JPS59178781A - Light emitting element or light receiving sealed body - Google Patents
Light emitting element or light receiving sealed bodyInfo
- Publication number
- JPS59178781A JPS59178781A JP58054945A JP5494583A JPS59178781A JP S59178781 A JPS59178781 A JP S59178781A JP 58054945 A JP58054945 A JP 58054945A JP 5494583 A JP5494583 A JP 5494583A JP S59178781 A JPS59178781 A JP S59178781A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- carboxyl group
- resin
- light
- bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 44
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 44
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 38
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229920001971 elastomer Polymers 0.000 claims abstract description 9
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 7
- 150000001993 dienes Chemical class 0.000 claims abstract description 5
- 229930185605 Bisphenol Natural products 0.000 claims abstract 4
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229920000459 Nitrile rubber Polymers 0.000 claims 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical group C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 15
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract description 10
- 150000008064 anhydrides Chemical class 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 abstract description 9
- 229920000642 polymer Polymers 0.000 abstract description 8
- 229920001577 copolymer Polymers 0.000 abstract description 4
- 239000005062 Polybutadiene Substances 0.000 abstract description 3
- 229920002857 polybutadiene Polymers 0.000 abstract description 3
- 239000004848 polyfunctional curative Substances 0.000 abstract 3
- 239000005060 rubber Substances 0.000 abstract 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- 229920003244 diene elastomer Polymers 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XLYOFNOQVPJJNP-ZSJDYOACSA-N Heavy water Chemical compound [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- RIAHASMJDOMQER-UHFFFAOYSA-N 5-ethyl-2-methyl-1h-imidazole Chemical compound CCC1=CN=C(C)N1 RIAHASMJDOMQER-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920003006 Polybutadiene acrylonitrile Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- MFGZXPGKKJMZIY-UHFFFAOYSA-N ethyl 5-amino-1-(4-sulfamoylphenyl)pyrazole-4-carboxylate Chemical compound NC1=C(C(=O)OCC)C=NN1C1=CC=C(S(N)(=O)=O)C=C1 MFGZXPGKKJMZIY-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は発光素子又は受光素子を樹脂封止してなる発光
素子又は受光素子封止体に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a light-emitting element or light-receiving element sealed body formed by sealing a light-emitting element or a light-receiving element with a resin.
発光又は受光素子を樹脂封止するために、低圧成形用エ
ポキシ樹脂成形材料や液状エポキシ樹脂注型材料を用い
ることは広く知られている。It is widely known that an epoxy resin molding material for low pressure molding or a liquid epoxy resin casting material is used to seal a light emitting or light receiving element with a resin.
しかしながら近年、特にかかる素子の大型化特殊化等の
要求により、従来の成形材料を封止用樹脂として用いて
得られた封止体では、素子に加わる収縮応力が大きく、
このため冷熱試験によって封止用樹脂にクラックが発生
したり通電特性が低下するなど封止体としての信頼性に
劣る欠点を有しでいた。However, in recent years, due to the demand for larger and more specialized devices, sealing bodies obtained using conventional molding materials as sealing resins have a large shrinkage stress applied to the device.
For this reason, the sealing resin had the drawbacks of poor reliability as a sealing body, such as cracks occurring in the sealing resin and deterioration of current conduction characteristics during thermal tests.
本発明はこのような欠点を改良するために為されたもの
で、ビスフェノールＡ型エポキシ樹脂ヲ主体とするエポ
キシ樹脂（Ａ＋、ｅ＆無水物系硬化剤（Ｂｌ卦よび力を
ホキシル基含有ジエン系ゴム質ポリマ（Ｃ１
−（Ｃ）を含む組成物でろって、催量比で□ＩＡＩ ＋
＋Ｂｌ ＋ ｔｃ！１
が０．０２−０．３０好ましくは０．０５〜０，１５と
された工ポキン樹脂組成物を用いて発光又は受光素子を
モールドしてなる発光素子又は受光素子封止体に関する
ものでるる。The present invention has been made to improve these drawbacks, and uses epoxy resins mainly consisting of bisphenol A type epoxy resin (A+, e & anhydride curing agent (Bl) and phoxyl group-containing diene rubber. A composition containing a quality polymer (C1-(C)) has a mass ratio of □IAI +
+Bl+tc! 1 is 0.02-0.30, preferably 0.05-0.15, and relates to a light-emitting or light-receiving device sealed body formed by molding a light-emitting or light-receiving device using a polypropylene resin composition. .
