JPS59189686A - 表示装置 - Google Patents

表示装置

Info

Publication number
JPS59189686A
JPS59189686A JP58066168A JP6616883A JPS59189686A JP S59189686 A JPS59189686 A JP S59189686A JP 58066168 A JP58066168 A JP 58066168A JP 6616883 A JP6616883 A JP 6616883A JP S59189686 A JPS59189686 A JP S59189686A
Authority
JP
Japan
Prior art keywords
reflector
display device
lead frame
pieces
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58066168A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0316794B2 (en, 2012
Inventor
Kiyoharu Nakamura
清春 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58066168A priority Critical patent/JPS59189686A/ja
Publication of JPS59189686A publication Critical patent/JPS59189686A/ja
Publication of JPH0316794B2 publication Critical patent/JPH0316794B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Led Device Packages (AREA)
JP58066168A 1983-04-13 1983-04-13 表示装置 Granted JPS59189686A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58066168A JPS59189686A (ja) 1983-04-13 1983-04-13 表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58066168A JPS59189686A (ja) 1983-04-13 1983-04-13 表示装置

Publications (2)

Publication Number Publication Date
JPS59189686A true JPS59189686A (ja) 1984-10-27
JPH0316794B2 JPH0316794B2 (en, 2012) 1991-03-06

Family

ID=13308048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58066168A Granted JPS59189686A (ja) 1983-04-13 1983-04-13 表示装置

Country Status (1)

Country Link
JP (1) JPS59189686A (en, 2012)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6168440A (ja) * 1984-09-12 1986-04-08 Mitsui Toatsu Chem Inc メチルグリオキサ−ルの製造法
JPH02114954U (en, 2012) * 1989-03-01 1990-09-14
FR2658344A1 (fr) * 1990-02-09 1991-08-16 Neiman Sa Systeme de telecommande notamment pour le verrouillage/deverrouillage de portieres pour vehicules automobiles.
JPH0690029A (ja) * 1992-09-08 1994-03-29 Stanley Electric Co Ltd 半導体素子
WO2001013437A1 (en) * 1999-08-12 2001-02-22 Rohm Co., Ltd. Chip semiconductor light-emitting device
CN103594603A (zh) * 2013-10-30 2014-02-19 王定锋 一种新型的smd-led支架、贴片型led及其制造方法
CN103904191A (zh) * 2012-12-26 2014-07-02 中微光电子(潍坊)有限公司 一种led封装基底及led封装结构

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6168440A (ja) * 1984-09-12 1986-04-08 Mitsui Toatsu Chem Inc メチルグリオキサ−ルの製造法
JPH02114954U (en, 2012) * 1989-03-01 1990-09-14
FR2658344A1 (fr) * 1990-02-09 1991-08-16 Neiman Sa Systeme de telecommande notamment pour le verrouillage/deverrouillage de portieres pour vehicules automobiles.
US5266946A (en) * 1990-02-09 1993-11-30 Valeo Neiman Remote control system, in particular for locking and unlocking the doors of motor vehicles with two axially offset light emitters
JPH0690029A (ja) * 1992-09-08 1994-03-29 Stanley Electric Co Ltd 半導体素子
WO2001013437A1 (en) * 1999-08-12 2001-02-22 Rohm Co., Ltd. Chip semiconductor light-emitting device
CN103904191A (zh) * 2012-12-26 2014-07-02 中微光电子(潍坊)有限公司 一种led封装基底及led封装结构
CN103594603A (zh) * 2013-10-30 2014-02-19 王定锋 一种新型的smd-led支架、贴片型led及其制造方法

Also Published As

Publication number Publication date
JPH0316794B2 (en, 2012) 1991-03-06

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