JPS59138236U - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS59138236U
JPS59138236U JP1983033581U JP3358183U JPS59138236U JP S59138236 U JPS59138236 U JP S59138236U JP 1983033581 U JP1983033581 U JP 1983033581U JP 3358183 U JP3358183 U JP 3358183U JP S59138236 U JPS59138236 U JP S59138236U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
cap
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983033581U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0236280Y2 (fr
Inventor
正行 片岡
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP1983033581U priority Critical patent/JPS59138236U/ja
Publication of JPS59138236U publication Critical patent/JPS59138236U/ja
Application granted granted Critical
Publication of JPH0236280Y2 publication Critical patent/JPH0236280Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1983033581U 1983-03-07 1983-03-07 混成集積回路装置 Granted JPS59138236U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983033581U JPS59138236U (ja) 1983-03-07 1983-03-07 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983033581U JPS59138236U (ja) 1983-03-07 1983-03-07 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS59138236U true JPS59138236U (ja) 1984-09-14
JPH0236280Y2 JPH0236280Y2 (fr) 1990-10-03

Family

ID=30164364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983033581U Granted JPS59138236U (ja) 1983-03-07 1983-03-07 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS59138236U (fr)

Also Published As

Publication number Publication date
JPH0236280Y2 (fr) 1990-10-03

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