本発明において用いるビスフェノールＡ型エポキシ樹脂
としては、エポキシ当量１８０〜１０００、分子量３５
０〜２５００程度のものが一般的に用いられる。The bisphenol A type epoxy resin used in the present invention has an epoxy equivalent of 180 to 1000 and a molecular weight of 35.
A value of about 0 to 2500 is generally used.
本発明に卦いて用いるエポキシ樹脂としては、すべてを
ビスフェノールＡ型エポキシ樹脂とするのが好ましいが
、用いるエポキシ樹脂の５０屯址φまで、好ましくは３
０重叶係−までをビスフェノールＡ型エポキシ樹脂以外
の他のエポキシ樹脂と置きかえてイ吏用することができ
る。All epoxy resins used in the present invention are preferably bisphenol A type epoxy resins, but up to 50 ton diameter of the epoxy resin used, preferably 3
It is possible to use other epoxy resins other than bisphenol A type epoxy resin by replacing up to 0 layers of epoxy resin.
これらの他のエポキシ樹脂としては、ビスフェノールＦ
型エポキシ樹脂、脂環式エポキシ樹脂、ノボラック型エ
ボキノ樹脂、ヒダントイン型エポキシ樹脂を挙げること
ができる。These other epoxy resins include bisphenol F
Type epoxy resins, alicyclic epoxy resins, novolac type evoquino resins, and hydantoin type epoxy resins can be mentioned.
これら他のエポキシ樹脂としては一般的にエポキシ当量
ｔｏｏ〜２００、分子量１８０〜６００程度のものを用
いるのが好ましい。As these other epoxy resins, it is generally preferable to use those having an epoxy equivalent of too to 200 and a molecular weight of about 180 to 600.
用いるビスフェノールＡ型エポキシ樹脂の５０重量％以
上を他のエポキシ樹脂に代えて使用すると得られる封止
体を構成するエポキシ樹脂硬化体のガラス転、移温度が
低下すると共に耐湿性にも劣るようになったり、耐クラ
ツク性が低下したりする。When 50% by weight or more of the bisphenol A type epoxy resin used is used in place of other epoxy resins, the glass transition and transition temperatures of the cured epoxy resin constituting the resulting sealing body are lowered, and the moisture resistance is also inferior. or the crack resistance may decrease.
本発明において用いる酸無水物としては、無水７タル酸
、無水テトラヒト”ｏ７タル酸、無水トリノリノド酸、
無水メチルテトラヒドロフタル酸、無水メチルエンドメ
チレンテトラヒドロフタル酸、シクロヘキセン−１・２
−ジカルボン酸無水物、／クロヘキセンー３・４−ジカ
ルボン酸無水物、トリメリット酸無水物の二手レンゲリ
コール、ニスデルなどを挙げることができる。Examples of the acid anhydride used in the present invention include 7-talic anhydride, tetrahydro-7-talic anhydride, trinolinodoic anhydride,
Methyltetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, cyclohexene-1/2
-dicarboxylic anhydride, /chlorhexene-3,4-dicarboxylic anhydride, trimellitic anhydride, dicarboxylic acid, Nisdel, and the like.
しかし好ましくは分子量１４０〜５ｏｏ程度の飽和カル
ボン酸無水物又１ｒｉ芳香族カルボン酸無水物を用いる
（無水物は−又は二無水物である）。酸無水物のエポキ
シ樹脂に対する配合割合は、該エポキシ樹脂を硬化させ
うるに充分な量が用いられるが、一般的にエポキシ樹脂
の１エポキシ当量に対して、０．６〜１．５好ましくは
０．７〜１．２酸無水物当叶としされる。However, preferably a saturated carboxylic acid anhydride or an aromatic carboxylic acid anhydride having a molecular weight of about 140 to 500 is used (the anhydride is - or dianhydride). The blending ratio of the acid anhydride to the epoxy resin is a sufficient amount to cure the epoxy resin, but generally it is 0.6 to 1.5, preferably 0 to 1 epoxy equivalent of the epoxy resin. .7 to 1.2 acid anhydride.
