JPS59136321A - 光半導体封止用エポキシ樹脂組成物 - Google Patents
光半導体封止用エポキシ樹脂組成物Info
- Publication number
- JPS59136321A JPS59136321A JP58011718A JP1171883A JPS59136321A JP S59136321 A JPS59136321 A JP S59136321A JP 58011718 A JP58011718 A JP 58011718A JP 1171883 A JP1171883 A JP 1171883A JP S59136321 A JPS59136321 A JP S59136321A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- curing
- formate
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Light Receiving Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58011718A JPS59136321A (ja) | 1983-01-26 | 1983-01-26 | 光半導体封止用エポキシ樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58011718A JPS59136321A (ja) | 1983-01-26 | 1983-01-26 | 光半導体封止用エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59136321A true JPS59136321A (ja) | 1984-08-04 |
JPS6225686B2 JPS6225686B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-06-04 |
Family
ID=11785817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58011718A Granted JPS59136321A (ja) | 1983-01-26 | 1983-01-26 | 光半導体封止用エポキシ樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59136321A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6086175A (ja) * | 1983-10-19 | 1985-05-15 | Sumitomo Deyurezu Kk | エポキシ樹脂粉体塗料組成物 |
JPS61200118A (ja) * | 1985-03-01 | 1986-09-04 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物 |
US6495270B1 (en) | 1998-02-19 | 2002-12-17 | Hitachi Chemical Company, Ltd. | Compounds, hardening accelerator, resin composition, and electronic part device |
WO2005092980A1 (ja) * | 2004-03-25 | 2005-10-06 | Matsushita Electric Works Ltd. | 光半導体素子封止用エポキシ樹脂組成物、及び光半導体装置 |
US7781543B2 (en) | 2002-09-05 | 2010-08-24 | Daicel Chemical Industries, Ltd. | Curable alicyclic diepoxy resin composition |
US7786224B2 (en) * | 2001-03-23 | 2010-08-31 | Daicel Chemical Industries, Ltd | Liquid composition of alicyclic diepoxide, curing agent and/or curing accelerator |
-
1983
- 1983-01-26 JP JP58011718A patent/JPS59136321A/ja active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6086175A (ja) * | 1983-10-19 | 1985-05-15 | Sumitomo Deyurezu Kk | エポキシ樹脂粉体塗料組成物 |
JPS61200118A (ja) * | 1985-03-01 | 1986-09-04 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物 |
US6495270B1 (en) | 1998-02-19 | 2002-12-17 | Hitachi Chemical Company, Ltd. | Compounds, hardening accelerator, resin composition, and electronic part device |
US7786224B2 (en) * | 2001-03-23 | 2010-08-31 | Daicel Chemical Industries, Ltd | Liquid composition of alicyclic diepoxide, curing agent and/or curing accelerator |
US7781543B2 (en) | 2002-09-05 | 2010-08-24 | Daicel Chemical Industries, Ltd. | Curable alicyclic diepoxy resin composition |
WO2005092980A1 (ja) * | 2004-03-25 | 2005-10-06 | Matsushita Electric Works Ltd. | 光半導体素子封止用エポキシ樹脂組成物、及び光半導体装置 |
JPWO2005092980A1 (ja) * | 2004-03-25 | 2008-02-14 | 松下電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物、及び光半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6225686B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-06-04 |
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