JPS59188198A - Cooling structure of eletronic circuit package - Google Patents
Cooling structure of eletronic circuit packageInfo
- Publication number
- JPS59188198A JPS59188198A JP6215783A JP6215783A JPS59188198A JP S59188198 A JPS59188198 A JP S59188198A JP 6215783 A JP6215783 A JP 6215783A JP 6215783 A JP6215783 A JP 6215783A JP S59188198 A JPS59188198 A JP S59188198A
- Authority
- JP
- Japan
- Prior art keywords
- cooling structure
- circuit package
- cover
- package
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は電子回路パッケージの冷却構造に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a cooling structure for an electronic circuit package.
従来、電子回路パッケージの冷却構造としては、■自然
空冷構造、■強制空冷構造、■冷却液浸漬構造に大別さ
れ、それぞれ次のような欠点を有している。■は高発熱
に対しては対応がとれない。■は送風装置が必要となる
上、送風装置の寿命が電子回路の寿命を左右し、その寿
命は一般は短かいこと、更に送風装置により騒音を発す
る。■は複数のパッケージを同一チャンバーにとじ込め
て液漬しているため、故障時のパンケージ交換が困難で
あり保守性が悪い。Conventionally, cooling structures for electronic circuit packages are broadly classified into (1) natural air cooling structure, (2) forced air cooling structure, and (2) coolant immersion structure, each of which has the following drawbacks. ■No measures can be taken against high fever. (2) requires a blower, and the lifespan of the blower determines the lifespan of the electronic circuit, which is generally short; and furthermore, the blower generates noise. In case (2), multiple packages are kept in the same chamber and immersed in liquid, making it difficult to replace the pancakes in the event of a failure, resulting in poor maintainability.
本発明はかかる従来技術の欠点を解決し、高発熱部品に
対し、冷却効果が高くかつ保守性の良い電子回路パンケ
ージの冷却構造を提供するにある。SUMMARY OF THE INVENTION The present invention solves the drawbacks of the prior art and provides a cooling structure for electronic circuit pancakes that has a high cooling effect and is easy to maintain for high heat generating components.
本発明の要点は、パッケージに実装した発熱部品をカバ
ーにて密閉し、その中に冷却液を入れて発熱部品を冷却
液に浸漬することにより、冷却効率を大ならしめたこと
にある。又パッケージ内に冷却液の温度検出素子も合せ
て実装すれば、冷却構造の安全性をより確保でさるもの
である。The gist of the present invention is to increase the cooling efficiency by sealing the heat-generating components mounted in the package with a cover, filling the cover with a cooling liquid, and immersing the heat-generating components in the cooling liquid. Furthermore, if a cooling liquid temperature detection element is also mounted in the package, the safety of the cooling structure can be further ensured.
以下本発明を図面により詳細に説明する。第１図は本発
明による電子回路パンケージ１の−実施例を示す正面図
であり、第２図は第を図の要部断面図である。The present invention will be explained in detail below with reference to the drawings. FIG. 1 is a front view showing an embodiment of an electronic circuit pancase 1 according to the present invention, and FIG. 2 is a sectional view of a main part of the same.
図において２は印刷配線板であり、−例えば鉄心２ａに
絶縁＠２ｂをコーテングし、その上に印刷配線２Ｃを設
け、プラグイン接続用の接栓部２ｄを有する。この印刷
配線板２には、発熱のない回路部品５ａ及び高発熱部品
５ｄが実装される。In the figure, 2 is a printed wiring board, for example, an iron core 2a is coated with insulation@2b, a printed wiring 2C is provided thereon, and a plug part 2d for plug-in connection is provided. On this printed wiring board 2, a non-heat generating circuit component 5a and a high heat generating component 5d are mounted.
４は大略−ロー形の金属カバーであり、上記高発熱部品
５ｂを覆いかぶせて、カバー４の７ラング部４ａを印刷
配線板２の鉄心２ａに密着させ、レーザ光線を矢印への
方向から７ラング部４ａの全周にわたって連続照射して
容接する。なお印刷配線板２は、カバー４の密着部２ｅ
において絶縁膜２ｂは設けていない。又カバー４はその
一部において穴４ｂを設けておく。Reference numeral 4 designates a generally low-shaped metal cover, which covers the high heat generation component 5b, brings the 7 rungs 4a of the cover 4 into close contact with the iron core 2a of the printed wiring board 2, and directs the laser beam from the direction of the arrow. Continuous irradiation is applied to the entire circumference of the rung portion 4a. Note that the printed wiring board 2 is attached to the contact portion 2e of the cover 4.
Insulating film 2b is not provided in FIG. Further, a hole 4b is provided in a part of the cover 4.
カバー４を上述の如く溶接した後、冷却液５を穴４ｂか
ら注入し発熱部品６ｂを浸漬する。その抜穴４ｂを例え
ば半田ケで塞いでカバー４の内側を気密構造にする。After the cover 4 is welded as described above, the cooling liquid 5 is injected through the hole 4b to immerse the heat generating component 6b. The hole 4b is closed with solder, for example, to make the inside of the cover 4 airtight.
