JPS59145083U - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS59145083U
JPS59145083U JP1983039187U JP3918783U JPS59145083U JP S59145083 U JPS59145083 U JP S59145083U JP 1983039187 U JP1983039187 U JP 1983039187U JP 3918783 U JP3918783 U JP 3918783U JP S59145083 U JPS59145083 U JP S59145083U
Authority
JP
Japan
Prior art keywords
integrated circuit
heat sink
conductive path
hybrid integrated
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983039187U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0351992Y2 (enrdf_load_stackoverflow
Inventor
風見　明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1983039187U priority Critical patent/JPS59145083U/ja
Publication of JPS59145083U publication Critical patent/JPS59145083U/ja
Application granted granted Critical
Publication of JPH0351992Y2 publication Critical patent/JPH0351992Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP1983039187U 1983-03-17 1983-03-17 混成集積回路 Granted JPS59145083U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983039187U JPS59145083U (ja) 1983-03-17 1983-03-17 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983039187U JPS59145083U (ja) 1983-03-17 1983-03-17 混成集積回路

Publications (2)

Publication Number Publication Date
JPS59145083U true JPS59145083U (ja) 1984-09-28
JPH0351992Y2 JPH0351992Y2 (enrdf_load_stackoverflow) 1991-11-08

Family

ID=30169839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983039187U Granted JPS59145083U (ja) 1983-03-17 1983-03-17 混成集積回路

Country Status (1)

Country Link
JP (1) JPS59145083U (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140754U (enrdf_load_stackoverflow) * 1974-09-20 1976-03-26
JPS56157086A (en) * 1980-05-09 1981-12-04 Tokyo Shibaura Electric Co Hybrid integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140754U (enrdf_load_stackoverflow) * 1974-09-20 1976-03-26
JPS56157086A (en) * 1980-05-09 1981-12-04 Tokyo Shibaura Electric Co Hybrid integrated circuit

Also Published As

Publication number Publication date
JPH0351992Y2 (enrdf_load_stackoverflow) 1991-11-08

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