JPS59153893A - 銀被覆導体とその製造方法 - Google Patents

銀被覆導体とその製造方法

Info

Publication number
JPS59153893A
JPS59153893A JP2608883A JP2608883A JPS59153893A JP S59153893 A JPS59153893 A JP S59153893A JP 2608883 A JP2608883 A JP 2608883A JP 2608883 A JP2608883 A JP 2608883A JP S59153893 A JPS59153893 A JP S59153893A
Authority
JP
Japan
Prior art keywords
alloy
plating
thickness
layer
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2608883A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6150160B2 (enrdf_load_stackoverflow
Inventor
Shoji Shiga
志賀　章二
Hitoshi Kato
加藤　人士
Toshio Kitamoto
俊生 北本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2608883A priority Critical patent/JPS59153893A/ja
Publication of JPS59153893A publication Critical patent/JPS59153893A/ja
Publication of JPS6150160B2 publication Critical patent/JPS6150160B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP2608883A 1983-02-18 1983-02-18 銀被覆導体とその製造方法 Granted JPS59153893A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2608883A JPS59153893A (ja) 1983-02-18 1983-02-18 銀被覆導体とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2608883A JPS59153893A (ja) 1983-02-18 1983-02-18 銀被覆導体とその製造方法

Publications (2)

Publication Number Publication Date
JPS59153893A true JPS59153893A (ja) 1984-09-01
JPS6150160B2 JPS6150160B2 (enrdf_load_stackoverflow) 1986-11-01

Family

ID=12183851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2608883A Granted JPS59153893A (ja) 1983-02-18 1983-02-18 銀被覆導体とその製造方法

Country Status (1)

Country Link
JP (1) JPS59153893A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346825A (en) * 1987-10-07 1994-09-13 Hitachi, Ltd. Method for improving the rate of cell fusion
EP4134458A4 (en) * 2021-06-25 2024-04-10 Nippon Micrometal Corporation Bonding wire for semiconductor device
EP4174202A4 (en) * 2021-06-25 2024-05-29 Nippon Micrometal Corporation CONNECTION WIRE FOR SEMICONDUCTOR DEVICE

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346825A (en) * 1987-10-07 1994-09-13 Hitachi, Ltd. Method for improving the rate of cell fusion
EP4134458A4 (en) * 2021-06-25 2024-04-10 Nippon Micrometal Corporation Bonding wire for semiconductor device
EP4174202A4 (en) * 2021-06-25 2024-05-29 Nippon Micrometal Corporation CONNECTION WIRE FOR SEMICONDUCTOR DEVICE

Also Published As

Publication number Publication date
JPS6150160B2 (enrdf_load_stackoverflow) 1986-11-01

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