 1983-07-18 1983-07-18 Chip parts land

Publications (1)

Publication Number Publication Date
JPS6018574U true JPS6018574U (en) 1985-02-07

Family

ID=30256419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11021383U Pending JPS6018574U (en) 1983-07-18 1983-07-18 Chip parts land

Country Status (1)

Country Link
JP (1) JPS6018574U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612378B2 (en) * 1977-10-05 1981-03-20
JPS5638895A (en) * 1979-09-07 1981-04-14 Hitachi Ltd Method of mounting ceramic chip element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612378B2 (en) * 1977-10-05 1981-03-20
JPS5638895A (en) * 1979-09-07 1981-04-14 Hitachi Ltd Method of mounting ceramic chip element

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