JPS59186333A - ボンデイング装置 - Google Patents

ボンデイング装置

Info

Publication number
JPS59186333A
JPS59186333A JP58061638A JP6163883A JPS59186333A JP S59186333 A JPS59186333 A JP S59186333A JP 58061638 A JP58061638 A JP 58061638A JP 6163883 A JP6163883 A JP 6163883A JP S59186333 A JPS59186333 A JP S59186333A
Authority
JP
Japan
Prior art keywords
pellet
bonding
substrate
arm
recognition device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58061638A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0213933B2 (enrdf_load_stackoverflow
Inventor
Noriyuki Inagaki
典之 稲垣
Yutaka Makino
豊 牧野
Takeichi Yoshida
吉田　竹一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58061638A priority Critical patent/JPS59186333A/ja
Publication of JPS59186333A publication Critical patent/JPS59186333A/ja
Publication of JPH0213933B2 publication Critical patent/JPH0213933B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP58061638A 1983-04-07 1983-04-07 ボンデイング装置 Granted JPS59186333A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58061638A JPS59186333A (ja) 1983-04-07 1983-04-07 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58061638A JPS59186333A (ja) 1983-04-07 1983-04-07 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS59186333A true JPS59186333A (ja) 1984-10-23
JPH0213933B2 JPH0213933B2 (enrdf_load_stackoverflow) 1990-04-05

Family

ID=13176945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58061638A Granted JPS59186333A (ja) 1983-04-07 1983-04-07 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS59186333A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224635A (ja) * 1985-07-24 1987-02-02 Matsushita Electric Ind Co Ltd フリツプチツプボンダ−
JPS6226830A (ja) * 1985-07-26 1987-02-04 Matsushita Electric Ind Co Ltd チツプボンデイング装置
JPS6297341A (ja) * 1985-10-23 1987-05-06 Matsushita Electric Ind Co Ltd ボンディング装置及びボンディング方法
JPH01183829A (ja) * 1988-01-19 1989-07-21 Toshiba Corp 電子部品の成形装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224635A (ja) * 1985-07-24 1987-02-02 Matsushita Electric Ind Co Ltd フリツプチツプボンダ−
JPS6226830A (ja) * 1985-07-26 1987-02-04 Matsushita Electric Ind Co Ltd チツプボンデイング装置
JPS6297341A (ja) * 1985-10-23 1987-05-06 Matsushita Electric Ind Co Ltd ボンディング装置及びボンディング方法
JPH01183829A (ja) * 1988-01-19 1989-07-21 Toshiba Corp 電子部品の成形装置

Also Published As

Publication number Publication date
JPH0213933B2 (enrdf_load_stackoverflow) 1990-04-05

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