JPS59202642A - 混成集積回路装置の製造方法 - Google Patents

混成集積回路装置の製造方法

Info

Publication number
JPS59202642A
JPS59202642A JP58077936A JP7793683A JPS59202642A JP S59202642 A JPS59202642 A JP S59202642A JP 58077936 A JP58077936 A JP 58077936A JP 7793683 A JP7793683 A JP 7793683A JP S59202642 A JPS59202642 A JP S59202642A
Authority
JP
Japan
Prior art keywords
resin
chip
substrate
nitrogen gas
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58077936A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0367337B2 (enFirst
Inventor
Koji Tanaka
幸二 田中
Chikashi Ito
史 伊藤
Toshio Sonobe
園部　俊夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP58077936A priority Critical patent/JPS59202642A/ja
Publication of JPS59202642A publication Critical patent/JPS59202642A/ja
Publication of JPH0367337B2 publication Critical patent/JPH0367337B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP58077936A 1983-05-02 1983-05-02 混成集積回路装置の製造方法 Granted JPS59202642A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58077936A JPS59202642A (ja) 1983-05-02 1983-05-02 混成集積回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58077936A JPS59202642A (ja) 1983-05-02 1983-05-02 混成集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59202642A true JPS59202642A (ja) 1984-11-16
JPH0367337B2 JPH0367337B2 (enFirst) 1991-10-22

Family

ID=13647960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58077936A Granted JPS59202642A (ja) 1983-05-02 1983-05-02 混成集積回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59202642A (enFirst)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177738A (ja) * 1985-01-28 1986-08-09 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 相互接続体
JPS62116542U (enFirst) * 1986-01-17 1987-07-24
JPH01132129A (ja) * 1987-11-18 1989-05-24 Sanyo Electric Co Ltd 混成集積回路の製造方法
US6376915B1 (en) 1999-02-26 2002-04-23 Rohm Co., Ltd Semiconductor device and semiconductor chip

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5232554A (en) * 1975-09-05 1977-03-11 Int Standard Electric Corp Ac generating electronic unit
JPS5831539A (ja) * 1981-08-19 1983-02-24 Nec Corp 混成集積回路の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5232554A (en) * 1975-09-05 1977-03-11 Int Standard Electric Corp Ac generating electronic unit
JPS5831539A (ja) * 1981-08-19 1983-02-24 Nec Corp 混成集積回路の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177738A (ja) * 1985-01-28 1986-08-09 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 相互接続体
JPS62116542U (enFirst) * 1986-01-17 1987-07-24
JPH01132129A (ja) * 1987-11-18 1989-05-24 Sanyo Electric Co Ltd 混成集積回路の製造方法
US6376915B1 (en) 1999-02-26 2002-04-23 Rohm Co., Ltd Semiconductor device and semiconductor chip

Also Published As

Publication number Publication date
JPH0367337B2 (enFirst) 1991-10-22

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