JPS59136954A - 熱伝導性電気絶縁シ−ト - Google Patents

熱伝導性電気絶縁シ−ト

Info

Publication number
JPS59136954A
JPS59136954A JP58010763A JP1076383A JPS59136954A JP S59136954 A JPS59136954 A JP S59136954A JP 58010763 A JP58010763 A JP 58010763A JP 1076383 A JP1076383 A JP 1076383A JP S59136954 A JPS59136954 A JP S59136954A
Authority
JP
Japan
Prior art keywords
silicone rubber
filler
molecule
glass cloth
polymerization type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58010763A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6367335B2 (enExample
Inventor
Ryoichi Ito
伊東　亮一
Yukio Shimazaki
島崎　行雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP58010763A priority Critical patent/JPS59136954A/ja
Publication of JPS59136954A publication Critical patent/JPS59136954A/ja
Publication of JPS6367335B2 publication Critical patent/JPS6367335B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58010763A 1983-01-25 1983-01-25 熱伝導性電気絶縁シ−ト Granted JPS59136954A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58010763A JPS59136954A (ja) 1983-01-25 1983-01-25 熱伝導性電気絶縁シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58010763A JPS59136954A (ja) 1983-01-25 1983-01-25 熱伝導性電気絶縁シ−ト

Publications (2)

Publication Number Publication Date
JPS59136954A true JPS59136954A (ja) 1984-08-06
JPS6367335B2 JPS6367335B2 (enExample) 1988-12-26

Family

ID=11759367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58010763A Granted JPS59136954A (ja) 1983-01-25 1983-01-25 熱伝導性電気絶縁シ−ト

Country Status (1)

Country Link
JP (1) JPS59136954A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6083853A (en) * 1996-11-06 2000-07-04 Fuji Polymer Industries Co., Ltd. Formed sheet of thermoconductive silicone gel and method for producing the same
JP2007273478A (ja) * 1994-09-13 2007-10-18 W L Gore & Assoc Inc 電気導体の保護のためのジャケット材料
WO2012002505A1 (ja) * 2010-07-02 2012-01-05 昭和電工株式会社 セラミックス混合物、及びそれを用いたセラミックス含有熱伝導性樹脂シート
JP7082724B1 (ja) * 2021-02-15 2022-06-08 富士高分子工業株式会社 熱伝導性シリコーン組成物
WO2022172547A1 (ja) * 2021-02-15 2022-08-18 富士高分子工業株式会社 熱伝導性シリコーン組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57163548A (en) * 1981-04-02 1982-10-07 Denki Kagaku Kogyo Kk Manufacture of heat radiating sheet
JPS5847341A (ja) * 1981-09-16 1983-03-19 Nippon Telegr & Teleph Corp <Ntt> 移動通信方式

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57163548A (en) * 1981-04-02 1982-10-07 Denki Kagaku Kogyo Kk Manufacture of heat radiating sheet
JPS5847341A (ja) * 1981-09-16 1983-03-19 Nippon Telegr & Teleph Corp <Ntt> 移動通信方式

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273478A (ja) * 1994-09-13 2007-10-18 W L Gore & Assoc Inc 電気導体の保護のためのジャケット材料
US6083853A (en) * 1996-11-06 2000-07-04 Fuji Polymer Industries Co., Ltd. Formed sheet of thermoconductive silicone gel and method for producing the same
US6140258A (en) * 1996-11-06 2000-10-31 Fuji Polymer Industries Co., Ltd. Formed sheet of thermalconductive silicone gel and method for producing the same
US6660203B1 (en) 1996-11-06 2003-12-09 Fuji Polymer Industries Co., Ltd Formed sheet of thermalconductive silicone gel and method for producing the same
WO2012002505A1 (ja) * 2010-07-02 2012-01-05 昭和電工株式会社 セラミックス混合物、及びそれを用いたセラミックス含有熱伝導性樹脂シート
JP7082724B1 (ja) * 2021-02-15 2022-06-08 富士高分子工業株式会社 熱伝導性シリコーン組成物
WO2022172547A1 (ja) * 2021-02-15 2022-08-18 富士高分子工業株式会社 熱伝導性シリコーン組成物

Also Published As

Publication number Publication date
JPS6367335B2 (enExample) 1988-12-26

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