JPS59205742A - 半導体冷却装置 - Google Patents
半導体冷却装置Info
- Publication number
- JPS59205742A JPS59205742A JP8188783A JP8188783A JPS59205742A JP S59205742 A JPS59205742 A JP S59205742A JP 8188783 A JP8188783 A JP 8188783A JP 8188783 A JP8188783 A JP 8188783A JP S59205742 A JPS59205742 A JP S59205742A
- Authority
- JP
- Japan
- Prior art keywords
- insulating sheet
- blocks
- cooling device
- insulating
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 238000001816 cooling Methods 0.000 title claims abstract description 27
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000005219 brazing Methods 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 abstract description 2
- 238000010292 electrical insulation Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8188783A JPS59205742A (ja) | 1983-05-09 | 1983-05-09 | 半導体冷却装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8188783A JPS59205742A (ja) | 1983-05-09 | 1983-05-09 | 半導体冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59205742A true JPS59205742A (ja) | 1984-11-21 |
JPH0122986B2 JPH0122986B2 (enrdf_load_stackoverflow) | 1989-04-28 |
Family
ID=13758953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8188783A Granted JPS59205742A (ja) | 1983-05-09 | 1983-05-09 | 半導体冷却装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59205742A (enrdf_load_stackoverflow) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5355981A (en) * | 1976-10-30 | 1978-05-20 | Shinetsu Chemical Co | Method of heat sinking for electric circuit |
JPS5722244U (enrdf_load_stackoverflow) * | 1980-07-10 | 1982-02-04 |
-
1983
- 1983-05-09 JP JP8188783A patent/JPS59205742A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5355981A (en) * | 1976-10-30 | 1978-05-20 | Shinetsu Chemical Co | Method of heat sinking for electric circuit |
JPS5722244U (enrdf_load_stackoverflow) * | 1980-07-10 | 1982-02-04 |
Also Published As
Publication number | Publication date |
---|---|
JPH0122986B2 (enrdf_load_stackoverflow) | 1989-04-28 |
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