JPS5918445U - 多層構造半導体装置 - Google Patents

多層構造半導体装置

Info

Publication number
JPS5918445U
JPS5918445U JP7489883U JP7489883U JPS5918445U JP S5918445 U JPS5918445 U JP S5918445U JP 7489883 U JP7489883 U JP 7489883U JP 7489883 U JP7489883 U JP 7489883U JP S5918445 U JPS5918445 U JP S5918445U
Authority
JP
Japan
Prior art keywords
semiconductor device
multilayer structure
structure semiconductor
semiconductor substrate
film formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7489883U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6218055Y2 (enExample
Inventor
守 前田
幹夫 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7489883U priority Critical patent/JPS5918445U/ja
Publication of JPS5918445U publication Critical patent/JPS5918445U/ja
Application granted granted Critical
Publication of JPS6218055Y2 publication Critical patent/JPS6218055Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Element Separation (AREA)
JP7489883U 1983-05-19 1983-05-19 多層構造半導体装置 Granted JPS5918445U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7489883U JPS5918445U (ja) 1983-05-19 1983-05-19 多層構造半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7489883U JPS5918445U (ja) 1983-05-19 1983-05-19 多層構造半導体装置

Publications (2)

Publication Number Publication Date
JPS5918445U true JPS5918445U (ja) 1984-02-04
JPS6218055Y2 JPS6218055Y2 (enExample) 1987-05-09

Family

ID=30204980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7489883U Granted JPS5918445U (ja) 1983-05-19 1983-05-19 多層構造半導体装置

Country Status (1)

Country Link
JP (1) JPS5918445U (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153799A (ja) * 2008-12-24 2010-07-08 Internatl Business Mach Corp <Ibm> 冷却機構を含む接合型半導体構造体とその形成方法
JP2012069585A (ja) * 2010-09-21 2012-04-05 Hitachi Ltd 半導体装置およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387163A (en) * 1977-01-12 1978-08-01 Hitachi Ltd Production of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387163A (en) * 1977-01-12 1978-08-01 Hitachi Ltd Production of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153799A (ja) * 2008-12-24 2010-07-08 Internatl Business Mach Corp <Ibm> 冷却機構を含む接合型半導体構造体とその形成方法
JP2012069585A (ja) * 2010-09-21 2012-04-05 Hitachi Ltd 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS6218055Y2 (enExample) 1987-05-09

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