JPS59125606A - 高耐熱絶縁被覆を有する電気鉄芯及びその製造方法 - Google Patents
高耐熱絶縁被覆を有する電気鉄芯及びその製造方法Info
- Publication number
- JPS59125606A JPS59125606A JP48083A JP48083A JPS59125606A JP S59125606 A JPS59125606 A JP S59125606A JP 48083 A JP48083 A JP 48083A JP 48083 A JP48083 A JP 48083A JP S59125606 A JPS59125606 A JP S59125606A
- Authority
- JP
- Japan
- Prior art keywords
- iron core
- epoxy resin
- melting point
- powder
- powder composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 56
- 239000011248 coating agent Substances 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000843 powder Substances 0.000 claims abstract description 143
- 239000000203 mixture Substances 0.000 claims abstract description 103
- 239000003822 epoxy resin Substances 0.000 claims abstract description 65
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 65
- 238000002844 melting Methods 0.000 claims abstract description 63
- 230000008018 melting Effects 0.000 claims abstract description 58
- 239000011521 glass Substances 0.000 claims abstract description 33
- 239000011256 inorganic filler Substances 0.000 claims abstract description 21
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 21
- 239000004593 Epoxy Substances 0.000 claims abstract description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 8
- 125000000524 functional group Chemical group 0.000 claims abstract description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 97
- 238000000034 method Methods 0.000 claims description 54
- 239000002245 particle Substances 0.000 claims description 41
- 238000010438 heat treatment Methods 0.000 claims description 30
- 239000007921 spray Substances 0.000 claims description 28
- 238000007598 dipping method Methods 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000011247 coating layer Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000009413 insulation Methods 0.000 abstract description 42
- 238000004804 winding Methods 0.000 abstract description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 18
- 239000000126 substance Substances 0.000 abstract description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 10
- 239000000377 silicon dioxide Substances 0.000 abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052710 silicon Inorganic materials 0.000 abstract description 5
- 229920006015 heat resistant resin Polymers 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 62
- 238000001723 curing Methods 0.000 description 17
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 11
- 238000002156 mixing Methods 0.000 description 11
- 238000007654 immersion Methods 0.000 description 8
- 230000003068 static effect Effects 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 239000012530 fluid Substances 0.000 description 6
- 239000011362 coarse particle Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 239000001023 inorganic pigment Substances 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000002841 Lewis acid Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- -1 polyenylene oxide Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- NIDNOXCRFUCAKQ-UMRXKNAASA-N (1s,2r,3s,4r)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1[C@H]2C=C[C@@H]1[C@H](C(=O)O)[C@@H]2C(O)=O NIDNOXCRFUCAKQ-UMRXKNAASA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- HULOKVFODSEDTE-UHFFFAOYSA-N 2,2-diphenylethane-1,1,1,2-tetrol Chemical compound C=1C=CC=CC=1C(O)(C(O)(O)O)C1=CC=CC=C1 HULOKVFODSEDTE-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 241000725101 Clea Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 241000123069 Ocyurus chrysurus Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007590 electrostatic spraying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229920000550 glycopolymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007937 lozenge Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical group [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/16—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets
