JPS59130435A - 超音波ワイヤボンダ用ウエツジ - Google Patents
超音波ワイヤボンダ用ウエツジInfo
- Publication number
- JPS59130435A JPS59130435A JP58172942A JP17294283A JPS59130435A JP S59130435 A JPS59130435 A JP S59130435A JP 58172942 A JP58172942 A JP 58172942A JP 17294283 A JP17294283 A JP 17294283A JP S59130435 A JPS59130435 A JP S59130435A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wedge
- guide hole
- tip
- ultrasonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/07168—
-
- H10W72/07502—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58172942A JPS59130435A (ja) | 1983-09-21 | 1983-09-21 | 超音波ワイヤボンダ用ウエツジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58172942A JPS59130435A (ja) | 1983-09-21 | 1983-09-21 | 超音波ワイヤボンダ用ウエツジ |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51121925A Division JPS6020894B2 (ja) | 1976-10-13 | 1976-10-13 | 超音波ワイヤボンダ用ウエツジ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11400185A Division JPS6127647A (ja) | 1985-05-29 | 1985-05-29 | 超音波ワイヤボンデイング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59130435A true JPS59130435A (ja) | 1984-07-27 |
| JPS6135698B2 JPS6135698B2 (cg-RX-API-DMAC10.html) | 1986-08-14 |
Family
ID=15951204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58172942A Granted JPS59130435A (ja) | 1983-09-21 | 1983-09-21 | 超音波ワイヤボンダ用ウエツジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59130435A (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5485949A (en) * | 1993-04-30 | 1996-01-23 | Matsushita Electric Industrial Co., Ltd. | Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03162899A (ja) * | 1989-11-22 | 1991-07-12 | Naomoto Kogyo Kk | ラペル成型プレス装置 |
-
1983
- 1983-09-21 JP JP58172942A patent/JPS59130435A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5485949A (en) * | 1993-04-30 | 1996-01-23 | Matsushita Electric Industrial Co., Ltd. | Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6135698B2 (cg-RX-API-DMAC10.html) | 1986-08-14 |
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