JPS5355981A - Method of heat sinking for electric circuit - Google Patents
Method of heat sinking for electric circuitInfo
- Publication number
- JPS5355981A JPS5355981A JP13092176A JP13092176A JPS5355981A JP S5355981 A JPS5355981 A JP S5355981A JP 13092176 A JP13092176 A JP 13092176A JP 13092176 A JP13092176 A JP 13092176A JP S5355981 A JPS5355981 A JP S5355981A
- Authority
- JP
- Japan
- Prior art keywords
- electric circuit
- heat sinking
- sinking
- heat
- electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13092176A JPS5355981A (en) | 1976-10-30 | 1976-10-30 | Method of heat sinking for electric circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13092176A JPS5355981A (en) | 1976-10-30 | 1976-10-30 | Method of heat sinking for electric circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5355981A true JPS5355981A (en) | 1978-05-20 |
JPS5433959B2 JPS5433959B2 (en) | 1979-10-24 |
Family
ID=15045841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13092176A Granted JPS5355981A (en) | 1976-10-30 | 1976-10-30 | Method of heat sinking for electric circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5355981A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55127034A (en) * | 1979-03-16 | 1980-10-01 | Varian Associates | Device for mechanically urging semiconductor wafer to soft thermoconductive surface |
JPS59205742A (en) * | 1983-05-09 | 1984-11-21 | Mitsubishi Electric Corp | Semiconductor cooling device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4727348B2 (en) * | 2005-08-23 | 2011-07-20 | 三菱重工業株式会社 | Electric compressor |
-
1976
- 1976-10-30 JP JP13092176A patent/JPS5355981A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55127034A (en) * | 1979-03-16 | 1980-10-01 | Varian Associates | Device for mechanically urging semiconductor wafer to soft thermoconductive surface |
JPS605540A (en) * | 1979-03-16 | 1985-01-12 | バリアン・アソシエイツ・インコ−ポレイテツド | Vacuum treating device of semiconductor wafer |
JPS6257066B2 (en) * | 1979-03-16 | 1987-11-28 | Varian Associates | |
JPS6323616B2 (en) * | 1979-03-16 | 1988-05-17 | Varian Associates | |
JPS59205742A (en) * | 1983-05-09 | 1984-11-21 | Mitsubishi Electric Corp | Semiconductor cooling device |
JPH0122986B2 (en) * | 1983-05-09 | 1989-04-28 | Mitsubishi Electric Corp |
Also Published As
Publication number | Publication date |
---|---|
JPS5433959B2 (en) | 1979-10-24 |
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