JPS59175149A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS59175149A
JPS59175149A JP58050054A JP5005483A JPS59175149A JP S59175149 A JPS59175149 A JP S59175149A JP 58050054 A JP58050054 A JP 58050054A JP 5005483 A JP5005483 A JP 5005483A JP S59175149 A JPS59175149 A JP S59175149A
Authority
JP
Japan
Prior art keywords
pellet
wire
wires
supporting body
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58050054A
Other languages
Japanese (ja)
Inventor
Shinji Mitsui
三井　真司
Tomio Okamoto
岡本　富美夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP58050054A priority Critical patent/JPS59175149A/en
Publication of JPS59175149A publication Critical patent/JPS59175149A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85203—Thermocompression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H01L2224/85207—Thermosonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent the cutting caused by the short circuit and friction between a wire and a pellet and the wire fall by a sealed resin by a method wherein a supporting body is formed in the peripheral edge of a pellet of the possibility that bonding wires contact besides pellet electrodes. CONSTITUTION:The supporting body 5 is screen-printed to the peripheral edge of the pellet 1 in wafer state. By considering the cutting spaces on timing, supporting body forming regions are printed at all the parts of the possibility that the wires 2 contact at least the surface end of the pellet 1. Besides, at the top of the supporting body 5, the recesses 6 for supporting these wires are provided at positions for the extension of these wires 2. The recess 6 after printing and hardening is formed to a height whereby the wire can be sufficiently held and does not contact the surface end of the pellet 1.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体装置に係り、ボンディング用ワイヤー
とペレット間のショートおよびワイヤーとペレット表面
端の摩擦によるワイヤーの断線、また、樹脂封止による
ワイヤーのなぎ倒し全防止することのできる半導体装置
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to semiconductor devices, and is used to prevent short circuits between bonding wires and pellets, wire breakage due to friction between the wire and pellet surface edges, and wire breakage due to resin sealing. The present invention relates to a semiconductor device that can be completely prevented from being knocked down.

従来例の構成とその問題点 ペレットの電極とリード内端とをワイヤーで接続した半
導体装置では、ペレット周縁に設けられた電極に直径３
ｏμｍ前後の金あるいはアルミニウムのワイヤーの一端
を熱圧着あるいは超音波熱２　、、、 圧着し、そののち、ワイヤーにループを描かせてリード
内端にワイヤーの他端を熱圧着あるいは超音波熱圧着し
て接続させる。Conventional configuration and its problems In a semiconductor device in which the electrode of the pellet and the inner end of the lead are connected with a wire, the electrode provided on the periphery of the pellet has a diameter of 3 mm.
One end of a gold or aluminum wire of around 0 μm is thermocompression bonded or ultrasonic heat crimped, and then the wire is made to draw a loop and the other end of the wire is thermocompression bonded or ultrasonic thermocompression bonded to the inner end of the lead. and connect.

かかる構造におめでは、ペレット電極とリード内端の距
離が長かったＶ、ペレット電極がペレット周縁よりかな
り内側にある場合、ワイヤー長さが長くなり、その結果
、外力もしくは衝撃によってチップ表面端にワイヤーが
接触し、ショートあるいは摩擦によってワイヤーが断線
する恐れがあり、また、樹脂封止型半導体装置において
は、封止の際に、樹脂によるワイヤーのなぎ例しがあっ
た。In such a structure, if the distance between the pellet electrode and the inner end of the lead is long, and if the pellet electrode is located far inside the pellet periphery, the wire length will be long, and as a result, external force or impact may cause the chip surface edge to There is a risk that the wires may come into contact and break due to short-circuiting or friction, and in resin-sealed semiconductor devices, the wires may be glued with the resin during sealing.

発明の目的 本発明は、土述のような従来装置の問題点を解消し、ワ
イヤーとペレットの間のショートおよびワイヤーとペレ
ットの表面端の摩擦によるワイヤーの断線、また樹脂封
止の際の樹脂によるワイヤーのなぎ倒し全防止する構造
を有する半導体装置を提供するものである。Purpose of the Invention The present invention solves the problems of conventional devices, such as short circuit between the wire and the pellet, wire breakage due to friction between the wire and the surface edge of the pellet, and resin sealing during resin sealing. The present invention provides a semiconductor device having a structure that completely prevents wires from being knocked down by wires.

発明の構成 ３、、。Composition of the invention 3.

本発明は、ボンティング用ワイヤーがペレット電極以外
に接触する恐れのあるペレット周縁部に支持体全形成し
た装置であり、これによれば、ワイヤーとペンット間の
ショートおよびワイヤーとペレットの間の摩擦によるワ
イヤーの断線、捷た樹脂封止の際の樹脂によるワイヤー
のなぎ例しが防止できる。The present invention is a device in which a support is entirely formed on the periphery of the pellet where the bonding wire may come into contact with anything other than the pellet electrode. It is possible to prevent the wire from breaking due to the resin sealing, and the wire from being damaged by the resin when sealing with the resin.