また本発明のエポキシ樹脂組成物に硬化促進剤を添加す
ることもできる。Further, a curing accelerator can also be added to the epoxy resin composition of the present invention.
硬化促進剤としてはたとえば第３級アミン類、イミダゾ
ール類、カルボン酸金属塩等があり、これらの例として
はベンジルジメチルアミン、トリエタノールアミン、ト
リス（ジメチルアミンメチル）フェノール、２−メチル
イミダゾール、２−エチル−４−メチルイミダゾール、
オクチル酸スズ、オクチル酸亜鉛、サリチル酸亜鉛等が
挙げられる。Examples of curing accelerators include tertiary amines, imidazoles, carboxylic acid metal salts, etc. Examples of these include benzyldimethylamine, triethanolamine, tris(dimethylaminemethyl)phenol, 2-methylimidazole, -ethyl-4-methylimidazole,
Examples include tin octylate, zinc octylate, and zinc salicylate.
硬化促進剤を使用する場合の添加量け、エポキシ樹脂、
酸無水物系硬化剤およ〃カルボキシル基金をジエン系ゴ
ム質ポリマーの合計量に対して好適には０．１〜３．５
重ｔ％である。Addition amount when using curing accelerator, epoxy resin,
The amount of acid anhydride curing agent and carboxyl foundation is preferably 0.1 to 3.5 based on the total amount of diene rubbery polymer.
The weight is t%.
硬化促進剤を用いる場合には、２・６−ジ−ターンヤリ
−ブチル−４−メチルフェノールヲ添加するのが好まし
い。その添加量は、一般的にエポキシ樹脂、酸無水物系
硬化剤および２・６−ジ−ターシャリ−ブチル−４−メ
チルフェノールの合計量に対して、好ましくは０．０１
〜１０重ｔ％、特には０．１〜２重量％程度である。When using a curing accelerator, it is preferable to add 2,6-di-ternary-butyl-4-methylphenol. The amount added is generally preferably 0.01 to the total amount of the epoxy resin, acid anhydride curing agent, and 2,6-di-tert-butyl-4-methylphenol.
It is about 10% by weight, especially about 0.1 to 2% by weight.
本発明においてカルボキシル基含有ジエン系ゴ０１
１質′す′−の使用量を・節１己の投口”ｔＡＩ ＋
（Ｂｌ ＋ （。１を重蓋比で０．０２〜０．３０とし
た理由は、この範囲外では素子に加わる応力を低減でき
ず、さらにガラス転移温度の低下が起ると共に耐湿性が
低下する欠点を有する。In the present invention, the amount of carboxyl group-containing diene rubber used is
(The reason why Bl + (.1 is set to 0.02 to 0.30 in terms of heavy lid ratio is that outside this range, the stress applied to the element cannot be reduced, and the glass transition temperature also decreases, leading to a decrease in moisture resistance. It has the disadvantage of
カルボキシル基含有ジエン系ゴム質ポリマーとしては、
分子量１０００−１００，０００ 、好ましくは１００
０、〜１０，０００、特に好ましくは１５００〜５，０
００、−分子量りのカルボキシル基の数１．４〜１０ケ
、好ましくは１，６〜２．４のものを用いるのがよいＯ
カルボキシル基含有ジエン系ゴム質ポリマーとしては、
カルボキシル基含有ゲタジエン・アクリロニトリル共重
合体、カルボキシル基含有ポリブタジェン、カルボキシ
ル基含有ゲタジエン・アクリロニトリル・アクリル酸共
重合体、カルボキシル基含有ブタジェン・アクリル酸共
重合体、カルホキシル基含有イソプレン、メタクリル酸
共重合体、カルボキシル基含有ポリイソグレン、カルボ
キシル基含有ブタジェン・スチレン・アクリル酸共重合
体、カルボキシル基含有ブタジェン・イソグチレ／ ア
クリル酸共重合体等を挙げることができる○
カルボキシル基含有ジエン系ゴム質ポリマーとしては、
カルボキシル基が分子末端に位１ｄするものが好１し、
く使用される。As carboxyl group-containing diene rubbery polymers,
Molecular weight 1000-100,000, preferably 100
0.~10,000, particularly preferably 1500~5.0
00, - It is preferable to use one having a molecular weight of 1.4 to 10 carboxyl groups, preferably 1.6 to 2.4.
