JPS59193082A - 光ファイバー付レーザーダイオード装置 - Google Patents

光ファイバー付レーザーダイオード装置

Info

Publication number
JPS59193082A
JPS59193082A JP58065466A JP6546683A JPS59193082A JP S59193082 A JPS59193082 A JP S59193082A JP 58065466 A JP58065466 A JP 58065466A JP 6546683 A JP6546683 A JP 6546683A JP S59193082 A JPS59193082 A JP S59193082A
Authority
JP
Japan
Prior art keywords
submount
chip
fixed
light emitting
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58065466A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0514434B2 (enExample
Inventor
Akira Ishii
暁 石井
Norihiro Minoha
蓑羽　憲宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58065466A priority Critical patent/JPS59193082A/ja
Publication of JPS59193082A publication Critical patent/JPS59193082A/ja
Publication of JPH0514434B2 publication Critical patent/JPH0514434B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
JP58065466A 1983-04-15 1983-04-15 光ファイバー付レーザーダイオード装置 Granted JPS59193082A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58065466A JPS59193082A (ja) 1983-04-15 1983-04-15 光ファイバー付レーザーダイオード装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58065466A JPS59193082A (ja) 1983-04-15 1983-04-15 光ファイバー付レーザーダイオード装置

Publications (2)

Publication Number Publication Date
JPS59193082A true JPS59193082A (ja) 1984-11-01
JPH0514434B2 JPH0514434B2 (enExample) 1993-02-25

Family

ID=13287920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58065466A Granted JPS59193082A (ja) 1983-04-15 1983-04-15 光ファイバー付レーザーダイオード装置

Country Status (1)

Country Link
JP (1) JPS59193082A (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56100430A (en) * 1980-01-11 1981-08-12 Toshiba Corp Fixing method for power transistor to substrate
JPS57112085A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Photocoupler

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56100430A (en) * 1980-01-11 1981-08-12 Toshiba Corp Fixing method for power transistor to substrate
JPS57112085A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Photocoupler

Also Published As

Publication number Publication date
JPH0514434B2 (enExample) 1993-02-25

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