JPS59177394A - 電極体 - Google Patents
電極体Info
- Publication number
- JPS59177394A JPS59177394A JP5106783A JP5106783A JPS59177394A JP S59177394 A JPS59177394 A JP S59177394A JP 5106783 A JP5106783 A JP 5106783A JP 5106783 A JP5106783 A JP 5106783A JP S59177394 A JPS59177394 A JP S59177394A
- Authority
- JP
- Japan
- Prior art keywords
- electrode body
- palladium
- plated
- plating
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5106783A JPS59177394A (ja) | 1983-03-26 | 1983-03-26 | 電極体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5106783A JPS59177394A (ja) | 1983-03-26 | 1983-03-26 | 電極体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59177394A true JPS59177394A (ja) | 1984-10-08 |
JPH0352553B2 JPH0352553B2 (enrdf_load_stackoverflow) | 1991-08-12 |
Family
ID=12876452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5106783A Granted JPS59177394A (ja) | 1983-03-26 | 1983-03-26 | 電極体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59177394A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02232400A (ja) * | 1989-03-07 | 1990-09-14 | Fujitsu Ltd | 電解処理装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101632892B1 (ko) * | 2015-04-09 | 2016-06-23 | 주식회사 포스코 | 습식 공정용 냉각 탱크의 토출 배관 막힘 방지 장치 |
-
1983
- 1983-03-26 JP JP5106783A patent/JPS59177394A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02232400A (ja) * | 1989-03-07 | 1990-09-14 | Fujitsu Ltd | 電解処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0352553B2 (enrdf_load_stackoverflow) | 1991-08-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5620581A (en) | Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring | |
US2211584A (en) | Coaxial electrical conductor | |
MY131896A (en) | Solid electrolytic capacitor and process for making the same | |
US2221596A (en) | Method of manufacturing dry rectifiers | |
US2848391A (en) | Method of making a multiple lamination construction | |
JPS59123789A (ja) | 陽極酸化膜を有するアルミニウム被処理体をめつきのために処理する方法 | |
US3753665A (en) | Magnetic film plated wire | |
JPS59177394A (ja) | 電極体 | |
US1529249A (en) | Method of and apparatus for electrodeposition and the product thereof | |
US2973571A (en) | Current conductor | |
US2822302A (en) | Non-emissive electrode | |
JPH07157893A (ja) | 電気接点用Snめっき線とその製造方法 | |
JPS6486527A (en) | Ccb tape carrier | |
GB980468A (en) | Improvements in and relating to electrical circuit elements | |
JP3346535B2 (ja) | めっきアルミニウム電線、絶縁めっきアルミニウム電線およびこれらの製造方法 | |
GB997898A (en) | Production of magnetic tape | |
US2758962A (en) | Method of electroplating and apparatus therefor | |
US1562164A (en) | Process of coating electrodes | |
US1784674A (en) | Film formation and operation of electrolytic condensers and other apparatus | |
JPS57145969A (en) | Chemical plating method | |
JP3074414B2 (ja) | 金属薄膜の製造方法 | |
GB1005719A (en) | Improvements in or relating to electro-plating | |
GB1395425A (en) | Electrode for anodic stripping voltammetry | |
JPS6141792A (ja) | シリンダ−輪転銅めつきの均一電着方法 | |
JPS56158424A (en) | Electrolytic copper plating for compound semiconductor |