As carboxyl group-containing diene rubbery polymers,
Carboxyl group-containing getadiene/acrylonitrile copolymer, carboxyl group-containing polybutadiene, carboxyl group-containing getadiene/acrylonitrile/acrylic acid copolymer, carboxyl group-containing butadiene/acrylic acid copolymer, carboxyl group-containing isoprene, methacrylic acid copolymer, Carboxyl group-containing polyisogrene, carboxyl group-containing butadiene/styrene/acrylic acid copolymer, carboxyl group-containing butadiene/isobutyrene/acrylic acid copolymer, etc. ○ As the carboxyl group-containing diene-based rubbery polymer,
It is preferable that the carboxyl group is located at the 1d position at the end of the molecule,
often used.
本発明にも・いてカルボキシル基含有ジエン系コ゛ム質
ポリマーとして、特に好適なものは、末端カルボキシル
基含有ブタジェン、アクリロニトリル共爪合体、末端カ
ルボキシル基含有ポリブタジーンでおる。Particularly suitable carboxyl group-containing diene polymers according to the present invention include butadiene containing terminal carboxyl groups, co-acrylonitrile polymers, and polybutadiene containing terminal carboxyl groups.
市販品の例としては、米国グツドリッチ社製、閤情名ノ
・イカ−〇ＴＢＮの一連のシリーズのものを挙げること
ができる。As an example of a commercially available product, there may be mentioned a series of products manufactured by Gutdrich Co., Ltd. in the United States and sold under the name "Kinjo-no-Ika-0TBN".
本発明において、１分子当りのカルボキシルの数が平均
的に１．６〜２、４ケの末端カルボキシル基含有ポリブ
タジェン・アクリロニトリル重合体を用いる場合には、
そのアクリ・トニトリル含有量が３０菫ψチ以下（通常
下限値は５重量％）のものが有用である。In the present invention, when using a polybutadiene-acrylonitrile polymer containing terminal carboxyl groups having an average number of carboxyl groups of 1.6 to 2 or 4 per molecule,
Those having an acrylic tonitrile content of 30 psi or less (usually the lower limit is 5% by weight) are useful.
本発明に赴いて、エポキシ樹脂組成物を製造するには前
記エポキシ樹脂、硬化剤、ゴム質ポリマーおよび好丑し
くけ硬化促進剤を均一に配合混線（ ｉｕｉ常は熱混練
）して得られろが、この組成物にはさらに無定形ソリ力
、結晶性シリカ、タルク、炭酸カルシウムのような無機
質充填剤、酸化アンチモン、ハロゲン化物のようｆｘ．
難燃剤、ソラ／カッグリ／ダ剤、離型剤、顔料、染料の
如き各匈添加剤を添加してもよい。In order to produce the epoxy resin composition according to the present invention, the epoxy resin, curing agent, rubbery polymer, and preferred hardening accelerator are uniformly blended and kneaded (usually by hot kneading). However, this composition may also contain amorphous warp, inorganic fillers such as crystalline silica, talc, calcium carbonate, fx.
Various additives such as flame retardants, solar/black/white agents, mold release agents, pigments, and dyes may be added.
