JPS5914356U - 半導体受光チツプ - Google Patents

半導体受光チツプ

Info

Publication number
JPS5914356U
JPS5914356U JP10955982U JP10955982U JPS5914356U JP S5914356 U JPS5914356 U JP S5914356U JP 10955982 U JP10955982 U JP 10955982U JP 10955982 U JP10955982 U JP 10955982U JP S5914356 U JPS5914356 U JP S5914356U
Authority
JP
Japan
Prior art keywords
semiconductor photodetector
photodetector chip
light
main surface
receiving area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10955982U
Other languages
English (en)
Inventor
西村　芳徳
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP10955982U priority Critical patent/JPS5914356U/ja
Publication of JPS5914356U publication Critical patent/JPS5914356U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図Ａ、　Ｂは従来例を示し、第１図Ａは平面図、同
図Ｂは第１図ＡのＡ−Ａ’線断面図、第２図は本考案の
一実施例を示し、第２図Ａは平面図、同図Ｂは上記第２
図ＡのＢ−Ｂ’線断面図である。 ４・・・受光領域、５・・・ポンディングパッド。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一生面の中央に受光領域を有した平面四角形の半導体受
    光チップにおいて、ホンディングパッドは上記受光領域
    外の上記主面の４隅に設けられていることを特徴とする
    半導体受光チップ。
JP10955982U 1982-07-19 1982-07-19 半導体受光チツプ Pending JPS5914356U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10955982U JPS5914356U (ja) 1982-07-19 1982-07-19 半導体受光チツプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10955982U JPS5914356U (ja) 1982-07-19 1982-07-19 半導体受光チツプ

Publications (1)

Publication Number Publication Date
JPS5914356U true JPS5914356U (ja) 1984-01-28

Family

ID=30255160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10955982U Pending JPS5914356U (ja) 1982-07-19 1982-07-19 半導体受光チツプ

Country Status (1)

Country Link
JP (1) JPS5914356U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6137787U (ja) * 1984-08-10 1986-03-08 株式会社 オカベ のり巻きおにぎりの製造具
JPH07311084A (ja) * 1994-05-20 1995-11-28 Nippondenso Co Ltd 日射センサ装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6137787U (ja) * 1984-08-10 1986-03-08 株式会社 オカベ のり巻きおにぎりの製造具
JPS643353Y2 (ja) * 1984-08-10 1989-01-27
JPH07311084A (ja) * 1994-05-20 1995-11-28 Nippondenso Co Ltd 日射センサ装置

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