JPS585346U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS585346U
JPS585346U JP9809581U JP9809581U JPS585346U JP S585346 U JPS585346 U JP S585346U JP 9809581 U JP9809581 U JP 9809581U JP 9809581 U JP9809581 U JP 9809581U JP S585346 U JPS585346 U JP S585346U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor
dividing surface
semiconductor device
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9809581U
Other languages
English (en)
Inventor
三郎 木村
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP9809581U priority Critical patent/JPS585346U/ja
Publication of JPS585346U publication Critical patent/JPS585346U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
１．　　第１図は半導体装置の一例を示す平面図、第２
図は第１図Ａ−Ａ断面図、第３図は本考案による一半導
体装置の一例を示す部分透視平面図、第５図は本考案に
よる半導体装置に用いる半導体ペレットの平面図、第６
図は第５図Ｂ−Ｂ断面図を示す。 ６・・・・・・半導体ペレット、９・・・・・・微小凹
部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 分割面と隣接する少くとも一方の主面に分割面に沿う微
    小凹部を形成した半導体ペレットを具備したことを特徴
    とする半導体装置。
JP9809581U 1981-06-30 1981-06-30 半導体装置 Pending JPS585346U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9809581U JPS585346U (ja) 1981-06-30 1981-06-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9809581U JPS585346U (ja) 1981-06-30 1981-06-30 半導体装置

Publications (1)

Publication Number Publication Date
JPS585346U true JPS585346U (ja) 1983-01-13

Family

ID=29892864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9809581U Pending JPS585346U (ja) 1981-06-30 1981-06-30 半導体装置

Country Status (1)

Country Link
JP (1) JPS585346U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065144U (ja) * 1992-06-23 1994-01-21 八重洲無線株式会社 プラグ・ジャックコネクタの防水構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065144U (ja) * 1992-06-23 1994-01-21 八重洲無線株式会社 プラグ・ジャックコネクタの防水構造

Similar Documents

Publication Publication Date Title
JPS585346U (ja) 半導体装置
JPS5888239U (ja) 半導体装置用マスク
JPS58180643U (ja) 半導体装置のパツケ−ジ
JPS5849843U (ja) スイツチ操作装置
JPS6071146U (ja) 半導体装置
JPS6038796U (ja) 平行線定規
JPS594570U (ja) 重ね地図
JPS5885347U (ja) チツプトレイ
JPS591178U (ja) カセツトハ−フ
JPS5812938U (ja) 半導体ウエ−ハ
JPS58155026U (ja) 計算器の置数キ−
JPS5932495U (ja) フロ−テイング定規
JPS59104178U (ja) 表示装置
JPS58191641U (ja) 半導体装置
JPS6094834U (ja) 半導体装置
JPS58150849U (ja) 半導体装置
JPS58166064U (ja) 触針ランド
JPS60145888U (ja) せつけん箱
JPS6094832U (ja) 半導体素子
JPS60101755U (ja) 半導体装置
JPS59158181U (ja) 表示装置
JPS602834U (ja) 位置決め機構
JPS6113940U (ja) 半導体装置
JPS5887354U (ja) チツプキヤリア
JPS5996828U (ja) ウエハジヤケツト