本発明においては前記の如きエポキシ樹脂組成物を得る
に際して、ビスフェノールＡ型エボキヅ樹脂とカルボキ
シル基含有ジエン系ゴム質ポリマーを予め反応させてゴ
ム変性エポキシ樹脂としてので好ましい。In the present invention, when obtaining the above-mentioned epoxy resin composition, it is preferred that a bisphenol A type epoxy resin and a carboxyl group-containing diene rubbery polymer be reacted in advance to obtain a rubber-modified epoxy resin.
前記エポキシ樹脂とゴム質ポリマーの反応は、エポキシ
基にカルボキシル基を付加させて、ゴム変性エポキシ樹
脂を製造するのが目的であり、通常ｉｏｏ〜１８０℃で
３０分〜２０時間、好ましくは１２０〜１６０℃で４０
分〜１０時間程度行なう。The purpose of the reaction between the epoxy resin and the rubbery polymer is to add a carboxyl group to the epoxy group to produce a rubber-modified epoxy resin, and the reaction is usually at IOO to 180°C for 30 minutes to 20 hours, preferably 120 to 180°C. 40 at 160℃
Do this for about 10 minutes to 10 hours.
また得られるゴム変性エポキシ樹脂のカルボキシル基残
存率は、通常５０％以下、好ましくは２０チ以下とされ
る。ここでいうカルボキシル基残存率は、反応初期の系
に加えたゴム質ポリマー全体のカルボキシル基の数を１
００％として、反応後どれだけの割合のカルボキシル基
が残存しているかを示すものである。なお、得られたゴ
ム変性エポキシ樹脂とその他の残余成分は、常温混合あ
るいは熱混合して均一系のエポキシ樹脂組成物とされ本
発明において、エポキシ樹脂組成物により半導体素子を
モールドするには、該組成物が固形のきに（はトランス
ファー成形により、該組成物が液状のときには注型によ
り行なうことができる。Further, the carboxyl group residual rate of the rubber-modified epoxy resin obtained is usually 50% or less, preferably 20% or less. The carboxyl group residual rate here refers to the number of carboxyl groups in the entire rubbery polymer added to the system at the initial stage of the reaction.
00% indicates the proportion of carboxyl groups remaining after the reaction. The obtained rubber-modified epoxy resin and other remaining components are mixed at room temperature or heated to form a homogeneous epoxy resin composition.In the present invention, in order to mold a semiconductor element with the epoxy resin composition, When the composition is solid, it can be formed by transfer molding, and when the composition is liquid, it can be formed by casting.
このようにして得られた封止体は、エポキシ樹脂硬体は
遺品で、素子に加わる収縮応力が低くなっておシ、耐衝
撃性が向上し高湿下での素子寿命が長くなる。In the thus obtained sealed body, the epoxy resin hard body is a relic, and the shrinkage stress applied to the element is reduced, the impact resistance is improved, and the element life under high humidity is extended.
以下本発明を実施ｉ９Ｉｌ１７こより具体的に説明する
。The present invention will be explained in more detail below.
なお実施例中の部は重量部である。Note that parts in the examples are parts by weight.
実施例１
量１４５ ） ３０部およびカルボキシル基含有アクリ
ロニトリル−ブタジェン共重合体（分子ｉ３４．ｏＯ、
アクリルニトリル含有！１０ｋＨｔ％， −分子中に
含有するカルボキシル基の平均個数１．９）２０部配合
し，１３０℃〜１４０℃で１時間予備反応させて、この
ものを（１）液とした。Example 1 Amount 145) 30 parts and carboxyl group-containing acrylonitrile-butadiene copolymer (molecule i34.oO,
Contains acrylonitrile! 10 kHt%, - average number of carboxyl groups contained in the molecule: 1.9) 20 parts were mixed and pre-reacted at 130°C to 140°C for 1 hour to obtain liquid (1).
一方無水メチルへキサヒドロ７メルＨ １ ０ ０ 部
および２−メチル−４−エチルイミダゾール０．４部を
５０°Ｃで３０分間混合し、〔口〕液を得た０上記（１
）液：〔■〕液の比を１２０ ： １００（重猜比）で
混合してエポキシ樹脂組成物とした。On the other hand, 100 parts of anhydrous methyl hexahydro 7 mer H and 0.4 parts of 2-methyl-4-ethylimidazole were mixed at 50°C for 30 minutes to obtain a liquid.
