JPS59185832U - 実装装置 - Google Patents
実装装置Info
- Publication number
- JPS59185832U JPS59185832U JP5385784U JP5385784U JPS59185832U JP S59185832 U JPS59185832 U JP S59185832U JP 5385784 U JP5385784 U JP 5385784U JP 5385784 U JP5385784 U JP 5385784U JP S59185832 U JPS59185832 U JP S59185832U
- Authority
- JP
- Japan
- Prior art keywords
- tape carrier
- positioning
- showing
- view
- movable part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5385784U JPS59185832U (ja) | 1984-04-12 | 1984-04-12 | 実装装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5385784U JPS59185832U (ja) | 1984-04-12 | 1984-04-12 | 実装装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59185832U true JPS59185832U (ja) | 1984-12-10 |
| JPS6116691Y2 JPS6116691Y2 (enrdf_load_stackoverflow) | 1986-05-22 |
Family
ID=30184204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5385784U Granted JPS59185832U (ja) | 1984-04-12 | 1984-04-12 | 実装装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59185832U (enrdf_load_stackoverflow) |
-
1984
- 1984-04-12 JP JP5385784U patent/JPS59185832U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6116691Y2 (enrdf_load_stackoverflow) | 1986-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59185832U (ja) | 実装装置 | |
| JPS6117742U (ja) | 半導体製造装置 | |
| JPS588697Y2 (ja) | 電子部品の保持テ−プ | |
| JPS6384941U (enrdf_load_stackoverflow) | ||
| JPS6096831U (ja) | 半導体チツプ | |
| JPS6056472U (ja) | 万能タイプの刃物研削工具 | |
| JPS6237887B2 (enrdf_load_stackoverflow) | ||
| JPS58499U (ja) | 半導体装置のキャリア | |
| JPS62137818A (ja) | 半導体装置の製造方法 | |
| JPS60116234U (ja) | イオン注入用半導体基板保持装置 | |
| JPS60176557U (ja) | 集積回路チツプ | |
| JPS62204328U (enrdf_load_stackoverflow) | ||
| JPS58120655U (ja) | ウエハ−ダイシング用接着シ−ト | |
| JPS59200498A (ja) | 半導体装置組立用ダイコレツト | |
| JPH0385643U (enrdf_load_stackoverflow) | ||
| JPS5844843U (ja) | 半導体装置 | |
| JPS59112652U (ja) | サ−マルヘツド | |
| JPS6169857U (enrdf_load_stackoverflow) | ||
| JPS60130652U (ja) | 半導体装置 | |
| JPS6170043U (enrdf_load_stackoverflow) | ||
| JPH0279267U (enrdf_load_stackoverflow) | ||
| JPS5844852U (ja) | 半導体ウエハ | |
| JPS5916139U (ja) | 集積回路 | |
| JPS59180424U (ja) | 半導体基板用治具 | |
| JPS6134731U (ja) | 化合物半導体単結晶ウエハ− |