- H01F1/18—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets with insulating coating
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Soft Magnetic Materials (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48083A JPS59125606A (ja) | 1983-01-07 | 1983-01-07 | 高耐熱絶縁被覆を有する電気鉄芯及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48083A JPS59125606A (ja) | 1983-01-07 | 1983-01-07 | 高耐熱絶縁被覆を有する電気鉄芯及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59125606A true JPS59125606A (ja) | 1984-07-20 |
| JPS6334611B2 JPS6334611B2 (cs) | 1988-07-11 |
Family
ID=11474931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48083A Granted JPS59125606A (ja) | 1983-01-07 | 1983-01-07 | 高耐熱絶縁被覆を有する電気鉄芯及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59125606A (cs) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10257727A (ja) * | 1997-03-13 | 1998-09-25 | Sankyo Seiki Mfg Co Ltd | 粉体塗装方法、および電機子コアの製造方法 |
| JP2001237135A (ja) * | 1999-12-14 | 2001-08-31 | Murata Mfg Co Ltd | ガラス膜の形成方法およびその装置、金属膜の形成方法およびその装置、ならびに電子部品の製造方法 |
| JP2002249543A (ja) * | 2001-02-26 | 2002-09-06 | Sumitomo Bakelite Co Ltd | 一液型エポキシ樹脂組成物 |
| JP2002284846A (ja) * | 2001-03-23 | 2002-10-03 | Sumitomo Bakelite Co Ltd | 一液型エポキシ樹脂組成物 |
| WO2007004483A1 (ja) * | 2005-07-01 | 2007-01-11 | Shinji Kudo | 積層コイルの製造方法及び積層コイル |
| JP2018107410A (ja) * | 2016-12-28 | 2018-07-05 | 日立金属株式会社 | 樹脂被膜付き磁心の製造方法および樹脂被膜付き磁心 |
| JP2021005734A (ja) * | 2020-10-12 | 2021-01-14 | 日立金属株式会社 | 樹脂被膜付き磁心 |
| JP2022137266A (ja) * | 2020-10-12 | 2022-09-21 | 日立金属株式会社 | 樹脂被膜付き磁心の製造方法 |
-
1983
- 1983-01-07 JP JP48083A patent/JPS59125606A/ja active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10257727A (ja) * | 1997-03-13 | 1998-09-25 | Sankyo Seiki Mfg Co Ltd | 粉体塗装方法、および電機子コアの製造方法 |
| JP2001237135A (ja) * | 1999-12-14 | 2001-08-31 | Murata Mfg Co Ltd | ガラス膜の形成方法およびその装置、金属膜の形成方法およびその装置、ならびに電子部品の製造方法 |
| JP2002249543A (ja) * | 2001-02-26 | 2002-09-06 | Sumitomo Bakelite Co Ltd | 一液型エポキシ樹脂組成物 |
| JP2002284846A (ja) * | 2001-03-23 | 2002-10-03 | Sumitomo Bakelite Co Ltd | 一液型エポキシ樹脂組成物 |
| WO2007004483A1 (ja) * | 2005-07-01 | 2007-01-11 | Shinji Kudo | 積層コイルの製造方法及び積層コイル |
| JP2018107410A (ja) * | 2016-12-28 | 2018-07-05 | 日立金属株式会社 | 樹脂被膜付き磁心の製造方法および樹脂被膜付き磁心 |
| JP2021005734A (ja) * | 2020-10-12 | 2021-01-14 | 日立金属株式会社 | 樹脂被膜付き磁心 |
| JP2022137266A (ja) * | 2020-10-12 | 2022-09-21 | 日立金属株式会社 | 樹脂被膜付き磁心の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6334611B2 (cs) | 1988-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6524229B2 (ja) | 耐部分放電用電気絶縁樹脂組成物 | |
| JPH0143407B2 (cs) | ||
| JPWO2002084676A1 (ja) | 磁気コアおよび磁気コア用接着性樹脂組成物 | |
| TW201240032A (en) | Semiconductor device and method for producing the same | |
| KR101640559B1 (ko) | 코일매립형인덕터의 상온하몰딩제조를 위한 자성분말페이스트의 제조방법 및 자성분말페이스트 | |
| JPS59125606A (ja) | 高耐熱絶縁被覆を有する電気鉄芯及びその製造方法 | |
| CN111004507B (zh) | 一种交联型聚醚酰亚胺基介电复合薄膜的制备方法和用途 | |
| CN106205935A (zh) | 一种非晶态软磁复合磁粉芯及其制备方法 | |
| US20130037305A1 (en) | Electrical conductor coated in a bonding layer, and a method of manufacturing such an electrical conductor | |
| JPS6230215B2 (cs) | ||
| CN113871113A (zh) | 一种涂层非线性电导盆式绝缘子成型方法 | |
| JP2021193094A (ja) | イミド基含有化合物、イミド基含有硬化剤ならびにエポキシ樹脂硬化物およびそれを用いた電気絶縁性材料 | |
| JP7318422B2 (ja) | 樹脂組成物および成形品 | |
| CN105504811B (zh) | 一种长效抗静电聚酰亚胺薄膜 | |
| JPS6260425B2 (cs) | ||
| JPS626594B2 (cs) | ||
| JP2013203764A (ja) | エポキシ樹脂粉体塗料及びこれを用いて塗装された物品 | |
| JP5832402B2 (ja) | 絶縁膜、固定子コイル及びガス絶縁開閉装置 | |
| JPS59127308A (ja) | 高耐熱絶縁被覆を有する電気巻線体及びその製造方法 | |
| CN102360663B (zh) | 一种复合软磁材料及其制备方法 | |
| JP2015514384A (ja) | 高電圧回転機械のための電気絶縁体及び電気絶縁体を製造するための方法 | |
| JP4005183B2 (ja) | 粉体塗料及び該粉体塗料を使用する皮膜形成方法 | |
| EP1458812A1 (en) | Powdered epoxy composition | |
| JP5221051B2 (ja) | 一液型エポキシ樹脂組成物、該組成物を用いた絶縁コイルおよび硬化繊維構造体の製造方法 | |
| JPS59189173A (ja) | 耐熱性電気絶縁塗料組成物 |