) liquid: [■] liquid were mixed at a ratio of 120:100 (heavy water ratio) to prepare an epoxy resin composition.
実施例２〜４分よび比較例１〜４
実施例１に準じ下記第１表に示す配合でエボギシ樹脂組
成物を製造した。Examples 2 to 4 and Comparative Examples 1 to 4 Evogishi resin compositions were manufactured according to Example 1 with the formulations shown in Table 1 below.
上記第１表において、ゴム質ポリマー（１）は、実施例
１で用いたのと同じカルボキシル基含有アクリロニトリ
ループタジヱン共東合体であり、ゴム質ポリマー（２）
は、分子量３４００ 、 アクリロニトリル含有！１
．８重葉％、 −分子中に含有するカルボキシル基の
平均個数１．９のカルボキシル基含有アクリロニトリル
−ブタジェン共重合体であるＯＪ：記実流物１〜４およ
び比較例１〜４より得られたエポキシ樹脂組成物を、所
定の金型に充填して１２０”Ｃ，１時間とそれに引き続
＜１５０’Ｃ，６時間の条件でカロ熱硬化させて硬化物
をイ４た。In Table 1 above, the rubbery polymer (1) is the same carboxyl group-containing acrylonitriloptadiene Kyodogopolymer used in Example 1, and the rubbery polymer (2)
Has a molecular weight of 3400 and contains acrylonitrile! 1
．． OJ, which is a carboxyl group-containing acrylonitrile-butadiene copolymer with an average number of carboxyl groups in the molecule of 8%, - 1.9: Obtained from documentary streams 1 to 4 and comparative examples 1 to 4. The epoxy resin composition was filled into a predetermined mold and cured at 120'C for 1 hour and then at <150'C for 6 hours to obtain a cured product.
その緒特性を下記第２表に示す。Its initial characteristics are shown in Table 2 below.
第２表Table 2
Claims (1)
ポキシ樹脂（Ａ）、酸無水物系硬化剤ＦＢ＋および力素
子又は受光素子をモールドしてなる発光素子又は受光素
子封止体。 ＋２１！：、ｔ’キシｍ 脂ｔＡ＋中に占めるビスフェ
ノール型Ａ型エポキシ樹脂のｉが５０〜１００重喰襲で
ある特許請求の範囲第１項記載の発光素子又は受光素子
封止体。 （３）カルボキシル基含有ジエン系ゴム質ポリマーが末
端カルボキシル基含有ブタジェン・アクリロニトリル共
重合体および／″！、たけ末端カルボキシル基含仔ボリ
プタジェ／である特許請求の範囲第１項又は第２項記載
の半導体装置。[Scope of Claims] (A light-emitting device or a light-receiving device sealed body formed by molding an epoxy resin (A) containing 11-bisphenol A type epoxy resin, an acid anhydride curing agent FB+, and a force element or a light-receiving device) +21!:, t'oxym The light-emitting device or light-receiving device sealed body according to claim 1, wherein i of the bisphenol type A-type epoxy resin in the fat tA+ is 50 to 100. 3) The semiconductor according to claim 1 or 2, wherein the carboxyl group-containing diene-based rubbery polymer is a butadiene-acrylonitrile copolymer containing a terminal carboxyl group and a voluptaje containing a terminal carboxyl group. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58054945A JPS59178781A (en) | 1983-03-29 | 1983-03-29 | Light emitting element or light receiving sealed body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58054945A JPS59178781A (en) | 1983-03-29 | 1983-03-29 | Light emitting element or light receiving sealed body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59178781A true JPS59178781A (en) | 1984-10-11 |
Family
ID=12984786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58054945A Pending JPS59178781A (en) | 1983-03-29 | 1983-03-29 | Light emitting element or light receiving sealed body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59178781A (en) |
-
1983
- 1983-03-29 JP JP58054945A patent/JPS59178781A/en active Pending
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