実施例の説明 図は１本発明の一実施例である、図中、１はペレット、
２はワイヤー、３はリード内端部、４はマウント部、５
は支持体である。支持体５け、ウェハー状態でペレット
１の周縁部にスクリーン印シ 刷される。支持体形成領域は、ダイ＋ング時の切りしろ
全考慮して、少なくともペレット１の表面（端にワイヤ
ー２が接触する可能性のある箇所すべてに印刷される必
要力にある。また、支持体５の頂部にはワイヤー２がわ
たる位置に同ワイヤー支持用四部６を設ける。印刷硬化
後の四部６ば、ワイヤー全充分に保持でき、ペレット１
の表面端にワイヤーが接触しない高さでなければならな
い。The explanatory diagram of the embodiment is one embodiment of the present invention. In the diagram, 1 indicates pellets,
2 is the wire, 3 is the inner end of the lead, 4 is the mount part, 5
is the support. Five supports are screen printed on the peripheral edge of the pellet 1 in wafer form. The support formation area is determined by the necessary force to print at least on the surface of the pellet 1 (all the places where the wire 2 may come into contact with the edge), taking into account the entire cutting allowance during die-cutting. Four parts 6 for supporting the wire are provided on the top of the wire 2 at the position where the wire 2 spans.The four parts 6 after printing and curing can sufficiently hold the entire wire, and the pellet 1
The height shall be such that the wire does not touch the surface edge of the wire.

実施例では、支持体６の頂部の高さは１００μｍ四部６
は５０μｍになるようにした。寸た、この高さの最適値
は、ボンディグパノドの位置７ワイヤー径、ペレット表
面端からリード内端部までの距離などによって変化する
ことは言う丑でもない。In the example, the height of the top of the support 6 is 100 μm square 6
was set to 50 μm. Needless to say, the optimum value of this height varies depending on the bonding panod position 7 wire diameter, the distance from the pellet surface end to the inner end of the lead, etc.

支持体５の材料としては、ペレット表面との接着性がよ
く、ペレットを汚染する不純物を含まず、常温では硬化
せず、溶剤によって適度の粘度に調整することができ、
１００℃から４００℃程度の加熱処理によ−て数分から
数時間の間に十分硬化して安定となり、硬化後の絶縁性
が充分にあり、かつ耐熱性では、少なくとも２００℃以
上で長時間安定であり、しかもペレット表面近傍の電気
的特性に影響を与えないものが適当である。The material for the support 5 has good adhesion to the pellet surface, does not contain impurities that contaminate the pellet, does not harden at room temperature, and can be adjusted to an appropriate viscosity with a solvent.
It is sufficiently cured and stable within several minutes to several hours by heat treatment at temperatures between 100°C and 400°C, has sufficient insulation properties after curing, and is heat resistant and stable for long periods of time at temperatures above 200°C. A suitable material is one that does not affect the electrical characteristics near the pellet surface.

本実施例では、これらの条件を満足したポリイミド樹脂
を用すたが、これ以外にも、エポキシ系樹脂、フェノー
ル系樹脂、ポリカーボネート系樹脂、ポリアミド系樹脂
−ポリベンツィミダゾール系樹脂、あるいはこれらの二
種以上を組み合わせた樹脂など本発明の目的を達し得る
性質を備えた５　ページ 樹脂が好ましい。In this example, a polyimide resin satisfying these conditions was used, but in addition to this, epoxy resin, phenol resin, polycarbonate resin, polyamide resin-polybenzimidazole resin, or any of these resins may also be used. A 5-page resin having properties that can achieve the object of the present invention, such as a resin that is a combination of two or more types, is preferred.

発明の効果 以上述べたように一本発明によればペレット周縁に設け
られた支持体により、ワイヤーとペレットＮ面端の接触
によるショートおよびワイヤーとペレット表面端の摩擦
によるワイヤーの断線、また、樹脂封止の場合、樹脂に
よるワイヤーのなぎ例しが防止できる構造が得られ、高
信頼度の半導体装置が得られる。Effects of the Invention As described above, according to the present invention, the support provided around the pellet periphery prevents short circuits due to contact between the wire and the N-face edge of the pellet, wire breakage due to friction between the wire and the pellet surface edge, and the resin In the case of sealing, a structure can be obtained in which the resin can prevent wires from being undone, and a highly reliable semiconductor device can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の一実施例に係る半導体装置の要部斜視図で
ある。 １・・・・・・ペレット、２・・・・・・ワイヤー、３
・・・・・・リード内端部＋４・・・・・・ペレットマ
ウント、５・・・・・・支持体、６・・・・四部。 代理人の氏名　弁理士　中　尾　敏　男　ほか１名。The figure is a perspective view of essential parts of a semiconductor device according to an embodiment of the present invention. 1... Pellet, 2... Wire, 3
...Lead inner end +4 ... Pellet mount, 5 ... Support body, 6 ... Four parts. Name of agent: Patent attorney Toshio Nakao and one other person.

Claims (1)

【特許請求の範囲】[Claims] 半導体素子入面の少な（とも一部に、ボンディング用ワ
イヤーを支持し、かつ同ワイヤー径以上の四部を持つ支
持体を設けたことを特徴とする半導体装置。A semiconductor device having a small surface area into which the semiconductor element enters (a support body having four parts supporting a bonding wire and having a diameter equal to or larger than that of the wire is provided in both parts).
JP58050054A 1983-03-24 1983-03-24 Semiconductor device Pending JPS59175149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58050054A JPS59175149A (en) 1983-03-24 1983-03-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58050054A JPS59175149A (en) 1983-03-24 1983-03-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS59175149A true JPS59175149A (en) 1984-10-03

Family

ID=12848279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58050054A Pending JPS59175149A (en) 1983-03-24 1983-03-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS59175149A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0758487A4 (en) * 1994-05-03 1998-09-16 Douglas W Phelps Jr Tape application platform and processes therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0758487A4 (en) * 1994-05-03 1998-09-16 Douglas W Phelps Jr Tape application platform and processes therefor

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