JPS59146947U - semiconductor integrated device - Google Patents

semiconductor integrated device

Info

Publication number
JPS59146947U
JPS59146947U JP4060483U JP4060483U JPS59146947U JP S59146947 U JPS59146947 U JP S59146947U JP 4060483 U JP4060483 U JP 4060483U JP 4060483 U JP4060483 U JP 4060483U JP S59146947 U JPS59146947 U JP S59146947U
Authority
JP
Japan
Prior art keywords
semiconductor integrated
integrated device
cross
under
buried layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4060483U
Other languages
Japanese (ja)
Inventor
三上　靖夫
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP4060483U priority Critical patent/JPS59146947U/en
Publication of JPS59146947U publication Critical patent/JPS59146947U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来方法によるレイアウト図、第２図、第３図
は本考案の一実施例のレイアウト図、第４図は第３図の
回路図である。 １・・・ポンディングパッド、２・・・Ａ１配線、３・
・・分離層中心、４，５・・・ｎ十埋込層コンタクト、
６・・・Ｐ層コンタクト、７・・・外部インタフェース
端子、８・・・配線、９・・・ダイオード。FIG. 1 is a layout diagram of a conventional method, FIGS. 2 and 3 are layout diagrams of an embodiment of the present invention, and FIG. 4 is a circuit diagram of FIG. 3. 1...Ponding pad, 2...A1 wiring, 3.
...separation layer center, 4,5...n ten buried layer contacts,
6... P layer contact, 7... External interface terminal, 8... Wiring, 9... Diode.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 誘電体分離プロセスにおいて、ポンディングパッドを構
成する分離島中の埋込層をクロスアンダ用導体に用いる
ことにより、クロスアンダ用領域を減少させることを特
徴とする半導体集積装置。A semiconductor integrated device characterized in that, in a dielectric isolation process, a buried layer in an isolation island constituting a bonding pad is used as a cross-under conductor to reduce a cross-under area.
JP4060483U 1983-03-23 1983-03-23 semiconductor integrated device Pending JPS59146947U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4060483U JPS59146947U (en) 1983-03-23 1983-03-23 semiconductor integrated device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4060483U JPS59146947U (en) 1983-03-23 1983-03-23 semiconductor integrated device

Publications (1)

Publication Number Publication Date
JPS59146947U true JPS59146947U (en) 1984-10-01

Family

ID=30171220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4060483U Pending JPS59146947U (en) 1983-03-23 1983-03-23 semiconductor integrated device

Country Status (1)

Country Link
JP (1) JPS59146947U (en)

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