JPS59172753A - コネクタダイオ−ド - Google Patents

コネクタダイオ−ド

Info

Publication number
JPS59172753A
JPS59172753A JP4728983A JP4728983A JPS59172753A JP S59172753 A JPS59172753 A JP S59172753A JP 4728983 A JP4728983 A JP 4728983A JP 4728983 A JP4728983 A JP 4728983A JP S59172753 A JPS59172753 A JP S59172753A
Authority
JP
Japan
Prior art keywords
diode
case
connector
lead
locking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4728983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0427705B2 (enExample
Inventor
Tsutomu Nasu
那須　勉
Seiichi Hirai
平井　成一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP4728983A priority Critical patent/JPS59172753A/ja
Publication of JPS59172753A publication Critical patent/JPS59172753A/ja
Publication of JPH0427705B2 publication Critical patent/JPH0427705B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP4728983A 1983-03-23 1983-03-23 コネクタダイオ−ド Granted JPS59172753A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4728983A JPS59172753A (ja) 1983-03-23 1983-03-23 コネクタダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4728983A JPS59172753A (ja) 1983-03-23 1983-03-23 コネクタダイオ−ド

Publications (2)

Publication Number Publication Date
JPS59172753A true JPS59172753A (ja) 1984-09-29
JPH0427705B2 JPH0427705B2 (enExample) 1992-05-12

Family

ID=12771125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4728983A Granted JPS59172753A (ja) 1983-03-23 1983-03-23 コネクタダイオ−ド

Country Status (1)

Country Link
JP (1) JPS59172753A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288667A (en) * 1990-08-23 1994-02-22 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a molded semiconductor package having a lead frame and an connecting coupler
JP2001326113A (ja) * 2000-05-15 2001-11-22 Oizumi Seisakusho:Kk 電子部品実装用リードフレームおよび電子部品
JP2010251504A (ja) * 2009-04-15 2010-11-04 Seiko Instruments Inc 電子部品パッケージ及び電子部品パッケージの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288667A (en) * 1990-08-23 1994-02-22 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a molded semiconductor package having a lead frame and an connecting coupler
JP2001326113A (ja) * 2000-05-15 2001-11-22 Oizumi Seisakusho:Kk 電子部品実装用リードフレームおよび電子部品
JP2010251504A (ja) * 2009-04-15 2010-11-04 Seiko Instruments Inc 電子部品パッケージ及び電子部品パッケージの製造方法

Also Published As

Publication number Publication date
JPH0427705B2 (enExample) 1992-05-12

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