JPS59126653A - 電子部品素子の封止方法およびその封止構造 - Google Patents

電子部品素子の封止方法およびその封止構造

Info

Publication number
JPS59126653A
JPS59126653A JP159383A JP159383A JPS59126653A JP S59126653 A JPS59126653 A JP S59126653A JP 159383 A JP159383 A JP 159383A JP 159383 A JP159383 A JP 159383A JP S59126653 A JPS59126653 A JP S59126653A
Authority
JP
Japan
Prior art keywords
terminal
frame
electronic component
supporting
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP159383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6348429B2 (enrdf_load_stackoverflow
Inventor
Takashi Yamamoto
隆 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP159383A priority Critical patent/JPS59126653A/ja
Publication of JPS59126653A publication Critical patent/JPS59126653A/ja
Publication of JPS6348429B2 publication Critical patent/JPS6348429B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP159383A 1983-01-07 1983-01-07 電子部品素子の封止方法およびその封止構造 Granted JPS59126653A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP159383A JPS59126653A (ja) 1983-01-07 1983-01-07 電子部品素子の封止方法およびその封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP159383A JPS59126653A (ja) 1983-01-07 1983-01-07 電子部品素子の封止方法およびその封止構造

Publications (2)

Publication Number Publication Date
JPS59126653A true JPS59126653A (ja) 1984-07-21
JPS6348429B2 JPS6348429B2 (enrdf_load_stackoverflow) 1988-09-29

Family

ID=11505803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP159383A Granted JPS59126653A (ja) 1983-01-07 1983-01-07 電子部品素子の封止方法およびその封止構造

Country Status (1)

Country Link
JP (1) JPS59126653A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6150413A (ja) * 1984-08-20 1986-03-12 Nippon Dempa Kogyo Co Ltd 圧電振動子の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6150413A (ja) * 1984-08-20 1986-03-12 Nippon Dempa Kogyo Co Ltd 圧電振動子の製造方法

Also Published As

Publication number Publication date
JPS6348429B2 (enrdf_load_stackoverflow) 1988-09-29

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