JPS60167454A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS60167454A
JPS60167454A JP2164184A JP2164184A JPS60167454A JP S60167454 A JPS60167454 A JP S60167454A JP 2164184 A JP2164184 A JP 2164184A JP 2164184 A JP2164184 A JP 2164184A JP S60167454 A JPS60167454 A JP S60167454A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
leads
tab
lead wirings
lead
formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2164184A
Inventor
Ichiro Anjo
Shunji Koike
Keizo Matsukawa
Kazumasa Yanagisawa
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49503Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE:To unnecessitate the wiring design of leads by omission of tabs by providing leads supporting an insulating plate and capable of connection to bonding wires. CONSTITUTION:The insulating plate 7 indicated by an imaginary line is fixed with adhesive on lead wirings 6 extended from tips of leads 5. A semiconductor chip 8 is mounted thereon, and its electrode is electrically connected to the lead wirings 6 by means of a connector wire 10, which are then resin-sealed. Such a lead frame where a tab and tab-hanging leads have been omitted and the lead wirings 6 have been provided is formed by successively punching a ribbonlike metallic plate made of e.g. Fe-Ni-Co alloy or the like by press, and is formed not by fabricating a tab, but by patterning the lead wirings 6.
JP2164184A 1984-02-10 1984-02-10 Semiconductor device Granted JPS60167454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2164184A JPS60167454A (en) 1984-02-10 1984-02-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2164184A JPS60167454A (en) 1984-02-10 1984-02-10 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS60167454A true true JPS60167454A (en) 1985-08-30

Family

ID=12060686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2164184A Granted JPS60167454A (en) 1984-02-10 1984-02-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS60167454A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110034U (en) * 1987-01-09 1988-07-15
JPS63222453A (en) * 1987-03-11 1988-09-16 Mitsui Haitetsuku:Kk Semiconductor device
JPS63222454A (en) * 1987-03-11 1988-09-16 Mitsui Haitetsuku:Kk Semiconductor device and manufacture thereof
JPS63249342A (en) * 1987-04-06 1988-10-17 Shinko Electric Ind Co Ltd Semiconductor device
JPS63249340A (en) * 1987-04-06 1988-10-17 Shinko Electric Ind Co Ltd Semiconductor device
JPS63254758A (en) * 1987-04-13 1988-10-21 Shinko Electric Ind Co Ltd Semiconductor device
JPS63254759A (en) * 1987-04-13 1988-10-21 Shinko Electric Ind Co Ltd Semiconductor device
JPH02106060A (en) * 1988-10-14 1990-04-18 Hitachi Cable Ltd Lead frame for semiconductor device
JPH02148758A (en) * 1988-11-29 1990-06-07 Matsushita Electron Corp Lead frame for semiconductor device
US4934820A (en) * 1987-10-20 1990-06-19 Hitachi, Ltd. Semiconductor device
US4989068A (en) * 1988-02-12 1991-01-29 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US5358904A (en) * 1988-09-20 1994-10-25 Hitachi, Ltd. Semiconductor device
US5365113A (en) * 1987-06-30 1994-11-15 Hitachi, Ltd. Semiconductor device
US5863817A (en) * 1988-09-20 1999-01-26 Hitachi, Ltd. Semiconductor device

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110034U (en) * 1987-01-09 1988-07-15
JPS63222453A (en) * 1987-03-11 1988-09-16 Mitsui Haitetsuku:Kk Semiconductor device
JPS63222454A (en) * 1987-03-11 1988-09-16 Mitsui Haitetsuku:Kk Semiconductor device and manufacture thereof
JPS63249342A (en) * 1987-04-06 1988-10-17 Shinko Electric Ind Co Ltd Semiconductor device
JPS63249340A (en) * 1987-04-06 1988-10-17 Shinko Electric Ind Co Ltd Semiconductor device
JPS63254759A (en) * 1987-04-13 1988-10-21 Shinko Electric Ind Co Ltd Semiconductor device
JPS63254758A (en) * 1987-04-13 1988-10-21 Shinko Electric Ind Co Ltd Semiconductor device
US5365113A (en) * 1987-06-30 1994-11-15 Hitachi, Ltd. Semiconductor device
US5742101A (en) * 1987-06-30 1998-04-21 Hitachi, Ltd. Semiconductor device
US5514905A (en) * 1987-06-30 1996-05-07 Hitachi, Ltd. Semiconductor device
US4934820A (en) * 1987-10-20 1990-06-19 Hitachi, Ltd. Semiconductor device
US4989068A (en) * 1988-02-12 1991-01-29 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US6130114A (en) * 1988-03-20 2000-10-10 Hitachi, Ltd. Semiconductor device
US6081023A (en) * 1988-03-20 2000-06-27 Hitachi, Ltd. Semiconductor device
US6072231A (en) * 1988-03-20 2000-06-06 Hitachi, Ltd. Semiconductor device
US6069029A (en) * 1988-09-20 2000-05-30 Hitachi, Ltd. Semiconductor device chip on lead and lead on chip manufacturing
US5914530A (en) * 1988-09-20 1999-06-22 Hitachi, Ltd. Semiconductor device
US6018191A (en) * 1988-09-20 2000-01-25 Hitachi, Ltd. Semiconductor device
US5863817A (en) * 1988-09-20 1999-01-26 Hitachi, Ltd. Semiconductor device
US6531760B1 (en) 1988-09-20 2003-03-11 Gen Murakami Semiconductor device
US6720208B2 (en) 1988-09-20 2004-04-13 Renesas Technology Corporation Semiconductor device
US6100115A (en) * 1988-09-20 2000-08-08 Hitachi, Ltd. Semiconductor device
US5358904A (en) * 1988-09-20 1994-10-25 Hitachi, Ltd. Semiconductor device
US6303982B2 (en) 1988-09-20 2001-10-16 Hitachi, Ltd. Semiconductor device
US6919622B2 (en) 1988-09-20 2005-07-19 Renesas Technology Corp. Semiconductor device
JPH02106060A (en) * 1988-10-14 1990-04-18 Hitachi Cable Ltd Lead frame for semiconductor device
JPH02148758A (en) * 1988-11-29 1990-06-07 Matsushita Electron Corp Lead frame for semiconductor device

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