JPS59199169A - リ−ド線先端球状半田玉付装置 - Google Patents

リ−ド線先端球状半田玉付装置

Info

Publication number
JPS59199169A
JPS59199169A JP58074431A JP7443183A JPS59199169A JP S59199169 A JPS59199169 A JP S59199169A JP 58074431 A JP58074431 A JP 58074431A JP 7443183 A JP7443183 A JP 7443183A JP S59199169 A JPS59199169 A JP S59199169A
Authority
JP
Japan
Prior art keywords
solder
lead wire
section
cream solder
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58074431A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6210747B2 (cg-RX-API-DMAC7.html
Inventor
Yoshiro Morimoto
嘉郎 森本
Toshio Tanizaki
谷崎　利男
Seiichi Sawada
沢田　誠一
Masaaki Tanaka
正明 田中
Masaaki Maeda
昌昭 前田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58074431A priority Critical patent/JPS59199169A/ja
Publication of JPS59199169A publication Critical patent/JPS59199169A/ja
Publication of JPS6210747B2 publication Critical patent/JPS6210747B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP58074431A 1983-04-27 1983-04-27 リ−ド線先端球状半田玉付装置 Granted JPS59199169A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58074431A JPS59199169A (ja) 1983-04-27 1983-04-27 リ−ド線先端球状半田玉付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58074431A JPS59199169A (ja) 1983-04-27 1983-04-27 リ−ド線先端球状半田玉付装置

Publications (2)

Publication Number Publication Date
JPS59199169A true JPS59199169A (ja) 1984-11-12
JPS6210747B2 JPS6210747B2 (cg-RX-API-DMAC7.html) 1987-03-07

Family

ID=13547017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58074431A Granted JPS59199169A (ja) 1983-04-27 1983-04-27 リ−ド線先端球状半田玉付装置

Country Status (1)

Country Link
JP (1) JPS59199169A (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
JPS6210747B2 (cg-RX-API-DMAC7.html) 1987-03-07

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