JPS59190717A - 近接スイツチ - Google Patents
近接スイツチInfo
- Publication number
- JPS59190717A JPS59190717A JP58065921A JP6592183A JPS59190717A JP S59190717 A JPS59190717 A JP S59190717A JP 58065921 A JP58065921 A JP 58065921A JP 6592183 A JP6592183 A JP 6592183A JP S59190717 A JPS59190717 A JP S59190717A
- Authority
- JP
- Japan
- Prior art keywords
- proximity switch
- lead frame
- chip
- detection coil
- switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 238000000465 moulding Methods 0.000 claims abstract description 6
- 230000010355 oscillation Effects 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/945—Proximity switches
- H03K17/95—Proximity switches using a magnetic detector
- H03K17/9505—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
- Electronic Switches (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58065921A JPS59190717A (ja) | 1983-04-13 | 1983-04-13 | 近接スイツチ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58065921A JPS59190717A (ja) | 1983-04-13 | 1983-04-13 | 近接スイツチ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59190717A true JPS59190717A (ja) | 1984-10-29 |
| JPH0435859B2 JPH0435859B2 (enrdf_load_stackoverflow) | 1992-06-12 |
Family
ID=13300913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58065921A Granted JPS59190717A (ja) | 1983-04-13 | 1983-04-13 | 近接スイツチ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59190717A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0710919A3 (de) * | 1994-10-21 | 1997-03-26 | Giesecke & Devrient Gmbh | Kontaktloses elektronisches Modul |
| WO1998013869A1 (de) * | 1996-09-26 | 1998-04-02 | Sican Gesellschaft Für Silizium-Anwendungen Und Cad/Cat Niedersachsen Mbh | Integrierte schaltung mit einem induktiven bauelement |
| EP0902472A3 (en) * | 1997-09-15 | 2000-10-18 | Microchip Technology Inc. | Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor |
| EP1091404A1 (en) * | 1999-10-06 | 2001-04-11 | Lucent Technologies Inc. | Multifunction lead frame and integrated circuit package incorporating the same |
| WO2006085363A1 (ja) * | 2005-02-09 | 2006-08-17 | Renesas Technology Corp. | 半導体装置及び電子回路 |
| JP2008543092A (ja) * | 2005-06-03 | 2008-11-27 | インターナショナル・ビジネス・マシーンズ・コーポレーション | ミリメートル波アプリケーションのためのアンテナを集積回路チップと共にパッケージングするための装置及び方法 |
| JP2012234986A (ja) * | 2011-05-02 | 2012-11-29 | Shindengen Electric Mfg Co Ltd | インダクタ一体型リードフレーム、並びに、電子回路モジュール及びその製造方法 |
| WO2016026476A1 (de) * | 2014-08-22 | 2016-02-25 | Balluff Gmbh | Induktiver näherungssensor in integrierter bauweise |
-
1983
- 1983-04-13 JP JP58065921A patent/JPS59190717A/ja active Granted
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0710919A3 (de) * | 1994-10-21 | 1997-03-26 | Giesecke & Devrient Gmbh | Kontaktloses elektronisches Modul |
| US5946198A (en) * | 1994-10-21 | 1999-08-31 | Giesecke & Devrient Gmbh | Contactless electronic module with self-supporting metal coil |
| WO1998013869A1 (de) * | 1996-09-26 | 1998-04-02 | Sican Gesellschaft Für Silizium-Anwendungen Und Cad/Cat Niedersachsen Mbh | Integrierte schaltung mit einem induktiven bauelement |
| EP0902472A3 (en) * | 1997-09-15 | 2000-10-18 | Microchip Technology Inc. | Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor |
| EP1091404A1 (en) * | 1999-10-06 | 2001-04-11 | Lucent Technologies Inc. | Multifunction lead frame and integrated circuit package incorporating the same |
| WO2006085363A1 (ja) * | 2005-02-09 | 2006-08-17 | Renesas Technology Corp. | 半導体装置及び電子回路 |
| JP2008543092A (ja) * | 2005-06-03 | 2008-11-27 | インターナショナル・ビジネス・マシーンズ・コーポレーション | ミリメートル波アプリケーションのためのアンテナを集積回路チップと共にパッケージングするための装置及び方法 |
| JP2012234986A (ja) * | 2011-05-02 | 2012-11-29 | Shindengen Electric Mfg Co Ltd | インダクタ一体型リードフレーム、並びに、電子回路モジュール及びその製造方法 |
| WO2016026476A1 (de) * | 2014-08-22 | 2016-02-25 | Balluff Gmbh | Induktiver näherungssensor in integrierter bauweise |
| US10298230B2 (en) | 2014-08-22 | 2019-05-21 | Balluff Gmbh | Inductive proximity sensor of integrated design |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0435859B2 (enrdf_load_stackoverflow) | 1992-06-12 |
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