JPS59107553A - Wire bonding process of semiconductor device - Google Patents

Wire bonding process of semiconductor device

Info

Publication number
JPS59107553A
JPS59107553A JP57217965A JP21796582A JPS59107553A JP S59107553 A JPS59107553 A JP S59107553A JP 57217965 A JP57217965 A JP 57217965A JP 21796582 A JP21796582 A JP 21796582A JP S59107553 A JPS59107553 A JP S59107553A
Authority
JP
Japan
Prior art keywords
frame
island
wire bonding
semiconductor device
bonding process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57217965A
Other languages
Japanese (ja)
Inventor
Koichi Takegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57217965A priority Critical patent/JPS59107553A/en
Publication of JPS59107553A publication Critical patent/JPS59107553A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
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    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
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    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
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    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/73265—Layer and wire connectors
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83009—Pre-treatment of the layer connector or the bonding area
    • H01L2224/83051—Forming additional members, e.g. dam structures
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    • H01L2924/01—Chemical elements
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Abstract

PURPOSE:To cope with the increase of leads by a method wherein an insulator frame adheres to external periphery of the island for semiconductor element while a lead frame provided with a groove between frame and element is utilized. CONSTITUTION:A semiconductor pellet 1 is soldered 3 on an island 2 and the solder is prevented from flowing out by a groove 10. Next an insulator frame 9 adheres to the island 2 by soldering process. In such a constitution, wire is elongated in stabilized wire loop made supported by the frame 9, thereby wire bonding with high reliability may be assured coping with the increase of leads.
JP57217965A 1982-12-13 1982-12-13 Wire bonding process of semiconductor device Pending JPS59107553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57217965A JPS59107553A (en) 1982-12-13 1982-12-13 Wire bonding process of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57217965A JPS59107553A (en) 1982-12-13 1982-12-13 Wire bonding process of semiconductor device

Publications (1)

Publication Number Publication Date
JPS59107553A true JPS59107553A (en) 1984-06-21

Family

ID=16712500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57217965A Pending JPS59107553A (en) 1982-12-13 1982-12-13 Wire bonding process of semiconductor device

Country Status (1)

Country Link
JP (1) JPS59107553A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376756A (en) * 1991-12-20 1994-12-27 Vlsi Technology, Inc. Wire support and guide
JP6986796B1 (en) * 2021-06-04 2021-12-22 ハイソル株式会社 Coil structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376756A (en) * 1991-12-20 1994-12-27 Vlsi Technology, Inc. Wire support and guide
US5430250A (en) * 1991-12-20 1995-07-04 Vlsi Technology, Inc. Wire support and guide
JP6986796B1 (en) * 2021-06-04 2021-12-22 ハイソル株式会社 Coil structure
JP2022186186A (en) * 2021-06-04 2022-12-15 ハイソル株式会社 Coil structure body

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