JPS59172753A - コネクタダイオ−ド - Google Patents
コネクタダイオ−ドInfo
- Publication number
- JPS59172753A JPS59172753A JP4728983A JP4728983A JPS59172753A JP S59172753 A JPS59172753 A JP S59172753A JP 4728983 A JP4728983 A JP 4728983A JP 4728983 A JP4728983 A JP 4728983A JP S59172753 A JPS59172753 A JP S59172753A
- Authority
- JP
- Japan
- Prior art keywords
- diode
- case
- connector
- lead
- locking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4728983A JPS59172753A (ja) | 1983-03-23 | 1983-03-23 | コネクタダイオ−ド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4728983A JPS59172753A (ja) | 1983-03-23 | 1983-03-23 | コネクタダイオ−ド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59172753A true JPS59172753A (ja) | 1984-09-29 |
JPH0427705B2 JPH0427705B2 (enrdf_load_stackoverflow) | 1992-05-12 |
Family
ID=12771125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4728983A Granted JPS59172753A (ja) | 1983-03-23 | 1983-03-23 | コネクタダイオ−ド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59172753A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5288667A (en) * | 1990-08-23 | 1994-02-22 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a molded semiconductor package having a lead frame and an connecting coupler |
JP2001326113A (ja) * | 2000-05-15 | 2001-11-22 | Oizumi Seisakusho:Kk | 電子部品実装用リードフレームおよび電子部品 |
JP2010251504A (ja) * | 2009-04-15 | 2010-11-04 | Seiko Instruments Inc | 電子部品パッケージ及び電子部品パッケージの製造方法 |
-
1983
- 1983-03-23 JP JP4728983A patent/JPS59172753A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5288667A (en) * | 1990-08-23 | 1994-02-22 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a molded semiconductor package having a lead frame and an connecting coupler |
JP2001326113A (ja) * | 2000-05-15 | 2001-11-22 | Oizumi Seisakusho:Kk | 電子部品実装用リードフレームおよび電子部品 |
JP2010251504A (ja) * | 2009-04-15 | 2010-11-04 | Seiko Instruments Inc | 電子部品パッケージ及び電子部品パッケージの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0427705B2 (enrdf_load_stackoverflow) | 1992-05-12 |
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