JPS59195798U - 多層プリント配線板 - Google Patents

多層プリント配線板

Info

Publication number
JPS59195798U
JPS59195798U JP1121984U JP1121984U JPS59195798U JP S59195798 U JPS59195798 U JP S59195798U JP 1121984 U JP1121984 U JP 1121984U JP 1121984 U JP1121984 U JP 1121984U JP S59195798 U JPS59195798 U JP S59195798U
Authority
JP
Japan
Prior art keywords
wiring layer
multilayer printed
printed wiring
wiring board
grounding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1121984U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129837Y2 (enExample
Inventor
ジェームズ・アーサー・ブリュウアー
ジョン・ケネディ・ラングッド
ハーヴィ・ロセン・マーカム
Original Assignee
インターナシヨナル　ビジネス　マシーンズ　コーポレーシヨン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by インターナシヨナル　ビジネス　マシーンズ　コーポレーシヨン filed Critical インターナシヨナル　ビジネス　マシーンズ　コーポレーシヨン
Publication of JPS59195798U publication Critical patent/JPS59195798U/ja
Application granted granted Critical
Publication of JPH0129837Y2 publication Critical patent/JPH0129837Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP1121984U 1983-06-10 1984-01-31 多層プリント配線板 Granted JPS59195798U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47337783A 1983-06-10 1983-06-10
US473377 1983-06-10

Publications (2)

Publication Number Publication Date
JPS59195798U true JPS59195798U (ja) 1984-12-26
JPH0129837Y2 JPH0129837Y2 (enExample) 1989-09-11

Family

ID=23879282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1121984U Granted JPS59195798U (ja) 1983-06-10 1984-01-31 多層プリント配線板

Country Status (4)

Country Link
JP (1) JPS59195798U (enExample)
BR (1) BR8401005A (enExample)
DE (1) DE3408046A1 (enExample)
GB (1) GB8405864D0 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4030190A (en) * 1976-03-30 1977-06-21 International Business Machines Corporation Method for forming a multilayer printed circuit board

Also Published As

Publication number Publication date
JPH0129837Y2 (enExample) 1989-09-11
BR8401005A (pt) 1984-10-16
GB8405864D0 (en) 1984-04-11
DE3408046A1 (de) 1984-12-13

Similar Documents

Publication Publication Date Title
JPS5868057U (ja) プリント配線板
JPS59146999U (ja) プリント基板のシ−ルド構造
JPS59191794U (ja) プリント基板
JPS5981110U (ja) アンテナ装置
JPS58122473U (ja) 印刷配線基板
JPS59145058U (ja) 印刷配線板
JPS60953U (ja) 多層プリント基板
JPS58124973U (ja) 回路基板
JPS59189269U (ja) 印刷配線基板の接続構造
JPS5937765U (ja) ノイズ防止用配線基板
JPS58164263U (ja) 多層プリント配線板構造
JPS59145056U (ja) プリント配線基板
JPS6053119U (ja) 固定接点の接点部構造
JPS59104559U (ja) 基準パタ−ン入り多層プリント基板
JPS61161797A (ja) 多層プリント板
JPS6066071U (ja) 多層配線板
JPS58191661U (ja) プリント板
JPS59182966U (ja) セラミツク多層回路基板
JPS5956775U (ja) 多層印刷配線板
JPS5974751U (ja) 複合電子回路
JPS5972754U (ja) 印刷配線板
JPS59171380U (ja) 多層印刷配線板
JPS609248U (ja) プリント配線基板
JPS59177973U (ja) 多層印刷配線板用内層回路板
JPS59103476U (ja) 印刷配線板