又冷却液５で浸漬する位置に湿度検出素子５Ｃを実装し
ておき、印刷配線を介して、別に設けた異常温度検出回
路へと接続しておけば、冷却液５の湿度を検知すること
ができる。Furthermore, if a humidity detection element 5C is mounted at a position where it is immersed in the coolant 5 and connected to a separately provided abnormal temperature detection circuit via printed wiring, the humidity of the coolant 5 can be detected. can.
本発明によれば、高発熱部品は冷均液に浸漬されている
ため、冷却液によって効率よく冷却される。又冷却液は
カバおよび印刷配線板の鉄心に効率よく熱伝導をなすた
め、電子回路パッケージ全体が放熱フィンの効果をもつ
ことになり、極めて発熱密度の高い部品であっても、小
さな湿度上昇に抑えることがｒｉＪ能となり、装置の長
寿命、高信頼性が確保できる。更に冷却液の調度検出素
子を設けておけばより安全性も確保される。又冷却構造
はプラグインのパッケージ単位で完全に独立しているた
め、装置の保守性も高く工業的価値は非常に大なるもの
がある。According to the present invention, since the high heat generating components are immersed in the cold uniform liquid, they are efficiently cooled by the cooling liquid. In addition, since the coolant conducts heat efficiently to the cover and the iron core of the printed wiring board, the entire electronic circuit package has the effect of a heat dissipation fin, and even parts with extremely high heat generation density can be prevented from increasing humidity by a small amount. It is possible to suppress the riJ performance and ensure a long life and high reliability of the device. Furthermore, safety can be further ensured by providing a coolant preparation detection element. Furthermore, since the cooling structure is completely independent for each plug-in package, the device is highly maintainable and has great industrial value.
第１図は本発明の一実施例を示す正面図、第２図は第１
図の要部断面図である。
１：成子回路パッケージ、
２：印刷配線板、
２ａ：鉄心、
２ｂ；絶縁膜、
２Ｃ：印刷配線、
２ｄ：接栓部、
２ｅ：密着部、
５＝回路部品、
６ｂ：高発熱部品、
ろＣ：調度検出素子、
４；金属性カバー、
４ａ：フランジ部、
４ｂ：穴、
４Ｃ：半田、
５：冷却液。
第 １ 口
２FIG. 1 is a front view showing one embodiment of the present invention, and FIG. 2 is a front view showing one embodiment of the present invention.
It is a sectional view of the main part of the figure. 1: Seiko circuit package, 2: Printed wiring board, 2a: Iron core, 2b: Insulating film, 2C: Printed wiring, 2d: Plug part, 2e: Close contact part, 5 = Circuit component, 6b: High heat generation component, Filter C : Furnishing detection element, 4; Metallic cover, 4a: Flange portion, 4b: Hole, 4C: Solder, 5: Coolant. 1st mouth 2
Claims (1)
一部を内臓し、パッケージの部品実装面を壁の一部とし
た密閉容器となるようにカッく−を施し、そのカバー内
に冷却液を入れて上記発熱部品を浸漬させて構成された
ことを特徴とする電子回路パンケージの冷却構造。In the tm child circuit package, at least a part of the heat-generating components is housed, and the component mounting surface of the package is made into a sealed container as part of the wall, and a cooling liquid is poured into the cover. A cooling structure for an electronic circuit pancase characterized by being constructed by immersing heat-generating parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6215783A JPS59188198A (en) | 1983-04-11 | 1983-04-11 | Cooling structure of eletronic circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6215783A JPS59188198A (en) | 1983-04-11 | 1983-04-11 | Cooling structure of eletronic circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59188198A true JPS59188198A (en) | 1984-10-25 |
Family
ID=13191993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6215783A Pending JPS59188198A (en) | 1983-04-11 | 1983-04-11 | Cooling structure of eletronic circuit package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59188198A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63149635U (en) * | 1987-03-23 | 1988-10-03 | ||
| JP2019145749A (en) * | 2018-02-23 | 2019-08-29 | 日本電気株式会社 | Electronic equipment and electronic device |
| US11644249B2 (en) | 2018-04-02 | 2023-05-09 | Nec Corporation | Electronic apparatus |
-
1983
- 1983-04-11 JP JP6215783A patent/JPS59188198A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63149635U (en) * | 1987-03-23 | 1988-10-03 | ||
| JP2019145749A (en) * | 2018-02-23 | 2019-08-29 | 日本電気株式会社 | Electronic equipment and electronic device |
| US10772187B2 (en) | 2018-02-23 | 2020-09-08 | Nec Corporation | Electronic equipment and electronic device |
| US11644249B2 (en) | 2018-04-02 | 2023-05-09 | Nec Corporation | Electronic apparatus |
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